• Laser Solutions
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• v.6 no.2
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• pp.9-17
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• 2003

Due to the heat confinement in the shallow region of the target for a short time scale, pulsed laser annealing has received an increasing interest for the fabrication of poly-Si thin film transistors(TFTs) on glass as a low cost substrate in the flat panel displays. The formation and growth mechanisms of poly silicon(poly-Si) grains in thin films are investigated using an excimer laser crystallization system. To understand the crystallization mechanism, the grain formations are observed by FESEM photography. The optical reflectance and transmittance during the crystallization process are measured using HeNe laser optics. A two-step ELC(Excimer Laser Crystallization) process is applied to enhance the grain formation uniformity.

• Transactions of Materials Processing
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• v.22 no.8
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• pp.450-455
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• 2013

In the current study, a new dynamic recrystallization model for predicting high temperature flow stress is developed based on a physical model and the mean field theory. In the model, the grain aggregate is assumed as a representative volume element to describe dynamic recrystallization. The flow stress and microstructure during dynamic recrystallization were calculated using three sub-models for work hardening, for nucleation and for growth. In the case of work hardening, a single parameter dislocation density model was used to calculate change of dislocation density and stress in the grains. For modeling nucleation, the nucleation criterion developed was based on the grain boundary bulge mechanism and a constant nucleation rate was assumed. Conventional rate theory was used for describing growth. The flow stress behavior of pure copper was investigated using the model and compared with experimental findings. Simulated results by cellular automata were used for validating the model.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.612-618
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• 2000

The WC/WC grain boundary structure and intergranular segregation in WC-Co and WC-VC-Co cemented carbides were investigated by high-resolution transmission electron microscopy and energy dispersive X-ray spectroscopy in order to elucidate whether contiguous boundaries were present or not at the atomic level. Some grain boundaries were separated by liquid phase, while others were contiguous at the atomic level. Cobalt was found to be segregated to WC/WC grain boundaries in WC-Co. Cobalt and vanadium were co-segregated to grain boundaries in WC-VC-Co. The segregation width in both materials was about 6 nm. These results suggest that the vanadium present in contiguous boundaries acts as an effective barrier to the migration of boundaries during sintering and annealing. This could explain the grain growth inhibiting mechanism of VC added to WC-Co.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.6
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• pp.83-89
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• 1997

In order to study on fatigue crack retardation and retardation mechanism in variable loading, the effects of crack tip branching in fatigue crack growth retardation were examined. The characteristics of crack tip banching behavior was considered to micro structure. It was examined that the variation of crack tip branching angle. Crack tip branching was observed along the grain boundary of ferrite and pearlite structure. It was found that the abanching angle ranges from 25 to 53 degrees. Using the finite element method, the variable of crack driving force to branching angle was examined. The effective crack driving force ( $K_{\eff}$ ) decreased as the braching angle increases. The rate of decrease was 33% for the kinked type and 29% for the forked one. It was confirmed that the effect of crack tip branching is a very important factor in fatigue crack growth retardation. Therefore, crack branching effect should be considered building the hypoth- etical model to predict crack growth retardation.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.6
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• pp.263-269
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• 2019

The mechanism of microstructure and hardness changes during mill annealing of Ti-6Al-4V alloy was investigated. The annealing heat treatments were performed at $675{\sim}795^{\circ}C$ in vacuum for 2 hours, followed by air cooling. The microstructure was observed by using an optical microscope and X-ray diffraction, and hardness was measured by using a Rockwell hardness tester and micro Vickers hardness tester. The average grain size becomes smaller at $675^{\circ}C$ to $735^{\circ}C$ due to the formation of new grains rather than grain growth, but becomes larger at $735^{\circ}C$ to $795^{\circ}C$ due to growth of the already-formed grains rather than formation of new grains. The mill annealing temperature becomes higher, the ${\beta}$ phase fraction decreases and ${\alpha}$ phase fraction increases at room temperature. This is because the higher annealing temperature, the smaller amount of V present in the ${\beta}$ phase, and thus the ${\beta}$ to ${\alpha}$ transformation occurs more easily when cooled to room temperature. As the mill annealing temperature increases, the hardness value tends to decrease, mainly due to resolution of defects such as dislocations from $675^{\circ}C$ to $735^{\circ}C$ and due to grain growth from $735^{\circ}C$ to $795^{\circ}C$, respectively.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.32.1-32.1
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• 2018

Novel soft magnetic materials can be achieved by altering material properties such as morphology, composition, crystallinity, and grain size of soft magnetic alloys. Especially, magnetic properties (i.e., saturation magnetization, coarcivity) of soft magnetics are significantly affected by grain boundaries which act as a control of magnetic domain wall movement. Thus, we herein develop a two-step electroless plating method to control morphology and grain size of FeCo films for excellent magnetic properties. Accordingly, the chemical composition to control the degree of polarization of FeCo alloys was altered by electroless deposition parameters; for example, electrolyte concentration and temperature. The grain size and crystallinity of FeCo alloys was dramatically affected by the reaction temperature because the grain growth mechanism dominantly occurs at $90^{\circ}C$ where as the neucleation only happens at $50^{\circ}C$. By simply controlling the temperature, the micron-sized FeCo grains embedded FeCo film was synthesized where the large grains allow high magnetization originated from larger magnetic domain with low corecivity and the nano-sized grains allow excellent soft magnetic properties due to the magnetic correlation length.

• Korean Journal of Metals and Materials
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• v.49 no.6
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• pp.454-461
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• 2011

In this study, the relationship between corrosion resistance and microstructural characteristics such as grain size reduction, preferred orientation, and homogenous distribution of elements and impurity by mechanical milling of magnesium powder was investigated. Mechanical milling of pure magnesium powder exhibited a complex path to grain refinement and growth together with preferred orientation reversal with milling time. It was also found that anisotropic formation of dislocation on the basal plane of magnesium was initially the dominant mechanism for grain size reduction. After 60 hrs of milling, grain coarsening was observed and interpreted as a result of the strain relaxation process through recrystallization. In spite of the finer grain size and strong (002) texture developed in the sample prepared by spark plasma sintering at $500^{\circ}C$ for 5 min after mechanical milling for 2hrs, the sample showed a higher corrosion rate. The results from this study will be helpful for better understanding of the controlling factor for corrosion resistance and behaviors of mechanical milled magnesium powders.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.35-35
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• 2002

Atomic force microscopy was applied to study the formation and growth mechanism of thin chrome layers prepared under various pulse plating conditions. The chrome was electro-deposited from an electrolyte bath containing 250 gl-l of chromic acid, 25 gl-l of sulfuric acid using direct current density of $1.6{\;}mA.$\textrm{mm}^{-2} and pulse currents with on-off time from 5 to 900 ms. The higher current density enhanced nucleation rate which resulted in refining grain size. The chrome growth kinetics determining nodule size and shape significantly depends on the duration of on-time rather than duration of off-time and on/off time ratio.

• Journal of the Korean Ceramic Society
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• v.41 no.2
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• pp.131-135
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• 2004

The effect of Co additive on the microstructural evolusion of WC was investigated. A small amount of Co powder was placed on the top-center of the pure WC powder compact and then sintered at 1950$^{\circ}C$. During sintering some abnormally large WC grains of different size and shape observed depending on the distance from the liquid source. However, in the region far away from Co liquid source, it showed low densification and the grains of WC were very small and uniform in size. A small amount of Co liquid phase has a remarkable influence on the AGG of WC and it has been explained in terms of 2-D nucleation and growth mechanism.

• Journal of Welding and Joining
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• v.15 no.3
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• pp.128-135
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• 1997

Reaction diffusion and formation of $Ni_3Al$phase with $L1_2$ structure have been studied in temperature range of 1432K to 1573K using the diffusion couple of (Ni-40, 5at%Al)/(Ni-14, 1at%Al) and (Ni-49, 2at%Al)/ (Nickel). The layer growth of Ni$_{3}$Al pyhase in the annealed diffusion couple was measured by optical microscope and electron probe microanalyzer (EPMA). The layer growth of $Ni_3Al$phase in diffusion zone obeyed the parabolic law without any indication of grain boundary effects. The layer growth of $Ni_3Al$phase in temperature range of 1423K to 1573K was mainly controlled by the volume diffusion mechanism. The rate of layer growth of $Ni_3Al$phase was found to be colsely related to the composition of intermetallic compound NiAl phase. The activation energy for layer growth of $Ni_3Al$phase was calculated to be 127kJ/mol.