• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.230-233
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• 2001

FeSi2/Si Layer were grown using FeSi2, Si wafer by the chemical transport reactio nmethod. The directoptical energy gap was found to be 0.871eV at 300 K. The Hall effect is a physical effect arising in matter carrying electric current inthe presence of a magnetic field. The effect is named after the American physicist E. H. Hall, who discovered it in 1879. IN this paper, we study electrical properties of FeSi2/Si layer. And then we measured Hall coefficient Hall mobility, carrier density and Hall voltage according to variation magnetic field and temperature, Because of important part for it applicationVarious phase of silicide is formed at the metal-Si interface when transition metal contacts to Si. Silicides belong to metallic or semiconducting according to their electrical and optical properties. Metallic silicides are used as gate electrodes or interconnections in VLSI devices. Semiconducting silicides can be used as a new material for IR detectors because of their narrow energy band gap.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.234-237
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• 2001

FeSi2/Si Layer were grown using FeSi2, Si wafer by the chemical transport reactio nmethod. The directoptical energy gap was found to be 0.871eV at 300 K. The Hall effect is a physical effect arising in matter carrying electric current inthe presence of a magnetic field. The effect is named after the American physicist E. H. Hall, who discovered it in 1879. IN this paper, we study electrical properties of FeSi2/Si layer. And then we measured Hall coefficient Hall mobility,carrier density and Hall voltage according to variation magnetic field and temperature, Because of important part for it applicationVarious phase of silicide is formed at the metal-Si interface when transition metal contacts to Si. Silicides belong to metallic or semiconducting according to their electrical and optical properties. Metallic silicides are used as gate electrodes or interconnections in VLSI devices. Semiconducting silicides can be used as a new material for IR detectors because of their narrow energy band gap.

• Journal of Power Electronics
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• v.8 no.4
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• pp.363-370
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• 2008

In this paper, three kinds of PWM strategies for a three-phase current-fed dc/dc converter are proposed and compared in terms of losses and voltage transfer ratio. Each PWM strategy is described graphically and their switching losses are analyzed. With the proposed PWM C strategy, one turn-off switching of each bridge switch is eliminated to reduce switching losses under the same switching frequency. In addition, RMS current through the bridge switches is lowered by using parallel connection between two bridge switches and thus, conduction losses of the switches are reduced. Further, copper losses of the transformer are decreased due to the reduced RMS current of each transformer's winding. Therefore, total losses are minimized and the efficiency of the converter is improved by using the proposed PWM C strategy. Digital signal processor (DSP: TI320LF2407) and a field-programmable gate array (FPGA: EPM7128) board are used to generate PWM patterns for three-phase bridge and clamp MOSFETs. A 500W prototype converter is built and its experimental results verify the validity of the proposed PWM strategies.

• Journal of Power Electronics
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• v.11 no.4
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• pp.542-550
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• 2011

This paper describes the design and hardware implementation of a Single Input Fuzzy Logic Controller (SIFLC) to regulate the output voltage of a boost power converter. The proposed controller is derived from the signed distance method, which reduces a multi-input conventional Fuzzy Logic Controller (CFLC) to a single input FLC. This allows the rule table to be approximated to a one-dimensional piecewise linear control surface. A MATLAB simulation demonstrated that the performance of a boost converter is identical when subjected to the SIFLC or a CFLC. However, the SIFLC requires nearly an order of magnitude less time to execute its algorithm. Therefore the former can replace the latter with no significant degradation in performance. To validate the feasibility of the SIFLC, a 50W boost converter prototype is built. The SIFLC algorithm is implemented using an Altera FPGA. It was found that the SIFLC with asymmetrical membership functions exhibits an excellent response to load and input reference changes.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.595-596
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• 2006

The flexible organic thin film transistor (OTFT) array to use as a switching device for an organic light emitting diode (OLED) was designed and fabricated in the microcontact printing and low-temperature processes. The gate, source, and drain electrode patterns of OTFT were fabricated by microcontact printing which is high-resolution lithography technology using polydimethylsiloxane(PDMS) stamp. The OTFT array with dielectric layer and organic active semiconductor layers formed at room temperature or at a temperature tower than $40^{\circ}C$. The microcontact printing process using SAM(self-assembled monolayer) and PDMS stamp made it possible to fabricate OTFT arrays with channel lengths down to even nano size, and reduced the procedure by 10 steps compared with photolithography. Since the process was done in low temperature, there was no pattern transformation and bending problem appeared. It was possible to increase close packing of molecules by SAM, to improve electric field mobility, to decrease contact resistance, and to reduce threshold voltage by using a big dielecric.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.4
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• pp.92-102
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• 2003

To detect electrical faults of a TFT (Thin Film Transistor) panel for the LCD (Liquid Crystal Display), techniques of converting electric field to an image are used One of them is the PDLC (polymer-dispersed liquid crystal) modulator which changes light transmittance under electric field. The advantage of PDLC modulator in the electric field detection is that it can be used without physically contacting the TFT panel surface. Specific pattern signals are applied to the data and gate electrodes of the panel to charge the pixel electrodes and the image sensor detects the change of transmittance of PDLC positioned in proximity distance above the pixel electrodes. The image represents the status of electric field reflected on the PDLC so that the characteristic of the PDLC itself plays an important role to accurately quantify the defects of TFT panel. In this paper, the image of the PDLC modulator caused by the change of electric field of the pixel electrodes on the TFT panel is acquired and how the characteristics of PDLC reflect the change of electric field to the image is analyzed. When the holding time of PDLC is short, better contrast of electric field image can be obtained by changing the instance of applying the driving voltage to the PDLC.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.121-121
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• 2011

Graphene formed by chemical vapor deposition was exposed to the various plasmas of Ar, O2, N2, and H2 to examine its effects on the bonding properties of graphene to metal. Upon the Ar plasma exposure of patterned graphene, the subsequently deposited metal electrodes remained intact, enabling successful fabrication of field effect transistor (FET) arrays. The effects of enhancing adhesion between graphene and metals were more evident from O2 plasmas than Ar, N2, and H2 plasmas, suggesting that chemical reaction of O radicals induces hydrophilic property of graphene more effectively than chemical reaction of H and N radicals and physical bombardment of Ar ions. From the electrical measurements (drain current vs. gate voltage) of field effect transistors before and after Ar plasma exposure, it was confirmed that the plasma treatment is very effective in controlling bonding properties of graphene to metals accurately without requiring buffer layers.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.51-51
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• 2011

We have grown nanocrystalline graphite on sapphire substrate by using solid carbon source molecular beam epitaxy. Changes of structure from amorphous carbon to nanocrystalline graphite controlled by the growth temperature have been investigated by Raman spectroscopy. Raman spectra show D, G, and 2D peaks, whose intensities vary on the growth temperature. Atomic force microscopy reveals that the surface is very flat. Sapphire substrates of different cutting direction produce similar results. Simulations suggest that the interaction between carbon and oxygen causes disorders. Electrical transport measurements exhibit a Dirac-like peak, including a carrier type change by an external gate voltage bias.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.41-41
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• 2011

Flash memory에서 tunnel oxide film은 electron tunnelling 현상을 이용하여 gate에 전하를 전달하는 통로로 사용되고 있다. 특히, tunnel oxide film 내부의 charge trap 현상과 불순물이 소자 특성에 직접적인 영향을 주고 있어, 후속 N2O/NO 열처리 공정에서 SiO2/Si 계면에 nitrogen을 주입하여 tunnel oxide film 특성을 개선하고 있다. 따라서 N2O/NO 열처리 공정 최적화를 위해서는 tunnel oxide film 내 N 농도와 분포에 대한 정확한 평가가 필수적이다[1]. 본 실험에서는 low energy magnetic SIMS를 이용하여 N2O로 열처리된 tunnel oxide film 내의 N농도를 보다 정확하게 평가하고자 하였다. 사용된 시료는 Si substrate에 oxidation 이후 N2O 열처리를 진행하여 tunnel oxide를 형성시켰으며, 분석 impact energy는 surface effect최소화와 최상의 depth resolution 확보를 위해 250eV를 사용하였으며, matrix effect와 mass interference를 방지하기 위해 MCs+ cluster mode[2]로 CsN signal를 검출하였다. 실험 결과, 특정 primary beam 입사각도에서 nitrogen depth resolution 저하 현상이 발생하였고, SIMS crater 표면이 매우 거칠게 나타났다. 이에, Depth resolution 저하 현상을 개선하기 위해 극한의 glancing 입사각 조건으로 secondary extraction voltage 변화를 통해 depth resolution이 개선되는 최적의 impact energy와 primary beam 입사각 조건을 확보하였다. 그 결과 nitrogen의 depth resolution은 1.6nm의 depth resolution을 확보하였으며, 보다 정확한 N 농도와 분포를 평가할 수 있게 되었다.

• ETRI Journal
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• v.19 no.4
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• pp.402-413
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• 1997

A CMOS device which has an extended heavily-doped amorphous silicon source/drain layer on the field oxide and an amorphous silicon local interconnection (ASLI) layer in the self-aligned source/drain region has been studied. The ASLI layer has some important roles of the local interconnections from the extended source/drain to the bulk source/drain and the path of the dopant diffusion sources to the bulk. The junction depth and the area of the source/drain can be controlled easily by the ASLI layer thickness. The device in this paper not only has very small area of source/drain junctions, but has very shallow junction depths than those of the conventional CMOS device. An operating speed, however, is enhanced significantly compared with the conventional ones, because the junction capacitance of the source/drain is reduced remarkably due to the very small area of source/drain junctions. For a 71-stage unloaded CMOS ring oscillator, 128 ps/gate has been obtained at power supply voltage of 3.3V. Utilizing this proposed structure, a buried channel PMOS device for the deep submicron regime, known to be difficult to implement, can be fabricated easily.