• 전자통신동향분석
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• 제36권3호
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• pp.1-11
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• 2021

In this study, we analyze the automotive chip ecosystem that recently caused the global supply shortage, and attempt to derive policy implications for us from the conclusion. Automotive chips are critical parts that control various systems so that a vehicle can drive itself or operate with electricity. The current shortage in supply and demand for automotive chips is due to the inconsistency between supply and demand between automotive chip companies and car manufacturers. To promote the automotive chip industry, new investment incentives, tax cuts, and human resource training are needed.

• 전자통신동향분석
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• 제37권2호
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• pp.62-72
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• 2022

AMD is an American fabless semiconductor company that designs CPUs, GPUs, FPGAs, and APUs. AMD is competing with Intel with its Ryzen CPUs and Nvidia with its Radeon GPUs. Since 2008, production has been consigned to TSMC, concentrating on semiconductor design. AMD is releasing various new products through continuous R&D which is the basis for its growth. AMD stock have recorded the highest rise among global semiconductor companies as sales and operating profit soared due to the strong sales of new products.

• 전자통신동향분석
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• 제38권3호
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• pp.86-97
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• 2023

The outbreak of the novel coronavirus disease in 2020 caused a global semiconductor supply shortage and disruption in the production of devices such as iPhones owing to China's quarantine lockdown. Thus, Apple is diversifying its production bases from China to countries like India and Vietnam. The company is also accelerating semiconductor development to guarantee a stable supply, reduce design costs, and customize semiconductors with high quality and outstanding specifications for their products to outperform devices that use general-purpose semiconductors. Following the mobile application processor, Apple is releasing world-class semiconductors, such as the M1 and M2 chips that play the role of central processing units.

• 전자통신동향분석
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• 제38권6호
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• pp.52-61
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• 2023

With semiconductor scaling approaching the physical limits, devices including CMOS (complementary metal-oxide-semiconductor) components have managed to overcome yet are currently struggling with several technical issues like short-channel effects. Evolving from the process node of 22 nm with FinFET (fin field effect transistor), state-of-the-art semiconductor technology has reached the 3 nm node with the GAA-FET (gate-all-around FET), which appropriately addresses the main issues of power, performance, and cost. Technical problems remain regarding the foundry of GAA-FET, and next-generation devices called post-GAA transistors have not yet been devised, except for the CFET (complementary FET). We introduce a CFET that spatially stacks p- and n-channel FETs on the same footprint and describe its structure and fabrication. Technical details like stacking of nanosheets, special spacers, hetero-epitaxy, and selective recess are more thoroughly reviewed than in similar articles on CFET fabrication.

• 한국환경과학회지
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• 제33권5호
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• pp.297-304
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• 2024

PM (Particulate Matters) was collected from a bag filter dust collector at an aluminum foundries, and its physicochemical properties were investigated using particle size analyzer and scanning electron microscopy with energy dispersive X-ray spectrometer (SEM/EDS). The median volume diameter of the particles passing through the pretreatment dust collector of the cyclone was approximately 10 ㎛. The cyclone pretreatment dust collector was shown to significantly reduce the throughput of large particles with a particle size of 100 ㎛ or more. The chemical composition of the particles showed a high Al content, and trace amounts of Mg, Si, and Zn were detected.

• 한국주조공학회지
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• 제37권6호
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• pp.207-216
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• 2017

This study investigated the effects of the addition of Zn, Ca, and SiC on the microstructure and mechanical properties of Mg-Al alloys. The tensile properties of homogenized Mg-xAl (x = 6, 7, 8, and 9 wt.%) alloys increased with increasing Zn content by the solid-solution strengthening effect. However, when the added Zn content exceeded the solubility limit, the strength and ductility of the alloys decreased greatly owing to premature fracture caused by undissolved coarse particles or local melting. Among the Mg-xAl-yZn alloys tested in this study, the AZ74 alloy showed the best tensile properties. However, from the viewpoints of the thermal stability, castability, and tensile properties, the AZ92 alloy was deemed to be the most suitable cast alloy. Moreover, the addition of a small amount (0.17 wt.%) of SiC reduced the average grain size of the AZ91 alloy significantly, from $430{\mu}m$ to $73{\mu}m$. As a result, both the strength and the elongation of the AZ91 alloy increased considerably by the grain-boundary hardening effect and the suppression of twinning behavior, respectively. On the other hand, the addition of Ca (0.5-1.5 wt.%) and a combined addition of Ca (0.5-1.5 wt.%) and SiC (0.17 wt.%) increased the average grain size of the AZ91 alloy, which resulted in a decrease in its tensile properties. The SiC-added AZ92 alloy exhibited excellent tensile properties (YS 125 MPa, UTS 282 MPa, and EL 12.3%), which were much higher than those of commercial AZ91 alloy (YS 93 MPa, UTS 192 MPa, and EL 7.0%). The fluidity of the SiC-added AZ92 alloy was slightly lower than that of the AZ91 alloy because of the expansion of the solid-liquid coexistence region in the former. However, the SiC-added AZ92 alloy showed better hot-tearing resistance than the AZ91 alloy owing to its refined grain structure.

• 한국주조공학회지
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• 제40권2호
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• pp.7-15
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• 2020

The high-temperature stability of Mg-8.0Zn-1.6Y (wt.%) alloys upon the addition of Ca has been investigated by characterizing the ignition temperature, microstructure, tensile and creep properties. The ignition temperature increases with an increase in the Ca content, indicating that an addition of Ca enhances the ignition resistance of the Mg-Zn-Y alloy. The as-cast microstructures of all tested alloys mainly consisted of the dendritic α-Mg matrix and I-phase (Mg₃Zn₆Y) at the grain boundaries. In the Ca-added Mg-8.0Zn-1.6Y alloys, the Ca₂Mg₆Zn₃ phase forms, with this phase fraction increasing with an increase in the Ca contents. However, a high volume fraction of the Ca₂Mg₆Zn₃ phase rather deteriorates the mechanical properties. Therefore, a moderate amount of Ca element in Mg-8.0Zn-1.6Y alloys is effective for improving the tensile and creep properties of the Mg-Zn-Y alloy. The Mg-8.0Zn-1.6Y-0.3Ca alloy exhibits the highest tensile strength and the lowest creep strain among the alloys investigated in the present study. The creep resistance of Mg-Zn-Y-Ca alloys depends on the selection of the secondary solidification phase; i.e., when Ca₂Mg₆Zn₃ forms in an alloy containing a high level of Ca, the creep resistance deteriorates because Ca₂Mg₆Zn₃ is less stable than the I-phase at a high temperature.

• 한국주조공학회지
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• 제32권1호
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• pp.50-56
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• 2012

Fusion bonding of cast iron and Al alloy is an effective way to improve the properties such as low inertia, high efficiency and corrosion resistance in machinery parts. In case of fusion bonding, intermetallic compound layers are formed at the interface between cast iron and Al alloy interface. It is important to control the intermetallic compound layers for improving bonding strength. The formation behavior of intermetallic compound layer by heat treatment has been investigated. Heat treatment was performed at temperature from $600^{\circ}C$ to $800^{\circ}C$ with $100^{\circ}C$ interval for an hour to investigate the phase transformation during heat treatment. Heat treated specimens were analyzed by using FE-SEM, EPMA and EDS. The EPMA/WDS results revealed that various phases were formed at the interface, which exhibited 4 distinct intermetallic compound layers such as ${\tau}_6-Al_{4.5}FeSi$, ${\tau}_2-Al_3FeSi$, ${\tau}_{11}-Al_5Fe_2Si $and ${\eta}-Al_5Fe_2$. Also, fine precipitation of ${\tau}_1-Al_2Fe_3Si_3$ phase was formed between ${\tau}_{11}$ and ${\eta}$ layer. The phase fraction in intermetallic compound layer was changed by heat treatment temperature. At $600^{\circ}C$, intermetallic compound layer of ${\tau}_6$ phase was mainly formed with increasing heat treatment time. With increasing heat treatment temperature to $800^{\circ}C$, however, ${\tau}_2$ phase was mainly distributed in intermetallic compound layer. ${\tau}_1$ phase was remarkably decreased with increasing heat treatment time and temperature.

• 한국주조공학회지
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• 제22권1호
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• pp.42-48
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• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.

• 한국주조공학회지
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• 제11권6호
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• pp.475-481
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• 1991

In this study the fabrication technology and mechanical properties of AC8A/$Al_2O_3$ Composites by squeeze casting process were investigated to develope for application as the piston materials that require good friction, wear resistance, and thermal stability. AC8A/$Al_2O_3$ composistes without a porosity and the break of preform were fabricated at the melt temperature of $740^{\circ}C$, the preform temperature of $500^{\circ}C$, and mold temperature of $400^{\circ}C$ under the applied pressure of $1200kg/cm^2$ as the results of the observation of microstructures. As the results of this study, the tensile strength of AC8A/$Al_2O_3$ composites was not increased linearly with $Al_2O_3$ volume fraction and so it seemed not to agree with the rule of mixture, which had been used often in metal matrix composite. Also the tensile strength after thermal fatigue test was little different from that before the test. Consequently it was thought that AC8A/$Al_2O_3$ composites fabricated under our experimental conditions had a good thermal stability and subsequently a good interface bonding. Wear rate(i.e., volume loss per unit sliding distance) of AC8A/$Al_2O_3$ composites was decreased with $Al_2O_3$ volume fraction and the sliding speed at both room temperature and $250^{\circ}C$ and so there was a good correlation between wear rate and hardness. Also the wear rate of AC/8A20% $Al_2O_3$ composities was obtained the value of $1.65cm^3/cm$ at sliding speed of 1.14m/sec as compared with about $3.0\;{\times}10^{-8}cm^3/cm$ hyereutectie Al-Si alloy(Al-16%Si-2%Cu-1%Fe-1%Ni), which applied presently for piston materials. The wear behavior of $Al_2O_3$ composites was observed to a type of abrasive wear by the SEM view of wear surface.