• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.235.1-235.1
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• 2014

Precise measurement of plasma parameters including density and temperature is the most essential part for understanding plasma characteristics. To persue more accurate measurement, it is very important to understand the intrinsic error of the measurement method. In this paper, we performed the plasma measurement with different method; langmuire probe and cutoff probe. Both measurement technology are known to be exactly correlate with etch other. We conducted the four set of same experiments process by diffrent persons to observe the intrinsic error based on measurement tools. As a result, the cutoff probe is relatively reliable then the Langmuir probe. This difference is analyzed to be intrinsic since it cames from the inevitable error such as manufacturing of probe tip. From this study, we sure that it is good decision to choose cutoff probe as repeatable measurement independent with intrinsic human factor.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.267-269
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• 2003

반도체 웨이퍼 및 각종 박막의 면/비저항(sheet/resistivity resistance)의 측정에 비교적 간단히 측정할 수 있고 측정정확도가 높은 4탐침(four-point probe)방법이 널리 사용되고 있다 또한 4탐침 측정방법은 높은 분해능의 contour map작성과 ion implantation의 doping accuracy 및 doping uniformity의 측정에도 사용된다. 최근 재료의 소형, 박막화 경향으로 볼 때 정확한 비저항 측정의 필요성이 요구되고 있으며 이에 따라 4탐침 측정기술인 single 및 dual configuration method로 실리콘 웨이퍼에 대한 비저항의 측정 정확도를 고찰한 결과 dual configuration 측정방법이 single configuration측정 방법에 비하여 정밀 정확도가 더 좋은 것으로 고찰되었다.

• Journal of Multimedia Information System
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• 제1권2호
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• pp.127-132
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• 2014

The transverse electromagnetic (TEM) cells are widely used for electromagnetic compatibility (EMC) testing and field probe calibrations. We propose the verification of TEM mode with statistical method using a four-port TEM cell. The verification results are compared with Normal, Rayleigh, and Gamma distribution. As a result, the 75 % quantile of the Rayleigh distribution is excellent agreement with the true quantiles for a number of calibration points.

• 한국정밀공학회지
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• 제17권1호
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• pp.129-137
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• 2000

In this paper, a new method of noncontact measurement has been developed for a 3 dimensional topography in semiconductor wafer, implementing a new optical probe based on the precision defocus measurement. The developed technique consists of the new optical probe, precision stages, and the measurement/control system. The basic principle of the technique is to use the reflected slit beam from the specimen surface, and to measure the deviation of the specimen surface. The defocusing distance can be measured by the reflected slit beam, where the defocused image is measured by the proposed optical probe, giving very high resolution. The distance measuring formula has been proposed for the developed probe, using the laws of geometric optics. The precision calibration technique has been applied, giving about 10 nanometer resolution and 72 nanometer of four sigma uncertainty. In order to quantitize the micro pattern in the specimen surface, some efficient analysis algorithms have been developed to analyse the 3D topography pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, demonstrating the line scanning feature and excellent 3 dimensional measurement capability.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2015년도 제46회 하계학술대회
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• pp.1515-1516
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• 2015

Touch panel 및 Touch screen 등의 투명전극으로 많이 사용되고 있는 ITO(Indium Tin Oxide)나 CNT(Carbon Nano Tube) 등 전도성 박막의 면저항을 쉽고 빠르게 측정하기 위하여 van der Pauw method를 이용한 면저항 측정기를 개발하였다. 이 면저항 측정기는 대면적 시료의 면저항을 측정 할 수 있어 매우 편리하다. 면저항 측정은 주로 Four Point Probe method로 측정하는 것이 일반적이나 본 연구에서는 van der Pauw method를 이용한 측정값과 Four Point Probe method로 측정한 결과를 비교한 결과 1 % 이내에서 일치하였다. 개발된 측정기의 측정 정확도는 지시값의 1.0 % 이하이고, 측정범위는 $2{\Omega}/{\square}{\sim} 5k{\Omega}/{\square}$이다.

• 비파괴검사학회지
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• 제29권6호
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• pp.563-569
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• 2009

In this paper, four different types of pulsed eddy current(PEC) probe are designed and their performance of detecting wall thickness reduction is compared. By using the backward difference method in time and the finite element method in space, PEC signals from various thickness and materials are numerically calculated and three features of the signal are selected. Since PEC signals and features are obtained by various types and sizes of probe, the comparison is made through the normalized features which reflect the sensitivity of the feature to thickness reduction. The normalized features indicate that the shielded reflection probe provides the best sensitivity to wall thickness reduction for all three signal features. Results show that the best sensitivity to thickness reduction can be achieved by the peak value, but also suggest that the time to peak can be a good candidate because of its linear relationship with the thickness variation.

• Progress in Superconductivity
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• 제14권1호
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• pp.1-10
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• 2012

We fabricated a closed coils by using resistive-joint method and the joint resistance of the coils were estimated by field decay technique in liquid nitrogen. We used the Runge-kutta method for the numerical analysis to calculate the decay properties. The closed coil was wound by $(Bi,Pb)_2Sr_2Ca_2Cu_3O_x$/Ag tape. Both ends the tape were overlapped and soldered to each other. The current was induced in a closed coils by external magnetic flux density. Its decay characteristic was observed by means of measuring the magnetic flux density generated by induced current at the center of the closed coil with hall sensor. The joint resistance was calculated as the ratio of the inductance of the loop to the time constants. The joint resistances were evaluated as a function of critical current of loop, contact length, sweep time, and external magnetic flux density in a contact length of 7 cm. It was observed that joint resistance was dependent on contact length of a closed coil, but independent of critical current, sweep time, and external magnetic flux density. The joint resistance was measured to be higher for a standard four-probe method, compared with that for the field decay technique. This implies that noise of measurement in a standard four-probe method is larger than that of field decay technique. It was estimated that joint resistance was $8.0{\times}10^{-9}{\Omega}$ to $11.4{\times}10^{-9}{\Omega}$ for coils of contact length for 7 cm. It was found that 40Pb/60Sn solder are unsuitable for persistent mode.

• BMB Reports
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• 제37권3호
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• pp.356-361
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• 2004

To develop a simplified method that can rapidly prepare DNA microarray probes in a massive scale, a lambda phage genomic DNA-fragments library was constructed for the microarray-probes collection. Four methods of DNA band recovery from the first PCR products were tested and compared. The DNA microarray probes were collected by a novel method of nested PCR that was mediated by gel isolation of the first PCR products. This method was named GIN-PCR. The probes that were prepared by this GIN-PCR technique were used as subjects to fabricate a DNA microarray. The results showed that a wooden toothpick was superior to the other 3 methods, since this technique can steadily transfer the DNA bands as the template of the second PCR after the first PCR. A group of probes were successfully collected and DNA microarrays were constructed using these probes. Hybridization results demonstrated that this technique of DNA recovery and probe preparation was rapid, efficient, and effective. We developed a cost-effective and less labor-intensive method for DNA microarray probe preparation by nested PCR that is mediated by wooden toothpick transfer of the DNA bands in the gel after electrophoresis.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2009년도 춘계 학술발표회
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• pp.1125-1132
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• 2009

The theory and a probe of the pilot hole wall deformation method, which is a 3-dimensional stress measurement method based on the stress relief principle, were developed. A pilot hole is drilled from the bottom of a borehole and the stress measurement probe is inserted into the pilot hole. The borehole is advanced as the overcoring and the changes in the radius of the pilot hole in three directions and in the axial lengths between the borehole bottom and the pilot hole wall along four axial lines are measured by cantilever type-displacement sensors. The differences between the displacements by the elastic stress analysis and those measured by using the probe were within 3% in the uniaxial compression test of an acrylic resin plate having a hole.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.1634-1636
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• 2004

반도체 웨이퍼의 면저항을 정밀 측정하는 대표적인 두가지 방법인 4탐침(four point probe)방법과 van der Pauw방법으로 반도체 웨이퍼의 면저항을 비교평가 하였다. 4탐침방법에 의한 측정 시스템을 사용하여 웨이퍼의 전체 면에 대하여 면저항을 측정하고, 같은 웨이퍼의 가장자리 네 지점에 탐침 전극을 구성한 후 van der Pauw 방법으로 면저항을 측정한 결과 4탐침 방법에 의한 측정결과를 기준으로 1 %이하의 일치도를 나타냈다.