• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.125-130
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• 2016

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.270-275
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• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

• Journal of the Korean institute of surface engineering
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• v.48 no.2
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.125-130
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• 2002

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.

• Nuclear Engineering and Technology
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• v.49 no.8
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• pp.1654-1659
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• 2017

The boundary layer of a two-dimensional forced convective flow along a persistent moving horizontal needle in an electrically conducting magnetohydrodynamic dissipative nanofluid was numerically investigated. The energy equation was constructed with Joule heating, viscous dissipation, uneven heat source/sink, and thermal radiation effects. We analyzed the boundary layer behavior of a continuously moving needle in Blasius (moving fluid) and Sakiadis (quiescent fluid) flows. We considered Cu nanoparticles embedded in methanol. The reduced system of governing Partial differential equations (PDEs) was solved by employing the Runge-Kutta-based shooting process. Computational outcomes of the rate of heat transfer and friction factors were tabulated and discussed. Velocity and temperature descriptions were examined with the assistance of graphical illustrations. Increasing the needle size did not have a significant influence on the Blasius flow. The heat transfer rate in the Sakiadis flow was high compared with that in the Blasius flow.

• Journal of the Korea Institute of Military Science and Technology
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• v.22 no.2
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• pp.249-254
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• 2019

A Digital Transmitter/Receiver Module(DTRM), which is an essential part in active phased-array radar systems, generates a high heat density, and needs to be properly cooled for stable operation. A tile-type DTRM that is a stacking structure of multi-layer components was modeled with simplification and heat dissipation characteristics of the DTRM model were studied using computational fluid dynamics(CFD) simulations. Most of the heat was dissipated by the heat conduction through the cold plate, but the heat transfer by the forced convection on top of the DTRM also was found to play an important role in the thermal management. Under the given conjugated heat transfer environment, the DTRM was confirmed to secure a stable operating temperature range.

• Fashion & Textile Research Journal
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• v.4 no.6
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• pp.564-566
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• 2002

Protective clothing for firefighters typically consists of a flame resistant outer shell and inner layers. The inner layers are generally composed of a moisture barrier and a thermal barrier. On performing the task in fire place the heat and perspiration generated from the body become trapped inside the protective clothing. Those heat and moisture result into heat-stress and physical fatigue of fire fighter, which hinder the work. Therefore, the system of clothing designs and material layers must be chosen carefully to balance protection and comfort. 3 kinds of protective clothing of 3 layer structure were used in the experiment of physiological comfort. From the comparison of wear trials with the 3 kinds of layers in firefighters clothing, it indicates that the moisture dissipation of A+B2+C was highest, following A+BI+C andA+B3+C. And the heat dissipation of A+BI+C and A+B2+C were better than A+B3+C. In the protective clothing with A+B3+C, heat and perspiration generated through exercise remained in clothing system long and caused discomfort.

• Journal of Magnetics
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• v.21 no.1
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• pp.153-158
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• 2016

This paper aims to discuss the Non Darcy boundary layer flow of non-conducting viscous fluid with magnetic ferroparticles over a permeable linearly stretching surface with ohmic dissipation and mixed convective heat transfer. A magnetic dipole is applied "a" distance below the surface of stretching sheet. The governing equations are modeled. Similarity transformation is used to convert the system of partial differential equations to a system of non-linear but ordinary differential equations. The ODEs are solved numerically. The effects of sundry parameters on the flow properties like velocity, pressure, skin-friction coefficient and Nusselt number are presented. It is deduced the frictional resistance of Lorentz force decreases with stronger electric field and the trend reverses for temperature. Skin friction coefficient increase with increase in ferromagnetic interaction parameter. Whereas, Nusselt number decrease.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.2
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.7
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• pp.539-544
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• 2013

To study the encapsulation method for heat dissipation of high brightness organic light emitting diode (OLED), red emitting OLED of ITO (150 nm) / 2-TNATA (50 nm) / NPB (30 nm) / $Alq_3$ : 1 vol.% Rubrene (30 nm) / $Alq_3$ (30 nm) / LiF (0.7 nm) / Al (200 nm) structure was fabricated, which on $Alq_3$ (150 nm) / LiF (150 nm) as buffer layer and Al as protective layer was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and metal sheet. The current density, luminance and power efficiency was improved according to thickness of Al protective layer. The emission spectrum and the Commission International de L'Eclairage (CIE) coordinate did not have any effects on encapsulation process using attaching film and metal sheet The lifetime of encapsulated OLED using attaching film and metal sheet was 307 hours in 1,200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 7% compared with 287 hours, lifetime of encapsulated OLED using attaching film and flat glass. As a result, it showed the improved current density, luminance, power efficiency and the long lifetime, because the encapsulation method using attaching film and metal sheet could radiate the heat on OLED effectively.