• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1998.10a
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• pp.160-165
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• 1998

A theoretical analysis has been undertaken to show the influence of bearing geometry on the steady state characteristics of air lubricated spherical tilting pad bearings. The geometry variations considered are the number of pads, the eccentricity ratio, the direction of load, and the preloading.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.8
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• pp.717-724
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• 2013

The present study provides the numerical results in association with caliper stiffness and friction curve. From the numerical results, it is concluded that the pad vibration modes with dominant displacement in rotation direction is sensitive in the flutter instability. Particularly, the pad rigid mode is shown to become the squeal mode when the caliper stiffness is introduced in brake squeal model. Therefore, the caliper contact stiffness between the pad and caliper is expected to contribute to the squeal modes of the brake pad.

• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.15-20
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• 2004

Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.231-234
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• 2004

Chemical mechanical polishing(CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with the slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various coefficient of friction was attained and analyzed with the kind of pad, abrasive and the abrasive concentration. The lubrication regime is also classified with ${\eta}v/p(\eta,\;v\;and\;p;$ the viscosity, relative velocity and pressure). Especially, the co-relation not only between the friction force and the removal per unit distance but also between the coefficient of friction and within-wafer-nonuniformity was estimated.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.3
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• pp.102-109
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• 2005

Wheel-slip control systems are able to control the braking force more accurately and can be adapted to different vehicles more easily than conventional ABS systems. But, in order to achieve the superior braking performance through the wheel-slip control, real-time information such as the tire braking force is required. For example, in the case of EHB (Electro-Hydraulic Brake) systems, the tire braking force cannot be measured directly, but can be approximated based on the characteristics of the brake disk-pad friction. The friction characteristics can change significantly depending on aging of the brake, moisture on the contact area, heat etc. In this paper, a wheel slip The proposed wheel slip control system is composed of two subsystems: braking force monitor and robust slip controller In the brake force monitor subsystem, the tire braking forces as well as the brake disk-pad friction coefficient are estimated considering the friction variation between the brake pad and disk. The robust wheel slip control subsystem is designed based on sliding mode control methods and follows the target wheel-slip using the estimated tire braking forces. The proposed sliding mode controller is robust to the uncertainties in estimating the braking force and brake disk-pad friction. The performance of the proposed wheel-slip control system is evaluated in various simulations.

• Tribology and Lubricants
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• v.33 no.2
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• pp.71-78
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• 2017

The drag torque in the wet clutch system of a dual clutch transmission system is investigated because it is relatively high, up to 10 of the total output torque of the engine, even when the clutch is in the disengagement state with zero torque transfer. Drag torque results from the shear resistance of the DCTF between the friction pad and separator plate. To reduce the drag torque for ensuring fuel economy, the groove pattern of the wet clutch friction pad is designed to have a high flow rate through the pattern groove. In this study, four types of groove patterns on the friction pad are designed. The volume fraction of the DCTF (VOF) and hydrodynamic pressure developments in the gap between the friction pad and separator plate are computed to correlate with the computation of the drag torque. From the computational results, it is found that a high VOF and hydrodynamics increase the drag torque resulting from the shear resistance of the DCTF. Therefore, a patterned groove design should be used for increasing the flow rate to have more air parts in the gap to reduce the drag torque. In this study, ANSYS FLUENT is used to solve the flow analysis.

• Tribology and Lubricants
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• v.27 no.5
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• pp.269-274
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• 2011

The purpose of this paper is to study and analyze the improvement method for the failure examples including the vehicle brake system in actual field. It was verified that the indicator plate of pad wear scratched the brake disk because of wearing after displacement of non- identification parts pad. The caliper of other vehicle was installed with brake system verified the phenomenon produced groove in center point because of one side wear when the pad was not fully contacted with the rub disk by other action surface pressure and pad action condition. It verified that the crack phenomenon fatigue was produced by brake thermal deformation because of decreasing the thickness by grinding to modify the non-uniformed wear of brake disk. It verified that the friction sound was produced by the friction phenomenon because of non-uniformed contact of lining and an alien substance with inner of the drum and lining braking by crack phenomenon with brake drum surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.939-942
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• 1997

In chemical mechanical polishing(CMP) there are many factors affecting the results. Temperature is one of the factors and it affects the removal rate. That is, the higher it arise, the more the material is removed. But the detailed temperature behavior is not discovered. In this study, we discover the distribution of temperature across the pad where the wafer has just been polished. And then we reveal the cause of the result in connection with the mechanical structure. In addition, we also discover the relationship of the friction force and normal force. With the result of two forces, we get the friction coefficient and obtain the contact model of the wafer and pad.

• Journal of the Korean Society for Railway
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• v.9 no.6 s.37
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• pp.677-681
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• 2006

In general, the braking system of high speed train has an important role for the safety of the train. To stop the train safely at its pre-decided position, it is necessary to combine the various brakes properly. The Korean high speed train (HSR-350x) has adopted a combined electrical and mechanical (friction) braking system. In this study, the measuring method that can obtain the disc braking forces and friction coefficient between disc and pad during on-line test of HSR-350x has been suggested and verified through the comparison of the results obtained from this method and those of the results of the dynamo-tests.

• Tribology and Lubricants
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• v.34 no.3
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.