• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.158-158
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• 2016

최근 화석연료의 고갈과 환경 보전 및 에너지 절약에 대한 관심이 높아짐에 따라 화석연료의 소비를 최소화하고 실내조건을 쾌적하게 유지하려는 연구가 진행되고 있다. 국내의 경우 전체 에너지 소비의 30%이상을 차지하고 있는 건물부문에서의 에너지 소비를 줄이기 위한 활발한 연구가 진행되고 있으며 이에 따른 에너지절약 소재개발이 활발하게 진행되고 있다. 1975년 이후 여러 차례에 걸친 단열강화 조치를 통해 건물에서의 에너지 소모를 줄이고 있었으나 건물의 외벽에 대한 사항으로 한정되어있었고, 또한 건물의 창 면적이 증가함에 따라 창을 통한 열손실량과 열획득량이 더욱 증가하게 되었다. 이러한 문제를 해결하기 위해 열반사유리에 대한 많은 연구가 진행되고 있다. 열반사유리는 근적외선(열선)영역의 빛을 반사시켜 실내의 열손실량 및 외부에서의 열획득량을 감소시켜 에너지의 소비를 줄일 수 있는 유리을 말한다. 이러한 열반사유리은 fresnel 방정식을 통해 빛의 파장대에 따른 반사율 및 투과도를 예측할 수 있는데, 다층박막구조인 Oxide-Metal-Oxide(OMO)구조는 Oxide의 높은 굴절률과 Metal의 낮은 굴절률을 통해 가시광영역대의 높은 투과도와 근적외선 영역의 높은 반사율을 얻을 수 있다. 또한 Metal층을 삽입함으로서 flexible한 코팅이 가능하고, 높은 carrier density와 mobility로 표면 플라즈몬 공명을 통해 특정 파장대의 반사율을 높일 수 있으므로 많은 연구가 진행되고 있다. $TiO_2$는 고굴절률 및 낮은 광흡수성의 특성을 가지는 산화물반도체로 기존의 $In_2O_3$계 산화물에 비해 값이 싸고 높은 안정성과 광촉매특성을 보이므로 외부에 노출된 환경에 적합한 재료이다. Ag는 저굴절률과 낮은 광흡수성을 가지는 재료로 금속층에 적합하다. 본 연구에서는 fresnel 방정식을 통해 반사도 및 투과도를 예측하고 마그네트론 스퍼터링법으로 다층박막을 열선인 적외선 영역에서의 반사율 및 반사 효율을 평가하였다. Index-matching 시뮬레이션을 통해 $TiO_2/Ag/TiO_2$ 다층박막의 투과도와 반사도를 이론적으로 검토하였다. 시뮬레이션 프로그램은 Macleod프로그램을 이용하였고 재료 각각의 굴절률은 Ellipsometry를 이용하여 측정하였다. 두께 40 nm 와 8 ~ 16 nm를 가지는 $TiO_2$층과 Ag층을 각각 RF/DC 마그네트론 스퍼터링법을 이용하여 Glass기판 위에 증착하였다. 직경 3 in 의 $TiO_2$, Ag 소결체 타깃을 이용하였고 스퍼터링 파워는 각각 200 W, 50 W로 설정하였고, 스퍼터링 가스는 Ar가스의 유량을 20 sccm으로 설정하였다. 작업압력은 모두 1 Pa로 설정하였고 타깃 표면의 불순물 및 이물질 제거를 위해 Pre-sputtering을 10분 진행하였다. 박막의 두께는 reflectometer와 Alphastep을 이용하여 측정하였고 Hall effect measurement를 이용하여 비저항, carrier density, mobility등 전기적 특성을 측정하였다. 또한 UV-VIS spectrometer와 USPM-RU-W NIR Micro-Spectrophotometer를 통해 광학적 특성을 측정하였고 계산 값과 비교분석하였다. 또한 열반사 특성을 평가하기 위해 직접 set-up한 장비를 이용하였다. 단열 박스에 샘플을 장착해 적외선 램프를 조사하였을 때의 열 반사효율을 평가하였고, IR Camera를 이용하여 단열 박스 내부의 온도 변화를 관찰하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.8
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• pp.17-27
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• 2000

This paper presents deposition and characterization of hydrogenated microcrystalline silicon (${\mu}c$ -Si:H) films on low cost glass substrate by Hot Wire CVD(HWCVD). The HWCVD ${\mu}c$ -Si:H films had deposition rates ranging from 2${\AA}$/sec to 35${\AA}$/sec with the variations of preparation conditions, which was 10 times higher than that of the films obtained from the conventional PECVD method. From the Raman spectroscopy, the prepared silicon films were found to be composed of the mixture of crystalline and amorphous phases. The crystalline volume fraction and average crystallite size, obtained from the Raman To mode peak near 520cm$^{-1}$, were 37-63% and 6-10 nm, respectively. The conductivity activation energy($E_a$) of the ${\mu}c$ -Si:H films, representing the difference of conduction band and Fermi level in an intrinsic semiconductors, increased from 0.22eV to 0.68eV with increasing pressure from 30mTorr to 300mTorr. The increase of $E_a$ with pressure indicates that the deposited films have properties close to intrinsic semiconductors, which is also proved with low dark conductivity of the ${\mu}c$ -Si:H deposited at 300mTorr. The tungsten concentration incorporated into films was about $6{\times}10^{16}atoms/cm^3$ in the samples prepared at wire temperature of 1800$^{\circ}C$.

• Journal of the Korean Recycled Construction Resources Institute
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• v.7 no.3
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• pp.49-55
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• 2012

In this paper, the physical properties of lightweight aggregate such as density and water absorption according to addition ratio and type of flux were investigated. When using $Na_2CO_3$ as flux of lightweight aggregate, burnability was available at low burning temperature and water absorption increased. And as increasing addition ratio of $CaCO_3$, NaOH, $Fe_2O_3$, absorption decreased and $CaCO_3$, NaOH, $Fe_2O_3$ were considered improper to use flux of lightweight aggregate because of high dried density. $Na_2SO_4$ was proper to use flux of lightweight aggregate due to dried density $1.35{\sim}1.50g/cm^3$ and lower absorption. When using glass abrasive sludge as flux of lightweight aggregate, dried density and water absorption were in the range of $1.45{\sim}1.55g/cm^3$ and 9~12% respectively. It was indicated that as increasing addition ratio of blast furnace slag powder, density increased whereas absorption decreased. In use of oxidizing slag as flux, artificial lightweight aggregate which have dried density $1.46g/cm^3$, water absorption 8,5 % can be manufactured at 10 % of addition ratio.

• Advanced Composite Materials
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• v.17 no.1
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• pp.25-40
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• 2008

The research and development in soundproof materials for preventing noise have attracted great attention due to their social impact. Noise insulation materials are especially important in the field of soundproofing. Since the insulation ability of most materials follows a mass rule, the heavy weight materials like concrete, lead and steel board are mainly used in the current noise insulation materials. To overcome some weak points in these materials, fiber reinforced composite materials with lightweight and other high performance characteristics are now being used. In this paper, innovative insulation sheet materials with carbon and/or glass fabrics and nano-silica hybrid PU resin are developed. The parameters related to sound performance, such as materials and fabric texture in base fabric, hybrid method of resin, size of silica particle and so on, are investigated. At the same time, the wave analysis code (PZFlex) is used to simulate some of experimental results. As a result, it is found that both bundle density and fabric texture in the base fabrics play an important role on the soundproof performance. Compared with the effect of base fabrics, the transmission loss in sheet materials increased more than 10 dB even though the thickness of the sample was only about 0.7 mm. The results show different values of transmission loss factor when the diameters of silica particles in coating materials changed. It is understood that the effect of the soundproof performance is different due to the change of hybrid method and the size of silica particles. Fillers occupying appropriate positions and with optimum size may achieve a better effect in soundproof performance. The effect of the particle content on the soundproof performance is confirmed, but there is a limit for the addition of the fillers. The optimization of silica content for the improvement of the sound insulation effect is important. It is observed that nano-particles will have better effect on the high soundproof performance. The sound insulation effect has been understood through a comparison between the experimental and analytical results. It is confirmed that the time-domain finite wave analysis (PZFlex) is effective for the prediction and design of soundproof performance materials. Both experimental and analytical results indicate that the developed materials have advantages in lightweight, flexibility, other mechanical properties and excellent soundproof performance.

• Composites Research
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• v.33 no.4
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• pp.228-233
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• 2020

In this paper, a single lap shear test was performed using a glass fiber reinforced composite material (GFRC). Pencil lead drawn paper sensor (PLDPS) was applied for single lap shear test being performed. Bisphenol-A epoxy and amine hardener were used as adhesives combining with composite materials. To make a difference in adhesive properties, the adhesive was cured under different conditions. PLDPS was made of a 4B pencil on A4 paper. Because graphite in a pencil was an electrically conductive substance, electric resistance (ER) could be measured. A change in ER was observed by a position where a PLDPS was attached to single lap shear specimens. It was confirmed that the change in ER was different depending on two attached positions and was observed by lap shear strain as well. In case the lap shear strain was large, the change in ER of PLDPS was high. This was because the larger the extension of the adhesive part, the larger the degree of bending of the specimen and thus the larger the distance change between two electrodes.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.5
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• pp.227-231
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• 2010

Super hydrophilic $TiO_2$ thin films with photocatalytic property were successfully fabricated on a glass substrate by liquid phase deposition (LPD). The $TiO_2$ thin film formed nano particles on a surface at $70^{\circ}C$. As an immersion time in $TiF_4$ solution increased, the thickness of thin films gradually increased. $TiO_2$ thin film showed a water contact angel of below ca. $5^{\circ}$ and the transmittance of ca. 75~90 % in visible range. In addition, $TiO_2$ thin film showed the photocatalytic property to decompose methyl orange solution by the illumination of UV light. The surface morphologies, optical properties and contact angel of prepared thin films with a different immersion time were measured by field emission scanning electron microscope (FE-SEM), atomic force microscope (AFM), UV-Vis spectrophotometer and contact angle meter.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.49-55
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• 2016

In this study, we designed an environment friendly, water-based adhesive using the acrylic emulsion method as a replacement for solvent-based adhesives, which are most commonly used in layered laminates for flexible food packaging. We designed adhesives with different combinations of anionic, non-ionic, and phosphoric ester surfactants, and with different concentrations of chain transfer agent (CTA). We also examined the effect of the degree of cross-linking by synthesizing and comparing 8 test group adhesives with different types of functional monomers. Additionally, we synthesized 2 other test group pressure-sensitive adhesives (PSA) using styrene/alpha-methyl styrene/acrylic acid (SAA) semipolymer dispersing agents (with molecular weights of 13,000 g/mol and 8,600 g/mol, respectively) to replace the conventional surfactants. We evaluated whether the 10 test group pressure-sensitive adhesives met the basic physical property criteria required for flexible food packaging by carrying out a physical analysis of their glass transition temperature (Tg), particle size, adhesion, and molecular weight. In our test, 2 test group adhesives manufactured with the combination of anionic and non-ionic surfactants, CTA concentration of 0.2%, and functional monomers of hydroxyethyl acrylate (HEA) and glycidyl methacrylate (GMA) demonstrated molecular weight and flexibility suitable for flexible packaging, with low adhesiveness and small particle size.

• Korean Journal of Food Science and Technology
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• v.37 no.4
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• pp.567-573
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• 2005

Compatability of films made of chitosan, gelatin, and their blends prepared by aqueous solution casting was investigated using a thermogravimetric analyzer(TGA) and a dynamic mechanical analyzer (DMA). TGA showed gelatin is more thermally stable than chitosan, and thermal stability of chitosan in blends was higher than that of pure chitosan due to interaction among functional groups of component polymers in blend. Glass transition temperature $(T_g)$ of blends was dependent on chitosan content of blends. Blend films exhibited good miscibility. Moisture and glycerol contents of blend strongly affected thermal properties of two component polymers.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.178-184
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• 2001

Transparent and highly oriented KLN thin films have been grown by an rf- magnetron sputtering deposition method. A homogeneous and stable KLN target was prepared by calcine and sintering process. For KLN target, stoichiometry and composition excess with K of 30% and 60%, and Li of 15% and 30% respectively, was prepared. The targets were sintered at low temperature to prevent vaporization of K and Li. KLN thin films were fabricated by rf-magnetron sputtering method using those targets. In this experiment, using the target of composition excessed with K of 60% and Li of 30%, single phase KLN thin film was produced. KLN thin film has excellent crystallinity and highly c-axis oriented on Corning 1737 substrate. Transmittance of thin film in visible range was 90%, absorption edge is 333 nm and refractive index at 632.8 nm was 1.93.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.39-43
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• 2009

In this paper, the flow characteristics of underfill material driven by capillary action between flip-chip and substrate were investigated. Also, the effects of viscosity level and dispensing point of underfill on flow characteristics were investigated. Flip chip package size was $5mm{\times}5mm{\times}0.65^tmm$, the diameter of solder bump was 100 ${\mu}m$, and the pitch was 150 ${\mu}m$. It was full grid area-array type with 1024 I/Os. The glass substrate was used and the gap between the chip and substrate was 50 ${\mu}m$. For the experimental study, three different underfills with different viscous properties($2000{\sim}3700$ cps), and two different types of dispensing methods(center dot and edge dot) were used. The flow characteristics and filling time of underfill were investigated by using CCD camera. The results show that the edge flow was faster than center flow due to the edge effect, which was caused by the resistance of solder bumps. In case of edge dot dispensing type, the filling time was faster due to the large edge effect, compared to center dot dispensing type. Also, it was found that the underfill flow was faster and the filling time decreased as the viscosity level of underfill was decreased.