• Journal of the Korean Magnetics Society
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• v.13 no.1
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• pp.6-14
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• 2003

The purpose of this study is to investigate the effect of chemical reaction with a bonding glass on physical and magnetic properties of Fe-Hf-N/SiO$_2$ and Fe-Hf-N/Cr/SiO$_2$ thin films. When the Fe-Hf-N/SiO$_2$ films were reacted with the bonding glass, the soft magnetic properties of them were extremely degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 1 kG, and its coercivity increased to 27 Oe, and its effective permeability decreased to 70. It was found that the degradation of soft magnetic properties of the Fe-Hf-N/SiO$_2$ films reacted with the bonding glass were attributed to the oxidation of the Fe-Hf-N layers to HfO$_2$ and Fe$_3$O$_4$. The soft magnetic properties of the Fe-Hf-N/Cr/SiO$_2$ films reacted with the bonding glass were degraded less than those of Fe-Hf-N/SiO$_2$ films. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was found that the Cr layer suppressed the oxidation of the Fe-Hf-N layers during the chemical reaction between the Fe-Hf-N layer and bonding glass.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.1
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• pp.70-72
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• 2000

In this paper, a spacer process for FED(Field Emission Display) was developed with the glass to glass anodic bonding technology using Al film as an interlayer and a 3.5 inch monochromatic type FED was fabricated. Holder to dislocate spacers vertically was designed with (110) Si wafer by bulk etching. Spacers, $100\mum\; width\; and\; 1000\mum$ height, were formed on anode panel by spacer to glass anodic bonding and the fabricated FED was operated for emission at 1㎸ anode voltage.

• Restorative Dentistry and Endodontics
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• v.16 no.1
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• pp.60-73
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• 1991

The purpose of this study is to evaluate the effects of etching time, environmental temperature and humidity on the adhesion of composite resin to glass-ionomer cement. Two chemical cure composite resins (Clearfil F II and Microrest AP) and two glass-ionomer cements (Fuji ionomer Type I and KET AC-CEM) were used as the experimental materials. The experiment is performed in 3 stages: The first stage is to bond composite resins to glass-ionomer cements, and the surface was not etched, and etched for 20 seconds, 40 seconds, and 60 seconds. Then specimens are stored in distilled water at $37^{\circ}C$ for 24 hours to measure tensile strength. The second stage is to choose the one group that had the highest tensile strength from the first stage and prepare two experimental groups: One group with composite resin bonded to glass-ionomer cement without etching and bonding agent application and the other with composite resin bonded to glass-ionomer cement with etching but without any bonding agent application. The specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and tensile strength is measured. The third stage is to choose group that had the highest tensile strength from the first stage experiment, and bond composite resin to glass-ionomer cement at $24^{\circ}C$ 44%, $30^{\circ}C$ 44%, $30^{\circ}C$ 80%, and $32^{\circ}C$ 92%. The storage time of specimens is to bond immediately after storage, then changed to 30 sec., 60 sec., and 120 sec.. Specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and their tensile strength are measured again. The following results were obtained: 1. As the etching time increases, the tensile bond strength between glass-ionomer cement and composite resin increase, and the tensile bond strength is the highest when acid etched for 60 minutes (P < 0.05). 2. After acid etching for 60 minutes, the tensile strength of the group with bonding agent was stronger than that without bonding agent application (P < 0.05). 3. The tensile strength of Clearfil F II was stronger than that of Microrest AP. 4. It was observed that the tensile bond strength is not affected by different storage time with different temperature and humidity. 5. As the humidity was increased, the tensile bond strength between glass-ionomer cement and composite resin decreased (P < 0.05).

• Restorative Dentistry and Endodontics
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• v.19 no.2
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• pp.633-640
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• 1994

The tensile bond strength to dentin was measured for three glass-ionomer cement and composite resin combinations: two light-curing glass-ionomer cements(Vitrebond and XR - Ionomer) and one traditional glass - ionomer cement(Ketac - Bond), two adhesive systems(Scotchbond, and XR - Bonding System), and a corresponding composite resin. The bond strength of this "sandwich" was also compared with that of the same cements used in bulk. Vitredbond showed a significantly higher bond strength in bulk than did the other two cements. Of the sandwiches, the XR - Iomomer and XR - Bond combination showed a bond strength significantly higher than that of the Vitrebond and Scotchbond or Ketac- bond and Scotchbond combination. The fracture of the bond was mainly adhesive for Vitrebond, cohesive for XR - Ionomer when used in bulk and adhesive - cohesive when used in a sandwich, and cohesive for Ketac-Bond.

• Journal of computational fluids engineering
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• v.8 no.2
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• pp.33-41
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• 2003

A simplified simulation model is designed to investigate the vacuum-driven bonding of glass panels in the cell process for LCD manufacturing. The bonding process is modelled by the transient flow of a weakly-compressible fluid in a very thin channel between two horizontal glass panels. An order of magnitude scaling analysis is conducted based on the characteristic feature of the channel of which height is much smaller than the horizontal length scales. It is revealed that the flow in the channel is represented by a Poiseuille flow of a compressible fluid. A finite volume model has been constructed to acquire the numerical solution to the derived simplified equations. For a simple test problem of pressure-driven microchannel flow, an assessment is made of the accuracy and validity of the proposed model. The basic aspects of vacuum-driven bonding are examined numerically, and the applicability of the present simulation model is illustrated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.347-350
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• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

• Proceedings of the Korea Concrete Institute Conference
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• 2000.10a
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• pp.785-792
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• 2000

Repair and retrofit system of concrete structures has been developed from conventional reinforced concrete overlaying, steel plate bonding and recently to fiber composite systems. Research and study on carbon, aramid, and glass fiber composite system has been actively carried out from all over the world Glass fiber composite is proved to be competitive technically and enconomically, among fiber composite system. CAF system is a system developed locally using all domestic materal, glass fabric and epoxy, and improved in shear bonding property by utilizing silica fume mixed with epoxy. All the tests on material properties, structural behavior, constructiveness at site and quality control procedure proved to be most appropriate system so far developed. Futher research work is and will be under progress for utilization of this system which will be applied to more adverse situation.

• Proceedings of the Optical Society of Korea Conference
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• 2002.07a
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• pp.254-255
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• 2002

Optical elements such as small glass lenses or optical fibers can be permanently bonded to substrates using Al inter-layer by applying Pressure and heating. As an example aspherical lens was bonded on a silicon V-groove. The bonding has high shear strength and good thermal cycling stability.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1946-1949
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• 1996

We have performed silicon-to-silicon anodic bonding using glass layer deposited by electron beam evaporation. Wafers can be bonded at $135^{\circ}C$ with an applied voltage of $35V_{DC}$, which enables application of this technique to the vacuum packaging of microelectronic devices, because its bonding temperature and voltage are low. From the experimental results, we have found that the evaporated glass layer more than $1\;{\mu}$ m thick was suitable for anodic bonding. The role of sodium ions for anodic bonding was also investigated by theoretical bonding mechanism and experimental inspection.

• Journal of the Korean Academy of Esthetic Dentistry
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• v.7 no.1
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• pp.42-47
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• 1998

This study was performed to compare the bonding mechanism of glass ionomers. In this study, hybrid glass ionomers were used for restoration(Fuji II LC, GC, Japan) as the material of choice. Two different etching solutions were used in this study, 35% phosphoric acid and 10% polyacrylic acid. The effect of two different conditioners to dentin surface of a primary molar was studied and compared by using scanning electron microscope. Further, the interface of the dentin surface and the hybrid glass ionomers were examined.