• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1257-1260
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• 2005

Grinding process has unique characteristics compared with other machining processes. The cutting edges of the grinding wheel don't have uniformity and act differently on the workpiece at each grinding. The response surface analysis is one of various methods for optimizing and evaluating the process parameters to achieve the desired output. In this study, the effect of the grinding parameters on outcomes of the surface grinding was analyzed experimently. To predict the grinding outcomes and to select the grinding conditions before grinding, the second-order response surface models for the grinding force and the surface roughness were developed.

• 한국정밀공학회지
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• 제18권8호
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• pp.150-156
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• 2001

This paper deals with the theoretical estimation and its experimental verification of grinding wheel wear in surface grinding process. A theoretical formulation is provided to predict the grinding wheel wear in surface grinding. To validate the theoretical prediction, the grinding wheel wear is measured by using a laser scanning micrometer. The associated surface roughness and grinding farce are also investigated both theoretically and experimentally. Through a series of simulations and experiments, it is shown that the predictions are in good agreement with the experimental results.

• 한국기계가공학회지
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• 제3권1호
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• pp.45-51
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• 2004

In this paper, the relationship between the mechanical properties of alumina abrasives and grinding performance was investigated. Micro vickers hardness and fracture strength of all abrasives used in this study were measured. The grinding experiments were earned out with alumina grinding wheels made by various kinds of alumina abrasives including 32A, WA, ART, ALOMAX, and RA. The performance of such grinding wheel for grinding SKD11 was evaluated by specific grinding energy, grinding-ratio, and surface roughness. The grinding wheels composed by the harder abrasives and the lower fracture strength abrasives showed better grinding performance.

• 한국기계가공학회지
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• 제6권3호
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• pp.9-15
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• 2007

Three methods for grinding: cross grinding, slanted tool axis grinding and parallel grinding, were carried out to study the machinability of tungsten carbide mold for glass formed aspherics lens. In our research, the optimum grinding conditions were investigated in terms of feed-rate, relative velocity of wheel and work piece, tool marks and surface roughness. It is shown that cross grinding are most effective in removal ratio but poor in surface roughness. In addition, tool marks of each method were differentiated on direction and shape.

• 한국공작기계학회논문집
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• 제11권5호
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• 한국정밀공학회지
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• 제17권9호
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• pp.45-52
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• 2000

To reduce two preprocess operations to one in the surface grinding operation the laminated grinding wheel was introduced and its availability has already been investigated in the cylindrical grinding process. Thus in this study the experiment was carried out to attempt to prove that the laminated grinding wheel can be used in the surface grinding process with respect to the roughness and grinding force.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.16-21
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• 2004

As a new approach to analyze grinding energy, this paper introduces a specific grinding energy model based on the average grain. Using this model, grinding characteristics such as radial and tangential forces, specific grinding energy of SM45C were investigated altering grinding variables such as workpiece velocity(v) and apparent depth of cut(Z) in down-surface grinding. From the experimental results, there is no significant difference between the radial, tangential forces and vertical. horizontal forces because of small contact angle between wheel and workpiece. The specific grinding energy decreases as the maximum undeformed chip thickness increases. But, there is much difference between the specific grinding energies of the existing and the proposed model.

• 한국정밀공학회지
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• 제19권9호
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• pp.59-65
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• 2002

Grinding temperature between a grinding wheel and a workpiece surface, rising rapidly during a machining operation, has bad effects on a surface integrity such as the burning, the residual stress and the crack. In this study, the temperature distribution was obtained briefly by the finite element method and the grinding temperature of a workpiece varying with the grinding condition was measured experimentally. For obtaining the grinding temperature, a thermocouple method was applied. Three thermocouples were inserted in a surface of each workpiece. Changed grinding conditions were the depth of cuts, the feedrate, the dry and wet grinding, the up and down grinding and the number of pieces.

• 한국공작기계학회논문집
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• 제14권4호
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• pp.61-68
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• 2005

As a new approach to analyze grinding energy, this paper introduces a specific grinding energy model based on the average grain. Using this model, grinding characteristics such as radial and tangential forces, specific grinding energy of SM45C were investigated with changing grinding variables such as workpiece velocity(v) and apparent depth of cut(Z) in down-surface grinding. From the experimental results, the specific grinding energy decreases as the maximum undeformed chip thickness increases. And there is no significant difference between the specific grinding energies of the existing and the proposed model.