• Electrical & Electronic Materials
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• v.7 no.3
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• pp.187-199
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• 1994

In order to find an effect of structural changes due to variation of addition ratio of anhydride hardener and postcuring herat-treatments upon electrical properties of epoxy composites, the dielectric properties over a frequency range from 30[Hz] to l[MHz] were investigated in the temperature range of 20-180[.deg. C]. From the dielectric properties, the a peaks related with glass-transition phenomena of epoxy network appeared near 130[.deg. C], the conduction loss in high temperature region above 150[.deg. C] due to thermal dissociation of hardener started off with the low frequency side and the .betha. peak concerned with contribution of movable unreacted terminal epoxy groups and curing agents in the glass states concurred with the high-frequency side below 20[.deg. C]. And an effect of an hydride hardener upon structural changes and of postcuring heat treatments upon structural stability in epoxy composites would be explained through the estimation of the distribution of relaxation times and the activation energy for a .alpha. peak according to the WLF equations.

• Journal of the Korean Ceramic Society
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• v.39 no.2
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• pp.194-198
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• 2002

Various composition of $K_2O{\cdot}CaO{\cdot}P_2O_5$ glasses were studied by melting process to identify glass forming region. Thermal properties were observed by DSC and TG-DTA, structural properties were investigated by FT-IR and Raman Spectroscopy. The glass transition temperature (Tg) and softening temperature (Ts) were decreased with increasing $K_2O\;and\;P_2O_5$ contents. The basic structural unit of phosphate glasses is the $PO_2\;and\;PO_4^{3-}$ groups to make a cross-link and P-O-P group to form skeleton structure. As CaO content was increased, the P-O-P field strength in these glass was increased and intensity of $PO_2\;and\;PO_4^{3-}$ stretch was decreased.

• Korean Journal of Materials Research
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• v.17 no.8
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• pp.414-419
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• 2007

We report the electrical conductivity of the mixed alkali silicate glasses in the system (60-x)$SiO_2-40Na_2O-xCaO(x=0\sim15wt%)$ in the temperature range from $150^{\circ}C$ to $620^{\circ}C$. In the range from $150^{\circ}C$ to glass transition temperature$(T_g)$, the electrical conductivities of glass samples had a tendency to be proportion with temperature. The glasses of containing over 7.5wt% CaO showed lower conductivities than the glasses of containing 0 and 5wt% CaO because two kinds of alkali ions$(Na^+,\;Ca^{2+})$ were obstructed each other. On the other hand, in the range from $T_g$ to $620^{\circ}C$, the electrical conductivity of glasses($7.5{\leq}x{\leq}12.5$) was unstable and decreased in some region. From XRD results, the $Na_4Ca(SiO_3)_3$ phase were observed in these glasses. This means the alkali ions didn't behave as carrier, it seems that this caused the conductivities decrease. In case of glass of containing 15wt% CaO, any crystal phase were not observed. This means the alkali ions behaved as carrier, it consequently seems the conductivity increased.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.441-444
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• 2009

Weldlines are generated during the injection molding process when two or more melt flows are brought into contact. At the welded contact region, a 'V'-shaped notch is formed on the surface of the molded part. This 'V'-notch deteriorates not only surface appearance but also mechanical strength of the molded part. To eliminate or reduce weldlines so as to improve the weldline strength, the mold temperature at the corresponding weld locations should be maintained higher than the glass transition temperature of the resin material. The present study implements high-frequency induction heating in order to rapidly raise mold surface temperature without a significant increase in cycle time. This induction heating enables to local mold heating so as to eliminate or reduce weldlines in an injection-molded plastic part. The effect of induction heating conditions on the weldline strength and surface appearance of an injection-molded part is investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.813-816
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• 2001

In this paper, the dielectric properties of epoxy composites used for transformers are studied. The dielectric permittivity and loss of specimen are measured at the frequency range of 30[Hz]∼1[MHz] about temperature 20[$^{\circ}C$],100[$^{\circ}C$] and 140[$^{\circ}C$] respectively from a series of experiments. When the filler is added, between epoxy and silica is formed interface. Therefore, observed higher values of dielectric permittivity and loss in filled epoxy are attributed to MWS polarization effect. Also, glass transition temperature was shifted to higher temperature and value of dielectric permittivity and loss were decreased due to 2nd curing. Deformation of interfacial state is improved and value of dielectric permittivity and loss were decreased at low frequency region by the surface treatment of fillers with silane coupling agents.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.5-6
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• 2006

Molecular motion at the surface of monodisperse polystyrene (PS) films with various chain end groups was studied by scanning probe microscopy. Surface glass transition temperature ($T_{g^s}$) of the PS films was much lower than the corresponding bulk value. And, the magnitude of $T_{g^s}$ was strongly dependent on chain end chemistry. This result can be explained in terms of the chain end concentration at the surface. Time-temperature superposition principle was applied to rheological analysis at the surface. The apparent activation energy of the surface ${\alpha}_{a}$-relaxation process was approximately a half of that for the bulk sample. This result clearly indicates that the cooperativity for the surface segmental motion was reduced in comparison with that in the bulk region.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.35 no.2
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• pp.67-76
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• 1986

It is observed that an appreciable short-circuit current (Is) flows by the time variation of temperature without applying external field in M1(metal)-P(polymer)-M2(metal)system. In M1-P-M2(A1) system, Is flows in the direction from the electrode(A1) having a lower workfunction to the counter electrode(M1) during heating and its magnitude increases as the thickness of polymer is decreased and as the heating rate is raised. The sign of Is is reversed in lower temperature region (under glass transition temperature) when the direction of temerature variation is changed during heating and cooling. From these experimental results, we can sugest that Is flows in the external short-circuit during the space charge distribution formed around both interfacial surfaces (M1-P and P-M2) is continuously maintained in the non-equilibrium state but not in equilibrium state.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.233-236
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• 2006

A dilatometer was used to investigate the effect of cure conditions and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with number of cyclic cure. Post cured samples outside the mold led to less shrinkage compared with sample in the mold. And sample containing kaolin filler showed less shrinkage than unfilled sample.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.273-276
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• 2005

Packing characteristics of amorphous alloy particles were investigated by scanning electron microscopy, compositional analysis, micro-hardness test and finite element method (FEM). Electroless Ni-plating was made on the surface of the Cu-based amorphous particles before consolidation in ambient atmosphere at an intermediate region of glass transition and crystallization temperatures $(T_g\;and\;T_x)$. Some parts of the Ni-layer in the interfaces of the consolidated particles disappeared, while some of them still remained without appreciable change in compositions. No cracks or fractures were found in the particles, which may occur at low temperatures below or near $T_g$ as anticipated by the FEM analysis. Crystallization and change in hardness were not observed after consolidation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.544-547
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• 1999

To develop the better insulants. the zeolite particle, which is aluminosilicate mineral, was filled In the DGEBA/MDA/SN epoxy resin system. Dynamic DSC curves of cured specimens with various contents of zeolite were observed and the glass transition temperature(T$_{g}$) was obtained. According to this result, we could carry out the experiment concerned with the dielectric breakdown strength around T$_{g}$ and find the limit temperature for the application of the DDEBA/MDA/SN system filled with natural zeolite. T$_{g}$ increased with the content of zeolite. As the temperature increased, the dielectric breakdown strength decreased rapidly, in the region of T$_{g}$. At the high temperature, the deterioration by electrical stress was activated. The diameter of puncture at the high temperature was larger 7han that at the room temperature.erature.