• Steel and Composite Structures
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• 제27권6호
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• pp.761-775
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• 2018

In the present work, the recently developed non-polynomial shear deformation theories are assessed for thermo-mechanical response characteristics of laminated composite plates. The applicability and accuracy of these theories for static, buckling and free vibration responses were ascertained in the recent past by several authors. However, the assessment of these theories for thermo-mechanical analysis of the laminated composite structures is still to be ascertained. The response characteristics are investigated in linear and non-linear thermal gradient and also in the presence and absence of mechanical transverse loads. The laminated composite plates are modelled using recently developed six shear deformation theories involving different shear strain functions. The principle of virtual work is used to develop the governing system of equations. The Navier type closed form solution is adopted to yield the exact solution of the developed equation for simply supported cross ply laminated plates. The thermo-mechanical response characteristics due to these six different theories are obtained and compared with the existing results.

• Steel and Composite Structures
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• 제18권2호
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• pp.443-465
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• 2015

In this paper, an efficient and simple trigonometric shear deformation theory is presented for thermal buckling analysis of functionally graded plates. It is assumed that the plate is in contact with elastic foundation during deformation. The theory accounts for sinusoidal distribution of transverse shear stress, and satisfies the free transverse shear stress conditions on the top and bottom surfaces of the plate without using shear correction factor. Unlike the conventional trigonometric shear deformation theory, the proposed sinusoidal shear deformation theory contains only four unknowns. It is assumed that the mechanical and thermal non-homogeneous properties of functionally graded plate vary smoothly by distribution of power law across the plate thickness. Using the non-linear strain-displacement relations, the equilibrium and stability equations of plates made of functionally graded materials are derived. The boundary conditions for the plate are assumed to be simply supported on all edges. The elastic foundation is modelled by two-parameters Pasternak model, which is obtained by adding a shear layer to the Winkler model. The effects of thermal loading types and variations of power of functionally graded material, aspect ratio, and thickness ratio on the critical buckling temperature of functionally graded plates are investigated and discussed.

• Steel and Composite Structures
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• 제42권6호
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• pp.805-826
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• 2022

The free and live load-forced vibration behaviour of porous functionally graded (PFG) higher order nanobeams in the thermal and magnetic fields is investigated comprehensively through this work in the framework of nonlocal strain gradient theory (NLSGT). The porosity effects on the dynamic behaviour of FG nanobeams is investigated using four different porosity distribution models. These models are exploited; uniform, symmetrical, condensed upward, and condensed downward distributions. The material characteristics gradation in the thickness direction is estimated using the power-law. The magnetic field effect is incorporated using Maxwell's equations. The third order shear deformation beam theory is adopted to incorporate the shear deformation effect. The Hamilton principle is adopted to derive the coupled thermomagnetic dynamic equations of motion of the whole system and the associated boundary conditions. Navier method is used to derive the analytical solution of the governing equations. The developed methodology is verified and compared with the available results in the literature and good agreement is observed. Parametric studies are conducted to show effects of porosity parameter; porosity distribution, temperature rise, magnetic field intensity, material gradation index, non-classical parameters, and the applied moving load velocity on the vibration behavior of nanobeams. It has been showed that all the analyzed conditions have significant effects on the dynamic behavior of the nanobeams. Additionally, it has been observed that the negative effects of moving load, porosity and thermal load on the nanobeam dynamics can be reduced by the effect of the force induced from the directed magnetic field or can be kept within certain desired design limits by controlling the intensity of the magnetic field.

• 한국지반공학회논문집
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• 제35권7호
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• pp.41-50
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• 2019

국내 고준위폐기물처분장 공학적방벽(EBS)의 일부가 되는 완충재로 경주 벤토나이트가 우선적으로 고려되고 있다. 압축벤토나이트는 지하수침투로 인한 팽윤압과 처분용기에서 발산되는 열응력을 경험한다. 따라서 EBS의 성능평가를 위해서 역학적 물성의 산정이 중요하다. 본 논문은 탄성파를 이용하여 경주 압축벤토나이트의 변형특성 측정을 목표로 하였다. 두 개의 $1.59g/cm^3$와 $1.75g/cm^3$의 건조밀도를 가지는 압축벤토나이트 시편을 제작하였고, 자유단-자유단 공진주시험을 수행하여 구속압축파속도와 비구속압축파속도를 측정하였다. 측정된 압축파속도를 이용하여 미소변형에서의 탄성계수($E_{max}$), 구속탄성계수($M_{max}$), 감쇠비($D_{min}$), 포아송비를 측정하였다. 그 결과로 경주 압축벤토나이트의 변형특성을 산정 제시하여 선행연구 결과들과 비교 분석하였다.

• Composites Research
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• 제16권3호
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• pp.25-31
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• 2003

본 연구에서는 화학적 표면처리에 따른 탄화규소(SiC)의 표면특성 변화가 탄소섬유강화 에폭시 복합재료의 열안정성 및 기계적 계면물성에 미치는 영향을 조사하였다. 표면처리된 탄화규소의 표면특성은 산ㆍ염기도와 접촉각 측정을 통하여 알아보았으며, 열안정성은 TGA를 이용하여 조사하였다. 제조한 복합재료의 기계적 계면물성은 ILSS와 임계세기인자($\textrm{K}_{IC}$), 그리고 critical strain energy release rate($\textrm{G}_{IC}$)를 통하여 고찰하였다. 실험 결과 산 처리된 SiC(A-SiC)는 미처리된 SiC(V-SiC)나 염기처리된 SiC(B-SiC)에 비하여 산도가 증가하였다. 접촉각 측정 결과, 화학적 표면처리는 극성요소의 증가에 기인하는 SiC의 표면자유에너지를 증가시켰다. 이와 같은 물성들은 양극산화로 향상되어졌는데, 이는 좋은 젖음성이 최종 복합재료의 섬유와 매트릭스 사이의 계면결합력을 증가시키는데 중요한 역할을 하기 때문인 것으로 사료된다.

• Journal of Microbiology and Biotechnology
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• 제25권11호
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• pp.1856-1862
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• 2015

In order to improve the stability of endoglucanase under thermal and acidic conditions, the endoglucanase gene was fused to the N-terminus of the Saccharomyces cerevisiae pir gene, encoding the cell wall protein PIR. The fusion gene was transformed into Pichia pastoris GS115 for expression. A resulting strain with high expression and high activity was identified by examining resistance to Geneticin 418, Congo red staining, and quantitative analysis of enzyme activity. SDS-PAGE analysis revealed that the endoglucanase was successfully displayed on the yeast cell surface. The displayed endoglucanase (DEG) showed maximum activity towards sodium carboxyl methyl cellulose at approximately 275 IU/g cell dry weight. DEG exhibited greater than 60% residual activity in the pH range 2.5-8.5, higher than free endoglucanase (FEG), which had 40% residual activity at the same pH range. The highest tolerated temperature for DEG was 70℃, much higher than that of FEG, which was approximately 50℃. Moreover, DEG showed 91.1% activity at 65℃ for 120 min, while FEG only kept 77.8% residual activity over the same period. The half-life of DEG was 270 min at 65℃, compared with only 150 min for FEG. DEG could be used repeatedly at least three times. These results suggest that the DEG has broad applications as a yeast whole-cell biocatalyst, due to its novel properties of high catalytic efficiency, acid-thermal stabilities, and reusability.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.414-414
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• 2008

Vertically well-aligned Ga-doped ZnO nanorods with different Ga contents were grown by thermal evaporation on a ZnO template. The Ga-doped ZnO nanorods synthesized with 50 wt % Ga with respect to the Zn content showed maximum compressive stress relative to the ZnO template, which led to a rapid growth rate along the c-axis due to the rapid release of stored strain energy. A further increase in the Ga content improved the conductivity of the nanorods due to the substitutional incorporation of Ga atoms in the Zn sites based on a decrease in lattice spacing. The p-n diode structure with Ga-doped ZnO nanorods, as a n-type, displayed a distinct white light luminescence from the side-view of the device, showing weak ultraviolet and various deep-level emissions.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Computers and Concrete
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• 제23권5호
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• pp.321-327
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• 2019

Experimental isotherm compressive tests show that concrete behaviour is dependent on temperature. The aim of such tests is to reproduce how concrete will behave under environmental changes within a moderate range of temperature. In this paper, a novel constitutive elastic damage behaviour law is proposed based on a free energy with an apparent damage depending on temperature. The proposed constitutive behaviour leads to classical theory of thermo-elasticity at small strains. Fixed elastic mechanical characteristics and fixed evolution law of damage independent of temperature and the material volume element size are considered. This approach is applied to compressive tests. The model predicts compressive strength and secant modulus of elasticity decrease as temperature increases. A power scaling law is assumed for specific entropy as function of the specimen size which leads to a volume size effect on the stress-strain compressive behaviour. The proposed model reproduces theoretical and experimental results from literature for tempertaures ranging between $20^{\circ}C$ and $70^{\circ}C$. The effect of the difference in the coefficient of thermal expansion between the mortar and coarse aggregates is also considered which gives a better agreement with FIB recommendations. It is shown that this effect is of a second order in the considered moderate range of temperature.