• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.16-22
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• 1994

In this paper, transmitter and receiver modules for free space optical interconnection are implemented and characterized. In the transmitter module, bias circuitry which inject current into the direct modulated laser diode is fabricated and in the receiver module, p-i-n diode is integrated with an MMIC amplifying stage. Laser diode has a direct-modulated bandwidth of 2 GHz at 1.4 Ith bias while p-i-n diode and amplifying stage has a bandwidth of 1.3 GHz and 1.5 GHz, repectively. Optical interconnection has a bandwidth of 1.3 GHz and linearly transmit modulated voltage signal up to 1.5 Vp-p. Measured loss of optical interconnection is 5dB which is composed of optoelectronic conversion loss of 15 dB, electrical impedance mismatch loss of 6.7 dB in transmitter module and gain of 18 dB in receiver module. Seperation between transmitter and receiver can be extended up to 50 cm by using a lens.

• Journal of the Korean Solar Energy Society
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• v.38 no.1
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• pp.45-55
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• 2018

Environmentally benign lead-free solder coated ribbon (e. g. SnCu, SnZn, SnBi${\cdots}$) has been intensively studied to interconnect cells without lead mixed ribbon (e. g. SnPb) in the crystalline silicon(c-Si) photovoltaic modules. However, high melting point (> $200^{\circ}C$) of non-lead based solder provokes increased thermo-mechanical stress during its soldering process, which causes early degradation of PV module with it. Hence, we proposed low-temperature conductive paste (CP) based tabbing method for lead-free ribbon. Modules, interconnected by the lead-free solder (SnCu) employing CP approach, exhibits similar output without increased resistivity losses at initial condition, in comparison with traditional high temperature soldering method. Moreover, 400 cycles (2,000 hour) of thermal cycle test reveals that the module integrated by CP approach withstands thermo-mechanical stress. Furthermore, this approach guarantees strong mechanical adhesion (peel strength of ~ 2 N) between cell and lead-free ribbons. Therefore, the CP based tabbing process for lead free ribbons enables to interconnect cells in c-Si PV module, without deteriorating its performance.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.2
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• pp.116-116
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• 1999

In this study we propose a novel approach with which design engineers can define and design free-from surface more easily. Free-from surface is defined as a parameterics shape which consists of a set of contr ol points. Parametric shape which not only has the advantage of allowing users to perform design changes efficiently, but also provides designers with a natural design environment in which they can do their work more naturally and creatively. The objective of this study is to develop a PC level freeform surface modelling system which explicitly represents information of part geometry. In this study, freeform surface modeling system consist of three modules : freeform surface modeler, input/output modules and interface with Database. In recent year there are increasing demands for the 5-axis machining of a complicated shape. This study is the development of a CAM software system (or NC module) for the 5-axis machining of a general shape with a flat-end mill, a round-end mill, a ball-end mill.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.10
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• pp.135-141
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• 2013

In this paper, we installed three high brightness red, green, and blue LED in one socket and made one pixel unit. And we also developed the full-color display board module and control unit which can express various images such as text, graphics, video image with the combination of pixel units and a number of modules. LED display driver module have a driver circuit within the combination of the RGB pixel dot on unit area. These modules of the existing form can be high priced because of implementation a fixed resolution in specific space and installation space. To overcome these shortcomings, we developed a LED driver and LED pixel modules free in array at random pitch intervals. Display board module of this paper enabled to display smoothly video image which have many data processing quantity through dragging data speed up 36 frames per second. Also there are an effect which is provided more clear image because of improving the flickering of the existing display board.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.405-406
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• 2006

Recently, the flat display modules such as plasma or TFT-LCD employ thin crystallized panels which are normally weak to high level transient mechanical energy inputs. As a result, anti-shock performance is one of the most important design specifications for TFT-LCD modules. However, most of large display module designs are generated based on engineers own experiences. Also, a large-scale analysis to evaluate complex material and structural behaviors is one of interesting topic in diverse engineering and scientific fields. The utilization of massively parallel processors has also been a recent trend of high performance computing. The objective of this paper is to introduce a parallel process system which consists of general purpose finite element analysis solver as well as parallelized PC cluster. The parallel processing system is constructed using thirty-two processing elements and the finite element program is developed by adopting hierarchical domain decomposition method. In order to verify the efficiency of the established system, an impact analysis on thin and complex sub-parts of flat display modules is performed. The evaluation results showed a good agreement with the corresponding reference solutions, and thus, the parallel process system seems to be a useful tool fur the complex structural analysis such as IT related products.

• Journal of the Korean Mathematical Society
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• v.51 no.3
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• pp.509-525
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• 2014

Let R be a commutative ring with identity. An R-module M is said to be w-projective if $Ext\frac{1}{R}$(M,N) is GV-torsion for any torsion-free w-module N. In this paper, we define a ring R to be w-semi-hereditary if every finite type ideal of R is w-projective. To characterize w-semi-hereditary rings, we introduce the concept of w-injective modules and study some basic properties of w-injective modules. Using these concepts, we show that R is w-semi-hereditary if and only if the total quotient ring T(R) of R is a von Neumann regular ring and $R_m$ is a valuation domain for any maximal w-ideal m of R. It is also shown that a connected ring R is w-semi-hereditary if and only if R is a Pr$\ddot{u}$fer v-multiplication domain.

• Steel and Composite Structures
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• v.7 no.1
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• pp.71-85
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• 2007

This study suggests modular composite profile beams, where the prefab concept is applied to existing composite profile beams. The prefab concept produces a beam of desired size having two types of profile: side module and bottom module. Module section will improve construction efforts because it offers several benefits : reduction of deflections due to creep and shrinkage, which might be found in existing composite profile beams; increase in span/depth ratio; and free prefabrication of any required beams. Based on the established analysis theory of composite profile beams, an analysis theory of modular composite profile beams was suggested, and analysis values were compared with experimental ones. The behavior of individual modules with increase of load was measured with a strain gauge, and the shear connection ratio between modules was analyzed by using the measured values. As a result of experiment, it was found that theoretical flexural strength on condition of full connection was 57%-80% by connection of modules for each specimen, and it is expected that flexural strength will approximate the theoretical levels through further module improvement.

• Journal of applied mathematics & informatics
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• v.9 no.2
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• pp.705-716
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• 2002

In this paper we shall introduce the algebraic structure of a tensor product for arbitrarily given automata, giving a defintion of the tensor product for automata. We introduce and study that for any set X there always exists a free automaton on X. The existence of a tensor product for automata will be investigated in the same way like modules do.

• 전기의세계
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• v.31 no.5
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• pp.355-360
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• 1982

In numerical computation, it is desirable to access any row or column, the main diagonal, subarrays, of a matrix without any conflict for successful parallel processing. To meet this requirement special storage scheme is used for conflict-free access of necessary data. Interconnection network, which connects processing elements and processing element memory modules, is required to execute the necessary operations. In this paper we discuss the skewing method for conflict-free, access to various bit slices and single-stage interconnection networks.