• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2000.11c
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• pp.639-646
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• 2000

Hot air heater with light oil combustion is the most common heater for greenhouse heating in the winter season in Korea. However, since the heat efficiency of the heater is about 80%, considerable unused heat in the form of exhaust gas heat discharges to atmosphere. In order to capture this exhaust gas heat a heat recovery system for plant bed heating in the greenhouse was built and tested in the hot air heating system of greenhouse. The system consists of a heat exchanger made of copper pipes, ${\phi}\;12.7{\times}0.7t$ located inside the rectangular column of $330{\times}330{\times}900mm$, a water circulation pump, circulation plastic pipe and a water tame The total heat exchanger area is $1.5m^2$, calculated considering the heat exchange amount between flue gas and water circulated in the copper pipes. The system was attached to the exhaust gas path. The heat recovery system was designed as to even recapture the latent heat of flue gas when exposing to low temperature water in the heat exchanger. According to performance test it can recover 45,200 to 51,000kJ/hr depending on the water circulation rates of 330 to $690{\ell}$/hr from the waste heat discharged. The exhaust gas temperature left from the heat exchanger dropped to $100^{circ}C$ from $270^{circ}C$ by the heat exchange between the water and the flue gas, while water gained the difference and temperature increased to $38^{circ}C$ from $21^{circ}C$ at the water flow rate of $690{\ell}$/hr. And, the condensed water amount varies from 16 to $43m{\ell}$ at the same water circulation rates. This condensing heat recovery system can reduce boiler fuel consumption amount in a day by 34% according to the feasibility study of the actual mimitomato greenhouse. No combustion load was observed in the hot air heater.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• Journal of The Korean Society of Agricultural Engineers
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• v.57 no.5
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• pp.37-42
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• 2015

In order to provide fundamental data for the creation of environmental design criteria for horticultural facilities, we developed a method to easily calculate the seasonal heating load applying heating degree-hour while taking into account heating load reductions due to solar radiation in the daytime, and reviewed through greenhouse heating experiments. Heating experiments and measuring meteorological environments were carried out in three greenhouses located at Buyeo, Cheonan, and Buan, and we derived reduction factors of seasonal heating load according to hours of sunshine. Daily mean hours of sunshine during the experiment period in each of the greenhouse was 4.0 to 8.3 hours, and the reduction factor of seasonal heating load was 0.64 to 0.85, has been shown to decrease linearly with the increase in hours of sunshine. A method to estimate the seasonal heating load for greenhouses was developed using the reduction factor of seasonal heating load derived from the greenhouse heating experiment, including the adjustment factor of seasonal heating load according to hours of sunshine. The developed method was validated through heating experiments in a greenhouse located at Cheonan. Greenhouse seasonal heating loads calculated by the method developed in this study were analyzed to show the estimate error of 1.2 to 5.0%. It showed that the accuracy increased 2.3 times more than when using the heating load reduction factor of 0.75 applied uniformly in previous studies. Thus, the calculation method of seasonal heating load for greenhouses considering hours of sunshine developed in this study could be utilized for energy estimation, management planning, and economic evaluation in greenhouse design.

• International Journal of Highway Engineering
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• v.17 no.2
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• pp.31-37
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• 2015

PURPOSES : To design a pre-heater for warm in-place recycling equipment, three different heating systems were evaluated to determine their thermal efficiency. METHODS: In this study, a $30cm{\times}30cm{\times}15cm$ wheel-tracking specimen was used to measure the inner temperature as a function of the heating system. The inner temperature of the specimen was measured with a data logger at the surface, and at depths of 1cm, 2cm, 3cm, 4cm, and 5cm. To evaluate the thermal efficiency, the researchers used three different types of equipment, namely, IR, a heating wire, and a gas burner. RESULTS: The IR heating system exhibits a higher level of performance than the others to achieve the target temperature at a depth of 5cm in the specimen. The gas burner system was capable of heating the surface to a temperature of up to $600^{\circ}C$. The other types, however, cannot heat the surface up to 600. The thermal efficiencies were measured based on the laboratory conditions. CONCLUSIONS: To find the most effective system for application to the development of a pre-heater for warm in-place recycling, various systems (IR, heating wire, gas burner) were examined in the laboratory. As a result, it was found that the hot plate of a gas burner system provides the highest temperature at the surface of the asphalt but, of all the systems, the IR system provides the best internal temperature increase rate. Furthermore, a gas burner can age the asphalt binder of the surface layer as a result of the high temperature. However, the gas burner cannot attain the target temperature at 5cm. The IR system, on the other hand, is effective at increasing the internal temperature of asphalt.

• Journal of Welding and Joining
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• v.34 no.2
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• pp.46-53
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• 2016

Effect of heating rate on microstructure of brazed joints with STS 304 Printed Circuit Heat Exchanger (PCHE),which was manufactured as large-scale($1170(L){\times}520(W)){\times}100(T)$, mm), have been studied to compare bonding phenomenon. The specimens using MBF 20 was bonded at $1080^{\circ}C$ for 1hr with $0.38^{\circ}C/min$ and $20^{\circ}C/min$ heating rate, respectively. In case of a heating rate of $20^{\circ}C/min$, overflow of filler metal was observed at the edge of a brazed joints showing the height of filler metal was decreased from $100{\mu}m$ to $68{\mu}m$. At the center of the joints, CrB and high Ni contents of ${\gamma}$-Ni was existed. For the joints brazed at a heating rate of $0.38^{\circ}C/min$, the height of filler was decreased from $100{\mu}m$ to $86{\mu}m$ showing the overflow of filler was not appeared. At the center of the joints, only ${\gamma}$-Ni was detected gradating the Ni contents from center. This phenomenon was driven from a diffusion amount of Boron in filler metal. With a fast heating rate $20^{\circ}C/min$, diffusion amount of B was so small that liquid state of filler metal and base metal were reacted. But, for a slow heating rate $0.38^{\circ}C/min$, solid state of filler metal due to low diffusion amount of B reacted with base metal as a solid diffusion bonding.

• Applied Chemistry for Engineering
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• v.28 no.5
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• pp.513-520
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• 2017

The application possibility of an alternative new method with low energy consumption was studied for the eco-friendly fabrication of foamed glasses from waste glasses. As a result, fabricating temperature can be reduced under $300^{\circ}C$ without using various expensive inorganic oxidants. The foamed glass can be fabricated at a proper mixing ratio of the waste glass powder, water glass, little surfactant and bubble stabilizer by induction heating method. In the experimental range, the assured optimal condition is 4 min heating on the induction machine with a steel-container ($100mm{\times}100mm{\times}20mm$) and followed by evaporating and drying process for 11 min with 110 g of glass powder, 80 g of water glass, 3 g of surfactant and 0.2 g of bubble stabilizer. When the foamed glass was fabricated at the optimal condition, the density of the glass was $0.85g/cm^3$ and the heat conduction was $0.052W/h{\cdot}K$. In addition, the compressive strength of the glass was above $50kg/cm^2$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.435-442
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• 2004

This paper presents a hermetic MEMS on-chip package bonded by a closed-loop AuSn solder-line. We design three different package specimens, including a substrate heated specimen without interconnection-line (SHX), a substrate heated specimen with interconnection-line (SHI) and a locally heated specimen with interconnection-line (LHI). Pressurized helium leak test has been carried out for hermetic seal evaluation in addition to the critical pressure test for bonding strength measurement. Substrate heating method (SHX, SHI) requires the bonding time of 40min. at 400min, while local heating method (LHI) requires 4 min. at the heating power of 6.76W. In the hermetic seal test. SHX, SHI and LHI show the leak rates of 5.4$\pm$6.7${\times}$$^{-10}$ mbar-l/s, 13.5$\pm$9.8${\times}$$^{-10}$ mbar-l/s and 18.5$\pm$9.9${\times}$$^{-10}$ mbar-l/s, respectively, for an identical package chamber volume of 6.89$\pm$0.2${\times}$$^{-10}$. In the critical pressure test, no fracture is found in the bonded specimens up to the applied pressure of 1$\pm$0.1MPa, resulting in the minimum bonding strength of 3.53$\pm$0.07MPa. We find that the present on-chip packaging using a closed AuSn solder-line shows strong potential for hermetic MEMS packaging with interconnection-line due to the hermetic seal performance and the shorter bonding time for mass production.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.752-757
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• 2001

The characteristics of heat energy distribution on the fire-proof clay with microwave heating drying are numerically investigated using finite element method. The modelled regular hexahedron chamber$(50cm\times50cm\times50cm)$ filled with air consists of vertical heat source and sink walls, a fire-proof clay model, and adiabatic plates on the top and bottom walls. With different geometrical aspect ratios of the fire-proof clay model, the heat energy distribution is throughly investigated. The model gave a good prediction of the microwave heating characteristics of fire-proof clay. The optimal shape of the fire-proof clay for given chamber geometry and microwave power is analyzed.

• Food Science of Animal Resources
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• v.18 no.4
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• pp.358-363
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• 1998

The objectives of this study were to evaluate the effect of previous heating temperature and holding times on the thermal behavior of pork loin muscle by DSC. Pork loin muscles were heated to achieve the following end-point temperatures: 40$^{\circ}C$, 50$^{\circ}C$, 60$^{\circ}C$, 70$^{\circ}C$, 80$^{\circ}C$ at heating rate = 10$^{\circ}C$/min. The first peak was disappeared when samples were initially heated to 50$^{\circ}C$ for 1 minute. As end-point temperature was raised, major peaks were progressively disappeared and peaks were lost completely at 80$^{\circ}C$. Especially, peaks were completely disappeared at 70$^{\circ}C$ for 10 minute. Increasing of exposure time to elevated temperature also increased denaturation, thereby reducing the area of the thermogram.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1406-1411
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• 2004

A series of experiments was conducted to examine characteristics of a grooved flat-strip heat pipe having multiple heat sources. The inner grooves of the heat pipe have the aspect ratio of 1 to $2.5(0.42{\times}1.05$ mm) whose pitch was 0.6 mm. Four block heaters ($10{\times}20$ mm) were placed in the evaporator section at intervals of 20 mm and six different heating modes were tested. The maximum surface heat flux of 80 $W/cm^2$ was achieved while the operating temperature was kept below $100^{\circ}C$, In the nearest heating mode (from the condenser location), the heat pipe exhibited more stable temperature distribution than the far heating mode where the heaters is located furthest from the condenser.