• 한국재료학회지
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• 제34권3호
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• pp.152-162
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• 2024

In this study, we introduce a novel TiN/Ag embedded TiO₂/FTO resistive random-access memory (RRAM) device. This distinctive device was fabricated using an environmentally sustainable, solution-based thin film manufacturing process. Utilizing the peroxo titanium complex (PTC) method, we successfully incorporated Ag precursors into the device architecture, markedly enhancing its performance. This innovative approach effectively mitigates the random filament formation typically observed in RRAM devices, and leverages the seed effect to guide filament growth. As a result, the device demonstrates switching behavior at substantially reduced voltage and current levels, heralding a new era of low-power RRAM operation. The changes occurring within the insulator depending on Ag contents were confirmed by X-ray photoelectron spectroscopy (XPS) analysis. Additionally, we confirmed the correlation between Ag and oxygen vacancies (V_o). The current-voltage (I-V) curves obtained suggest that as the Ag content increases there is a change in the operating mechanism, from the space charge limited conduction (SCLC) model to ionic conduction mechanism. We propose a new filament model based on changes in filament configuration and the change in conduction mechanisms. Further, we propose a novel filament model that encapsulates this shift in conduction behavior. This model illustrates how introducing Ag alters the filament configuration within the device, leading to a more efficient and controlled resistive switching process.

• 한국주조공학회지
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• 제44권3호
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• pp.59-69
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• 2024

단결정 초내열합금 CMSX-4의 온도에 따른 인장 특성을 고찰하였다. 열처리된 상태에서는 공정 γ-γ'이 일부 남아 있으며, 대부분의 영역에서는 균일한 입방체 γ'이 관찰되었다. 항복강도와 인장강도는 750℃에서 가장 높았고 온도가 증가함에 따라 감소하였으며 연신율은 650℃에서 가장 낮았다. 연신율이 낮은 시편은 파단 부위 근처에 집중된 변형을 보인 반면, 연신율이 증가한 고온에서는 시편 전체에 걸쳐 변형이 발생하였다. 850℃ 및 950℃에서 인장시험 중 파단 표면 분석을 통해 균열이 주조 결함에서 발생하는 것으로 나타났다. 인장시험 후 수행된 TEM 관찰을 통해 상온에서의 주요 변형 메커니즘이 γ' 상 내의 전위 전단과 관련되어 있음을 알 수 있었다. 그러나 650℃와 적층 결함이 발생한 750℃에서는 γ'상의 전위에 대한 저항이 증가하여 강도가 증가하는 것으로 관찰되었다. 850℃ 이상의 온도에서 열적 활성화 과정으로 인해 전위의 이동이 쉬워지기 때문에 강도가 감소하는것으로 나타났다.

• 한국주조공학회지
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• 제44권2호
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• pp.31-39
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• 2024

제2세대 단결정 초내열합금 CMSX-4은 1310℃ 이상의 온도로 용체화처리에 의해 수지상 경계와 γ/γ'공정조직이 제거되었으며, γ'상의 크기는 용체화처리 온도와 시간의 증가에 따라 수지상간 영역에서 감소하는 경향을 보였다. γ'상의 크기는 수지상 중심과 수지상간 영역에서 큰 차이를 보였다. 모든 열처리 조건에서 수지상간 영역에서 γ'상이 크게 나타났다. 용체화처리 온도와 시간의 증가에 따라 수지상 중심과 수지상간 영역의 γ'합금형성 원소 편석은 크게 감소하였으나, W, Co, Re과 같은 고용 강화원소들의 편석은 모든 열처리 후에도 어느 정도 잔존하였다. 특히, Re은 편석이 완전히 해소되지 않았다. 새로운 유해상의 생성이 없는 상온 인장 특성은 용체화처리 온도와 시간의 증가에 따라 개선되는 경향을 보였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.23-34
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• 2005

Electronic interconnection and packaging is mainly performed in a planar, 2D design style. Further miniaturization and performance enhancement of electronic systems will more and more require the use of 3D interconnection schemes. Key technologies for realizing true 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnect with embedded die. Different applications require different complexities of 3D-interconnectivity. Therefore, different technologies may be used. These can be categorized as a more traditional packaging approach, a wafer-level-packaging, WLP ('above' passivation), approach and a foundry level ('below' passivation) approach. We define these technologies as respectively 3D-SIP, 3D-WLP and 3D-SIC. In this paper, these technologies are discussed in more detail.

• 한국소음진동공학회논문집
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• 제12권4호
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• pp.287-293
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• 2002

The unexpected failure of the induction motor makes the downtime of production, and the cost of the process cessation enormous. To reduce the downtime and increase the reliability of the motor, the vibration measurements for the fault detection have been used previously. Recently motor current signature analysis(MCSA) has been adapted for the fault detection and diagnosis of the motors. MCSA provides a powerful analysis tool for detecting the presence of mechanical and electrical faults in both the motor and driven equipment. In this paper, the fault severity of the rotor bar has been derived in terms of the resistance change which is calculated from the equivalent circuit model. Results show that the fault of the rotor can be easily detected and the measured value of the resistance change is verified by the detected fault from on-site tests using MCSA for the induction motors in an iron foundry.

• 전자공학회논문지A
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• 제33A권7호
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• pp.121-126
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• 1996

In this paper an MMIC VCO which can be used in a double conversion TV tuner is designed, fabricated and measured. The VCO is designed using the small signal method and fabricated using ETRI GaAs MMIC foundry. The 3x200$\mu$m gate width MESFET with 1$\mu$m gate length is used for an active device and MIM capacitors, spiral inductors, thin film resitors are used as passive elements. The VCO has output power of 10.95dBm at 1955 MHz with 5V bias voltage and 4V tuning voltage. The oscillation frequency change form 1947 MHz to 1964 MHz is obtaine dby an external varactor diode connected to the gate with a tuning voltage from 0 V to 6V.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.360-360
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• 2010

반도체 산업은 지속적인 design rule 감소로 인해 직접도 및 Pin Count가 점점 증가함에 따라 보증해야할 회로의 수와 기능이 더불어 증가하고 있으며, 그 중 Test Cost 감소 방법 확보가 시급하게 되었다. 이에 따라 Test Cost 감소와 직결된 Test Time 감소 방법이 다양하게 제시되고 연구되고 있다. 본 논문은 Test Time의 한 부분인 반도체 검사 장비 (Automatic Test Equipment)의 효율적인 제어 방법을 제공함으로써, 관련 분야의 이해를 돕고자 한다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제6권3호
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• pp.136-145
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• 2006

Two major processing technologies of GaAs HBT and pHEMT have been released in production at Win Semiconductors corp. to address the strong demands of power amplifiers and switches for both handset and WLAN communications markets. Excellent performance with low processing cost and die shrinkage features is reported from the manufactured MMICs. With the stringent tighter manufacturing quality control WIN has successfully become one of the major pure open foundry house to serve the communication industries. The advancing of both technologies to include E/D-pHEMTs and BiHEMTs likes for multifunctional integration of PA, LNA, switch and logics is also highlighted.

• 한국기계가공학회지
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• 제14권5호
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• pp.36-41
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• 2015

In this paper, research on the mold design of motor housing produced by the HPDC process was conducted using computer simulations and experiments. Recently, automobile parts have been required to be light and have high strength. The die casting process was used to manufacture automotive motor housings. In the die casting process, the control of casting defects is very important. However, it has usually depended on the experience of the foundry engineer. For the analysis of the manufacturing process of motor housing, the finite element method is applied. Through the simulations using commercial software, the filling pattern and product defects could be confirmed. The analysis results obtained from the filling behavior of the casting process agreed with the experimental results. The computer simulation results of filling behavior were reflected in the optimal mold design of motor housing.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.755-758
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• 2001

Most of the waste plastics are incinerated and landfilled now, leading to much environmental problems. The technology of injection into the blast furnace was developed as a useful recycling method of waste plastics, and applied to the actual operation in several ironmaking companies. We carried out the test operation to inject continuously the two kinds of waste plastics through four tuyeres of the Foundry blast furnace in POSCO by 130 ton of total amount. From this test operation, we analyzed the coke replacement ratio, the permeability, the heat load and other changes of furnace conditions with the injection of waste plastics into the blast furnace. Some trials based upon the theoretical approaches were applied to examine the efficiencies of blast furnace.