• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.364-366
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• 1997

An experimental helical resonator plasma system that can be applied to the next generation semiconductor processing was fabricated and its characteristics was investigated. Helical resonator plasma can operate both in a capacitive and an inductive mode. Such sources will produce an extended plasma for the capacitive mode and a plasma concentrated in the resonator for the inductive mode. Plasma parameters were measured with Double Langmuir Probes. Plasma densities of $10^{11}{\sim}10^{12}cm^{-3}$ were produced in argon for pressure in the $2{\sim}120\;mTorr$ range. From the results, we conclude that helical resonator plasma can be applied to the next generation semiconductor processing.

• Journal of the Korean Vacuum Society
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• v.8 no.2
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• pp.172-179
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• 1999

The axial distributions of plasma density in a helical resonator plasma with the external magnetic field have been measured using Langmuir probes. Net RF power is set to 200W and chamber pressure is varied from 0.4 mTorr to 100mTorr there are three kinds of eternal magnetic field structure applied on the helical resonator plasma. One is a uniform magnetic field, the second is a positive gradient magnetic field and the third is a negative gradient magnetic field. In the three magnetic field structures, the negative gradient magnetic field is found to show the highest increase in plasma density on the substrate compared with other magnetic structures. Plasma density profile in helical resonator is well consistent with electromagnetic field pattern obtained by computer simulation. It is also found that axial magnetic fields do not affect plasma density distribution in the plasma reactor region, but induce the increase of plasma density in the process chamber region. In order to avoid the nonuniformity of radial density profile, weak magnetic fields under 100G are applied.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.309-314
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• 1999

The magnetized helical resonator plasma etcher has been built. Electron density and temperature were measured as functions of rf source power, axial magnetic field, and pressure. The results show electron density increases as the magnetic field increases and reached $2\times1012cm^{-3}$,/TEX>. The oxide etch rate and selectivity to polysilicon were investigated as the above mentioned conditions and self-bias voltage. We can obtain the much improved oxide etch selectivity to polysilicon (60 : 1) by applying the external axial weak magnetic field in magnetized helical resonator plasma etcher.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.282-285
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• 2000

Four helical resonators are distributed in a 2 ${\times}$ 2 array by modifying upper part of the conventional reactive ion etching(RIE) type LCD etcher in order to prepare a large area plasma source. Since the resonance condition of the RF signal to the helical antenna, one RF power supply is used for delivering the power efficiently to all four helical resonators without an impedance matching network Previous work of 2 ${\times}$ 2array inductively coupled plasma(ICP)requires one matching circuit to each ICP antenna for more efficient power deliverly Distributions of ion density and electron temperature are measured in terms of chamber pressure, gas flow rate and RF power . By adjusting the power distribution among the four helical resonator units, argon plasma density of higher than 10$\^$17/㎥ with the uniformity of better than 7％ can be obtained in the 620 ${\times}$ 620$\textrm{mm}^2$ chamber.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.49-49
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• 1996

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.376-378
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• 1997

Plasma density and its axial distribution and uniformity on the substrate in a helical resonator plasma in the external magnetic field have been measured using Langmuir probes. Net RF power is set to 200W and chamber pressure is varied from $1{\times}10^{-1}Torr$ to $1{\times}10^{-4}Torr$. There are three kinds of external magnetic field structure applied on the helical resonator plasma. One is a uniform magnetic field, another is a plus gradient magnetic field and the third is a minus gradient magnetic field. Of the three magnetic field structure, the minus gradient magnetic field is found to show the highest increase in plasma density on the substrate compared with other magnetic structures. In order to avoid radial density ununiformity, weak magnetic fields under 100Gauss are applied.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.4
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• pp.261-266
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• 1998

In developing the high density memory device, the etching of fine pattern is becoming increasingly important. Therefore, definition of ultra fine line and space pattern and minimization of damage and contamination are essential process. Also, the high density plasma in low operating pressure is necessary. The candidates of high density plasma sources are electron cyclotron resonance plasma, helicon wave plasma, helical resonator, and inductively coupled plasma. In this study, planar type magnetized inductively coupled plasma etcher has been built. The density and temperature of Ar plasma are measured as a function of rf power, flow rate, external magnetic field, and pressure. The oxide etch rate and selectivity to polysilicon are measured as the above mentioned conditions and self-bias voltage.

• Journal of Korean Vacuum Science & Technology
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• v.3 no.1
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• pp.24-29
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• 1999

The characteristic behaviors of CH3Br were examined first for the dry etching of polysilicon in a Cl2/CH3Br/O2 plasma. CH3Br is revealed one of the excellent additive gases to control anisotropy of etching profile and to give no undercutting for various typed of polysilicons. CH3Br acts as a passivation precursor on the side wall in etch cavity by forming polymer-like films such as CHxBry(x+y=1,2). The decrease of etch selectivity due to the reaction if the C-containing species from CH3Br with the surface O atoms of SiO2 was overcome by the addition of O2 into plasma, resulting that the selectivity increased by 2~3 times. According to the results of optical emission signals, CH3Br should be dissociated into several fragments to give more hydrogen atoms than bromine atoms in our helical resonator system.

• Journal of the Korean Vacuum Society
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• v.8 no.1
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• pp.63-69
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• 1999

The characteristic parameters of high density plasma source (Helical Resonator) have been measured with Langmuir probe to get the plasma density electron temperature, ion current density, etc. Optical emission spectra of Si and SiCl have been analyzed in $Cl_2$$/poly-Si system to elucidate etching mechanism. In this system, the main reaction to remove silicon atoms on the surface is proceeding mostly through chemical reaction, not pure physical reaction. The emission intensity of SiCl (chemical etching product) increases much faster than Si (pure physical etching product) with increasing the concentration of impurities (P). This is due to the electron transfer from substrate to the surface via Si-Cl bond. As a result, Si-Cl bond becomes more ionic and mobile, therefore the Cl-containing etchant forms $SiCl_x$ with surface more easily. Consequently, for the removal of Si atom from poly silicon surface, the chemical etching is more favorable than physical etching with increasing P concentrations.