• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 추계학술대회 논문집
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• pp.232-232
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.85-86
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• 2010

• 한국기계가공학회지
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• 제15권4호
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• pp.8-15
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• 2016

Most machines lose a lot of energy due to friction. Wear due to friction also reduces performance. Therefore, it is important to reduce friction on the surface to improve energy efficiency and decrease wear. Surface texturing refers to making patterns on the surface for reducing friction. There are many surface texturing methods, such as using lasers, abrasive jet machining, and so on. Recently, mechanical manufacturing methods, such as cutting and grinding, have been highlighted. Among them, the grinding method has the advantage of making patterns in large areas quickly. Therefore, it is appropriate for surface texturing on large machines. This paper is a study on the slope change of the surface texturing pattern using grinding. Therefore, we researched the slopes of the patterns corresponding to "spindle speed and feed rate" and "curvature of workpiece surface" using a mathematical model and experiment. As a result, we made a proper mathematical model concerning our research. Therefore, using the mathematical model in this paper, we could predict the slope change of the pattern according to grinding conditions.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.918-921
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• 2001

In grinding process, the heat of $1200^{\circ}$~$1500^{\circ}$ on the grinding area between grinding wheel and workpiece is generated. It decreases the surface integrity of workpiece and causes the thermal damages such as the deformed layer, residual stress and grinding burn. Generally coolant is widely used for preventing the heat generation on the grinding area, but it deteriorates the working condition by polluting the atmosphere of workplace and in the end pollutes the environment. The grinding methods using the compressed cold air and mist are the cooling methods to substitute conventional coolant. They can decrease the environmental pollution through not using coolant any more or minimizing it. In this study, the cooling effects of grinding methods using the compressed cold air and mist have been investigated. The grinding system equipped with the water bathe and mist spray nozzle was developed. The energy partition to workpiece through measuring the temperature on the workpiece surface was calculated. The surface integrity of workpiece and thermal damage like the deformed layer were analyzed.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.459-464
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• 2000

In this paper, it verifies the relationships between wheel velocity and surface roughness with the mirror surface grinding using electrolytic in-process dressing (ELID). In the general, as wheel velocity is high, surface roughness is better on the base of grinding theory. However, the relationships between wheel velocity and surface roughness is undefined due to the effect of electro-chemical dressing and the characteristics of materials. According to above relationships, ELID grinding experiment is carried out by following the change of wheel velocity. As the result of this study, it is found that surface roughness is not better as linearly as the increase of wheel velocity, but the limit of wheel velocity exists according to the characteristics of materials. Also, in contradiction to the present trend of high wheel velocity of manufacturing system for high surface integrity, it is able to expected to the base on the development of new ultra precision grinding method with the practicality of mirror surface grinding using ELID grinding method.

• 한국재료학회지
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• 제28권3호
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• pp.148-158
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• 2018

This study investigated the effect of the grinding media of a ball mill under various conditions on the raw material of copper powder during the milling process with a simulation of the discrete element method. Using the simulation of the three-dimensional motion of the grinding media in the stirred ball mill, we researched the grinding mechanism to calculate the force, kinetic energy, and medium velocity of the grinding media. The grinding behavior of the copper powder was investigated by scanning electron microscopy. We found that the particle size increased with an increasing rotation speed and milling time, and the particle morphology of the copper powder became more of a plate type. Nevertheless, the particle morphology slightly depended on the different grinding media of the ball mill. Moreover, the simulation results showed that rotation speed and ball size increased with the force and energy.

• 에너지공학
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• 제28권1호
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• pp.1-9
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• 2019

석탄 화력발전소의 배연탈황공정에서 탈황용 흡수제로 사용하는 석회석을 대상으로 본드의 분쇄일지수(BWI) 및 하드그로브지수(HGI) 측정 후 분쇄효율을 비교하였다. 측정결과, 국내 탈황용 석회석의 분쇄성지수는 HGI가 증가함에 따라 BWI가 감소하는 선형적인 반비례 관계를 확인할 수 있었으며, 석회석의 화학조성 및 채광위치에 따른 결정구조에 따라 분쇄효율의 차이가 발생하였다. 이에 따라, 석회석의 분쇄성을 측정할 경우 측정방법이 까다롭고 시간이 오래 걸리는 BWI 보다 간편하게 측정할 수 있는 HGI를 활용하여도 시료의 분쇄성 차이를 확인할 수 있을 것으로 사료되며, 분쇄 특성에 따른 석회석의 선택적 활용 시 탈황효율 또한 향상시킬 수 있을 것으로 판단된다.

• 한국수소및신에너지학회논문집
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• 제14권4호
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• pp.321-326
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• 2003

We tried to improve the $H_2$-sorption properties of Mg by mechanical grinding under $H_2$ (reactive grinding) with CoO. The sample Mg+10wt.%CoO as prepared absorbs 1.25wt.% hydrogen and the activated sample absorbs 2.39wt.% hydrogen for 60min at 598K, $11.2barH_2$. The reactive grinding of Mg with CoO increases the $H_2$-sorption rates by facilitating nueleation(by creating defects on the surface of the Mg particles and by the additive), by making cracks on the surface of Mg particles and reducing the particle size of Mg and thus by shortening the diffusion distances of hydrogen atoms. Hydriding-dehydriding cycling increases the $H_2$-sorption rates by making cracks on the surface of Mg particles and reducing the particle size of Mg.

• 한국정밀공학회지
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• 제16권4호통권97호
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• pp.148-154
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• 1999

This study was carried out to verify grinding performance of dental diamond bur and investigate the possibility of AE application in dentistry field. Workpieces were made of acryl and bovine respectively for the experiments in this study. Grinding test was conducted to get the data of grinding resistance and specific grinding energy of four different types of diamond bur by using tool dynamometer. AE signal was acquired to verify grinding process in the AE measuring system. Tool wear was observed to find parameters about grinding characteristics of diamond bur by means of SEM picture. It was found that the wear of dental diamond bur could be detected with polishing of grinding material, removal of adhesive parts, wear of particles neighboring cutting nose, loss of material and elevation of temperature. The wear of B, C, D type diamond bur is due to wear and fracture of grain size. Abnormal state can be found through the behavior of AE signal in the grinding working. As a result, it is expected that forecast of abnormal state is possible using AE equipments under real time process.