• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.5
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• pp.48-53
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• 1998

Poly-Si TFT's could be fabricated on glass substrates by metal induced lateral crystallization (MILC) method at 450.deg. C. Channel area of the poly-Si TFT's was laterally crystallized from source and drain areas, where a thn nickel film was deposited. Dopants activation for the formation of source and drain region could be achieved by thermal annealing at 450.deg. C after the ion mass doping of phosphorus. The field effect mobility of thus formed N-channel poly-Si TFT's was 76cm$^{2}$/Vs, and the on/off current ratio was higher than 7E6.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.914-917
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• 2001

Single-shot laser damage of thin Cr films on glass substrates has been studied to understand the cracking and peeling-off mechanism. A numerical model is developed for the calculation of transient heat transfer and thermal stresses in Cr films during excimer laser irradiation and cooling, the transient temperature, and the stress-strain fields are analyzed by using a three-dimensional finite-element model of heat flow. According to the numerical analysis for the experimentally determined cracking and peeling-off conditions, cracking is found to be the result of the tensile brittle fracture due to the excessive thermal stresses formed during the cooling process, while peeling-off is found to be the combined result of films bulging from the softened glass surface at higher temperature and the tensile brittle fracture during the cooling process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.250-250
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• 2010

We have prepared CIGS thin film absorber layers with simple solution spray deposition technique and thin film were synthesized with different atomic ratio. CIGS thin films were synthesized using non-vacuum solution deposition method on pre-heated sodalime glass substrates and Mo-coated soadlime glass substrate. In precursor solution were Cu : In : Ga: S ratio 4 : 3 : 2 : 8 and the crystal type of sprayed thin film were CIGS chalcopyrite structures. This structure was identified as typical chalcopyrite tetragonal structure with XRD analysis. This result showed that CIGS solution deposition technique has potential for the one step synthesis and low cost fabrication process for CIS or CIGS thin film absorber layer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.1053-1057
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• 1997

Laser thin film process with a Q-switch pulsed YAG laser was performed for micro machining. In this research, we performed basic Cr thin film on glass substrates removal machining experiments. Form experiments, it happens not only evaporration of thin film but also spatter and cohesion of melting substance in working region, when machining a Cr thin film by Q-switch YAG laser beam irradiation. Critical energy of surface irradiation type by irradiation direction of laser in a face composing thin film on the glass is higher than that of back irradiation type, but the latter is favorable because of spatter appearance. In case of image formation position when laser beam is irradiated, the defocus is permitted to a certain extent within forcus depth. Ifexceeds focus depth, formation of pattern is vanishing step by step.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.4 s.247
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• pp.350-357
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• 2006

A new valveless micropump for bi-directional application has been developed and tested. The micropump was fabricated on silicon and glass substrates by micromachining process. The micropump in this study consists of a membrane actuator, a pumping chamber, fluidic channels and two piezoelectric ceramic films. The channels and pumping chamber were etched on a glass wafer and the membrane was made on a silion wafer which is actuated by a piezoelectric ceramic (PZT) film. The geometry of the micropump was optimized by numerical analysis and the performance of the micropump was investigated by the experiments. The maximum flow rate was $323{\mu}L/min$ and the maximum back pressure was 294 Pa when the membrane actuator of $10{\times}10mm^2$ was driven at 130 Hz and 385 V.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.350.2-350.2
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• 2014

We investigated the structural and optical evolution of Ga2O3 thin films on glass substrates deposited using radio frequency magnetron sputtering. Initially, amorphous Ga2O3 thin film is grown, and then, surface humps and nanowire (NW) bundles are gradually formed as the film thickness increases. The surface humps are Ga-rich and provide nucleation sites for NWs through a self-catalytic vapor-liquid-solid mechanism with self-assembled Ga droplets. Both the surface humps and the NWs induce variation of the optical properties such as the optical bandgap and refractive index by absorbing light in the ultraviolet region.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.44-49
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• 1997

AIN thin films were deposited on silicon and glass substrates by sputtering Al target and introducing mixed gases of argon and nitrogen into reactive RF magnetron sputter. The substrate was not heated to protect the PC (polycarbonate) substrate and the micro-sized pregroove morphology on the surface of PC substrate. But its temperature was around $100^{\circ}C$ due to the self-heating by plasma. The crystallinity, cross-section morphology and refractive index were characterized by changing various deposition parameters.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.294-294
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• 2010

Over the last decade, dye-sensitized solar cell (DSSC) has attracted much attention due to the high solar-to-electricity conversion efficiency up to 10% as well as low cost compared with p-n junction photovoltaic devices. DSSC is composed of mesoporous TiO2 nanoparticle electrodes coated with photo-sensitized dye, the redox electrolyte and the metal counter electrode. The performances of DSSC are dependent on constituent materials and interface as well as device structure. Replacing the heavy glass substrate with plastic materials is crucial to enlarge DSSC applications for the competition with inorganic based thin film photovoltaic devices. One of the biggest problems with plastic substrates is their low-temperature tolerance, which makes sintering of the photoelectrode films impossible. Therefore, the most important step toward the low-temperature DSSC fabrication is how to enhance interparticle connection at the temperature lower than $150^{\circ}C$. In this talk, the key issues for high efficiency plastic solar cells will be discussed, and several strategies for the improvement of interconnection of nanoparticles and bendability will also be proposed.

• Bulletin of the Korean Chemical Society
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• v.33 no.1
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• pp.248-254
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• 2012

During the monolayer assembly of zeolite microcrystals using sonication with stacking (SS) method, the factors that govern the degree of close packing (DCP) between the microcrystals, the rate of attachment (rA) of microcrystals onto the substrate, the degree of coverage (DOC), and the binding strength (BS) between each crystal and the substrate were investigated for each mode of binding linkage (MBL). The tested MBLs were covalent linkage (CL), ionic linkage (IL), and polyelectrolyte-mediated ionic linkage (p-IL). Unlike the monolayers of zeolite crystals assembled on glass with a covalent linkage, the strong BS, very high DOC, and very high DCP do not decrease during monolayer assembly on glass through ionic linkages. This results indicate that the surface migration of crystals undergo linkage-nondestructively when crystals were attached to the substrates through ionic linkages.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.663-666
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• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$$.$4H$_2$O), as a precursor, using a focused Ar$\^$+/ laser beam ($\lambda$= 514 nm) on PCB boards and glass substrates. The linewidth and thickness of the lines were investigated as a function of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler (${\alpha}$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameter using probe station and semiconductor analyzer. we compared resistivities of the patterned lines with that of the Cu bulk, respectively.