• 제목/요약/키워드: grinding process

검색결과 824건 처리시간 0.028초

고화소 디지털 카메라 비구면 Glass렌즈 초정밀연삭 특성에 관한 연구 (A Study on Grinding Characteristics of Aspherical Glass Lens core of High-pixel Digital Camera in Diamond Grinding Process)

  • 현동훈;이승준
    • 한국공작기계학회논문집
    • /
    • 제12권2호
    • /
    • pp.31-36
    • /
    • 2003
  • Electronic or measuring instruments equipped with aspherical lens have recently been used since aspherical lens is more effective than spherical one. for the mass production of aspherical lenses, specific molds with precisely machined cores should be prepared. Some researches on the aspherical lens machining have been carried out to date. However, ultra-precise finding of aspherical or mold core has not been fully studied. In this study, the ultra-precise grinding and evaluating system were established to investigate the finding characteristics of aspherical lenses. Unlike conventional grinding process, since a highly-precise lathe were operated in a clean room without vibration the experimental results can be very useful for further studies on ultra-precise grinding process.

웨이퍼 연삭 가공 기술의 동향 및 가공 정밀도 향상에 관한 연구 (The Trend of wafer Grinding Technology and Improvement of Machining Accuracy)

  • 안대균;황징연;이재석;이용한;하상백;이상직
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2002년도 춘계학술대회 논문집
    • /
    • pp.20-23
    • /
    • 2002
  • In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

  • PDF

연삭가공에서 이동열원에 의한 온도 분포 (A Moving Heat Source Caused by Temperature Distribution in Grinding Process)

  • 곽태경;하만경;구양;곽재섭
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 1997년도 추계학술대회 논문집
    • /
    • pp.899-902
    • /
    • 1997
  • The heat generated during surface grinding process can lead to elevate a grinding temperature, which cause the thermal damage to the workpiece material. Because of this reason, it is important to be able to predict the temperature which is occurred during grinding. The process parameters, therefore, should be adjusted properly to yield the acceptable workpiece temperature. In this study, we conducted an experimentation to obtain and also to analyze the temperature distribution of the workpiece with accordance in varying the grinding condition. For measuring the workpiece temperature, thermocouples of the CA type were inserted into the predetermined locations of the workpiece.

  • PDF

연삭가공의 이상상태 진단 기법 (Trouble Diagnostic Method in Grinding Process)

  • 곽재섭
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
    • /
    • pp.20-27
    • /
    • 2000
  • A chatter vibration and a workpiece burn are the main phenomena to be monitored in modern grinding processes. This study describes a trouble diagnosis of the cylindrical plunge grinding process using the power and acoustic emission (AE) signals. The raw signals of the power and the AE occurred during the grinding operation were sampled and analyzed to determine the relationship between each fault and change of signals. A neural network that has a high success rate of the fault detection was used. Furthermore, an analysis on the influence of parameters to the chatter vibration and the grinding burn was conducted.

  • PDF

2 Dimensional Modeling of Centerless Grinding -Infeed (Plunge) Process-

  • Kim, Kang
    • International Journal of Precision Engineering and Manufacturing
    • /
    • 제4권4호
    • /
    • pp.25-31
    • /
    • 2003
  • A computer simulation model for investigating a two-dimensional (2-D) rounding mechanism in a centerless grinding process is described. This model includes the interference phenomena and the concept of machining elasticity. Since initial contact points are used as a reference, the result of this simulation is not affected by the location of the reference circle center and the radius of the reference circle. Also, details of the machining factor are studied by using process variables (grinding wheel speed, wheel specification, workpiece speed, dressing condition, etc.). The effect of the threshold grinding force on the size of ground workpiece is investigated. For the verification of this method, simulation results are compared with the experimental work.

사파이어 의료용 나이프의 연삭가공에서 지그의 탄성계수가 날 부 형상에 미치는 영향 : 제2보 탄성계수와 치핑 현상의 검증 (Effect of the Elasticity Modulus of the Jig Material on the Blade Edge Shape in the Grinding Process of Sapphire Medical Knife - Part 2 Verification of the Chipping Phenomenon and Elastic Modulus of the Jig Material)

  • 신건휘;강병욱;곽태수
    • 한국기계가공학회지
    • /
    • 제16권5호
    • /
    • pp.63-68
    • /
    • 2017
  • This study determines the selection of an appropriate jig material for the blade edge of the medical sapphire knife. The physical properties of the jig material affects the edge shape and chipping phenomenon in machining of the medical sapphire knife. If a grinding wheel is used, brittle workpieces such as sapphire are easily damaged by the propagation of cracks because the grinding force significantly increases. It is important to constantly maintain the grinding force in the grinding process of the brittle materials. The grinding force can be kept constantly by inducing the elastic deformation of the Jig material because the elastic deformation of brittle work-piece is negligibly low. The chipping phenomenon may be reduced by selecting the proper Jig material. Aluminum, copper, stainless steels and carbon steel were used as Jig materials. The experiment was conducted using a cast iron grinding wheel, which was installed on a conventional grinding machine with the ELID grinding system. The thickness and width of the chipping area were measured using an optical microscope and FE-SEM to analyze the shape of the blade edge. According to the experiment result, the chipping phenomenon decreased, and the sharp edge was formed when the jig materials with low elastic modulus were used.

CBN 연삭숫돌의 초음파 인프로세스 드레싱 기법 (A Study on the Ultrasonic In-Process Dressing Method of CBN Grinding Wheel)

  • 이석우;정해도;최헌종
    • 한국정밀공학회지
    • /
    • 제17권2호
    • /
    • pp.43-50
    • /
    • 2000
  • A CBN wheel was used for the highly efficient and precision grinding of the mold material(STD11). The grinding form accuracy by a CBN wheel is very excellent due to its low wheel wear, but grinding fragments resemble fine powders rather chips. A fine powders by this fragmentation can easily get attached to the wheel surface and therefore causing a loading. In order to prevent this fragmentation phenomena, the alumina stick is use to processing. Because the dressing with alumina stick should be interrupted for a processing, the automation of the processing and high productivity was very difficult. The investigation on the effect of Ultrasonic In-Process Dressing(ULID) on the grinding characteristics focuses in this Paper. This ULID method is that ultrasonic vibration in my Position of wheel is used to remove impurities on the wheel surface. Finally, the rate of surface roughness change in grinding by the ULID method was less than grinding without ultrasonic vibration. Loading phenomena by the ULID method were more prevented than grinding without ultrasonic vibration.

  • PDF

MLCC 절단용 초경합금 칼날의 나노표면 가공 기술 (Nano-surface Machining Technology of Tungsten Carbide Blade for MLCC Cutting Process)

  • 강병욱;신건휘;곽태수
    • 한국기계가공학회지
    • /
    • 제18권11호
    • /
    • pp.41-46
    • /
    • 2019
  • The purpose of this study is to examine and propose a high quality blade manufacturing method by applying ELID grinding technology to machining the tungsten carbide blade edge for MLCC sheet cutting. In this study, experiments are performed according to the abrasive type of grinding wheel, grinding method and grinding direction using the non-stop continuous dressing ELID grinding technology. By comparing and analyzing the chipping phenomena and surface roughness of both the blade grinding surface and the processed surface, a method for machining the tungsten carbide blade for cutting MLCC sheet is proposed. From the analysis of the surface roughness and chipping phenomena, it is confirmed that the use of diamond abrasive is advantageous for the blade machining. In addition, it succeeds in the machining of $6{\mu}m$ fine blade without any chipping, by using the grinding wheel #4000 with the diamond abrasive.

최적 연속 전해드레싱을 적용한 SUS304의 연삭에 관한 연구 (A Study on the the Grindig of SUS304 with Optimum In-Process Electrolytic Dressing)

  • 김정두
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 1997년도 추계학술대회 논문집
    • /
    • pp.25-30
    • /
    • 1997
  • In recent years, grinding techniques for precision machining of astainless steel used in shaft, screw parts and clear value have been improved by using superabrasive wheel and precision grinding machine. The completion of optimum dressing of superabrasive wheel makes possible the effective percision grinding of stainless steel. However, the present dressing system cannot have control of optimum dressing of the superabrabive wheel. In this study, a new system and the grinding mechanism of optimum in-process electrolytic dressing were proposed. This system can carry out optimum in-process dressing of superabrasive wheel. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of stainless steel(SUS304).

  • PDF