• Title/Summary/Keyword: fluorocarbon polymer

Search Result 21, Processing Time 0.025 seconds

Ultrathin Polymer Networks of Itaconic Acid Copolymers and Poly(allkylamine) by the ;angmuir-Blodgett Technique

  • 최기선;이범종;장상목;권영수
    • Bulletin of the Korean Chemical Society
    • /
    • v.16 no.6
    • /
    • pp.493-498
    • /
    • 1995
  • Ultrathin networks of itaconic acid copolymers and poly(allylamine) were produced by a Langmuir-Blodgett (LB) technique employing a double-chain amine as a monolayer template which was subsequently removed by extraction after thermal crosslinking. Itaconic acid copolymers used were copoly (itaconic acid-ethyl vinyl ether) and copoly (itaconic acid-n-butyl vinyl ether). The polyion-complexed monolayers of three components consisting of template amine, itaconic acid copolymer and poly (allylamine) were formed at the air-water interface. The Langmuir film properties have been studied by the surface pressure-area isotherm and fluorescence microscopy. The monolayers were transferred on solid substrates and were characterized by FT-IR spectroscopy, X-ray photoelectron spectroscopy, and scanning electron microscopy (SEM). Two-dimensional polymer networks were formed through imide or amide linkages by heat treatment under vacuum. The heat-treated films were extracted with chloroform after immersion in aq. sodium chloride to remove the template amines. SEM observation of a LB film on a porous fluorocarbon membrane filter with pore diameter of 0.1 μm showed covering of the pores by six layers in the polyion complex state.

GPU Based Feature Profile Simulation for Deep Contact Hole Etching in Fluorocarbon Plasma

  • Im, Yeon-Ho;Chang, Won-Seok;Choi, Kwang-Sung;Yu, Dong-Hun;Cho, Deog-Gyun;Yook, Yeong-Geun;Chun, Poo-Reum;Lee, Se-A;Kim, Jin-Tae;Kwon, Deuk-Chul;Yoon, Jung-Sik;Kim3, Dae-Woong;You, Shin-Jae
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.08a
    • /
    • pp.80-81
    • /
    • 2012
  • Recently, one of the critical issues in the etching processes of the nanoscale devices is to achieve ultra-high aspect ratio contact (UHARC) profile without anomalous behaviors such as sidewall bowing, and twisting profile. To achieve this goal, the fluorocarbon plasmas with major advantage of the sidewall passivation have been used commonly with numerous additives to obtain the ideal etch profiles. However, they still suffer from formidable challenges such as tight limits of sidewall bowing and controlling the randomly distorted features in nanoscale etching profile. Furthermore, the absence of the available plasma simulation tools has made it difficult to develop revolutionary technologies to overcome these process limitations, including novel plasma chemistries, and plasma sources. As an effort to address these issues, we performed a fluorocarbon surface kinetic modeling based on the experimental plasma diagnostic data for silicon dioxide etching process under inductively coupled C4F6/Ar/O2 plasmas. For this work, the SiO2 etch rates were investigated with bulk plasma diagnostics tools such as Langmuir probe, cutoff probe and Quadruple Mass Spectrometer (QMS). The surface chemistries of the etched samples were measured by X-ray Photoelectron Spectrometer. To measure plasma parameters, the self-cleaned RF Langmuir probe was used for polymer deposition environment on the probe tip and double-checked by the cutoff probe which was known to be a precise plasma diagnostic tool for the electron density measurement. In addition, neutral and ion fluxes from bulk plasma were monitored with appearance methods using QMS signal. Based on these experimental data, we proposed a phenomenological, and realistic two-layer surface reaction model of SiO2 etch process under the overlying polymer passivation layer, considering material balance of deposition and etching through steady-state fluorocarbon layer. The predicted surface reaction modeling results showed good agreement with the experimental data. With the above studies of plasma surface reaction, we have developed a 3D topography simulator using the multi-layer level set algorithm and new memory saving technique, which is suitable in 3D UHARC etch simulation. Ballistic transports of neutral and ion species inside feature profile was considered by deterministic and Monte Carlo methods, respectively. In case of ultra-high aspect ratio contact hole etching, it is already well-known that the huge computational burden is required for realistic consideration of these ballistic transports. To address this issue, the related computational codes were efficiently parallelized for GPU (Graphic Processing Unit) computing, so that the total computation time could be improved more than few hundred times compared to the serial version. Finally, the 3D topography simulator was integrated with ballistic transport module and etch reaction model. Realistic etch-profile simulations with consideration of the sidewall polymer passivation layer were demonstrated.

  • PDF

$C_{x}F_{y}$ Polymer Film Deposition in rf and dc $C_{7}F_{16}$ Vapor Plasmas

  • Sakai, Y.;Akazawa, M.;Sakai, Yosuke;Sugawara, H.;Tabata, M.;Lungu, C.P.;Lungu, A.M.
    • Transactions on Electrical and Electronic Materials
    • /
    • v.2 no.1
    • /
    • pp.1-6
    • /
    • 2001
  • $C_{x}F_{y}$ polymer film was deposited in rf and dc Fluorinert vapor ($C_{7}F_{16}$) plasmas. In the plasma phase, the spatial distribution of optical emission spectra and the temporal concentration of decomposed species were monitored, and kinetics of the $C_{7}F_{16}$ decomposition process was discussed. Deposition of $C_{x}F_{y}$ film has been tried on substrates of stainless steel, glass, molybdenum and silicon wafers at room temperature in the vapor pressures of 40 and 100 Pa. The films deposited in the rf plasma showed excellent electrical properties as an insulator for multi-layered interconnection of deep-submicron LSI, i.e. the low dielectric constant ∼2.0, the dielectric strength ∼2 MV/cm and the high deposition rate ∼100nm/min at 100W input power.

  • PDF

Fabrication and organic gas response characteristics of the copolymer LB films (공중합체 LB막의 제작과 유기가스 반응 특성)

  • 신훈규;최용성;장정수;권영수
    • Electrical & Electronic Materials
    • /
    • v.9 no.2
    • /
    • pp.180-187
    • /
    • 1996
  • The use of preformed copolymers and their cross-linking have been attempted in order to improve the intrinsic fragility of monolayers and Langmuir-Blodgett (LB) films and to make their technological applications. It has shown that an imidization followed a polyion-complexation can stabilize the LB films against heat and solvents. And, when the polymer structure was properly designed, concurrent removal of the alkyl tails together with imide formation could be accomplished. In this paper, the monolayers of the polymers which were polyion-complexed with PAA at the air-water interface can be transferred onto solid substrates such as porous fluorocarbon membranes filter and quartz crystal microbalance. The properties of the monolayers and the LB films will be discussed by .pi.-A isotherms, FT-IR, DSC, deposition ratio, QCM, and SEM. In addition, it was attempted to investigate the response characteristics of polymer LB films to the organic gases by the use of QCM.

  • PDF

An Ultrathin Polymer Network through Polyion-Complex by Using Sodium Dioctadecyl Sulfate as Monolayer Template

  • Lee, Burm-Jong;Kim, Hee-Sang;Kim, Seong-Hoon;Son, Eun-Mi;Kim, Dong-Kyoo;Shin, Hoon-Kyu;Kwon, Young-Su
    • Bulletin of the Korean Chemical Society
    • /
    • v.23 no.4
    • /
    • pp.575-579
    • /
    • 2002
  • Two-dimensionally cross-linked ultrathin films of poly(maleic acid-alt-methyl vinyl ether) (MA-MVE) and poly(allylamine) (PAA) were produced by using sodium dioctadecyl sulfate (2C18S) as the monolayer template for Langmuir-Blodgett (LB) depositio n. The template molecules were subsequently removed by thermal treatment followed by extraction. The polyion-complexed monolayers of three components, i.e., template 2C18S, co-spread PAA, and subphase MA-MVE, were formed at the air-water interface. Their monolayer properties were studied by the surface pressure-area isotherm. The monolayers were transferred on solid substrates as Y type. The polyion-complexed LB films and the resulting network films were characterized by FT-IR spectroscopy, X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM). The cross-linking to form a polymer network was achieved by amide or imide formation through heat treatment under a vacuum. SEM observation of the film on a porous fluorocarbon membrane filter (pore diameter 0.1 ㎛) showed covering of the pores by four layers in the polyion complex state. Extraction by chloroform followed by heat treatment produced hole defects in the film.

Surface Characteristics of Polymer/Metal Compound LB Films in the Air/water Interface (고분자/금속화합물 LB막의 공기/물에서의 계면 특성)

  • Shin, Hoon-Kyu;Choi, Yong-Sung;Kim, Eun-Koo;Kwon, Young-Soo;Chang, Jeong-Soo;Bae, Jin-Ho;Lee, Burm-Jong
    • Proceedings of the KIEE Conference
    • /
    • 1994.07b
    • /
    • pp.1364-1366
    • /
    • 1994
  • In this paper, the monolayers of the polymers which polyion-complexed with PAA at the air-water interrace can be transferred on to solid substrates such as porous fluorocarbon membranes filter and quartz crystal microbalance. The properties of the monolayers and the LB films investigated by ${\pi}-A$ isotherms, FT-IR, DSC, deposition ratio, QCM, and SEM will be discussed. In addition, it was attempted to investigated the surface characterics of polymer/metal compound LB films in the air/water interface.

  • PDF

The Electrical Properties of Fluorocarbon Polymer Composites with High Voltage Arc Resistance (초고압 내아크용 불소수지 복합재료의 전기적 특성)

  • 박효열;안명상;강동필
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1996.05a
    • /
    • pp.216-219
    • /
    • 1996
  • Polytetrafluoroethylene is very suitable for insulation materials because of it's high thermal and chemical stability, high electrical resistance and low loss factor. But almost all kinds of pure fluoroplastic cannot endure long time in the high temperature arc environment breaking high voltage and current In this study, inorganic materials such as BN, TiO$_2$ and Al$_2$O$_3$ were filled in the polytetrafluoroethylene to improve arc resistance. The electrical properties, arc resistant properties and light reflectance of the composites were investigated.

  • PDF

Free-Standing Langmuir-Blodgett Films of Maleic Acid-Vinyl Ether Copolymers across 1 μm Pores

  • 이범종;최기선;권영수
    • Bulletin of the Korean Chemical Society
    • /
    • v.16 no.12
    • /
    • pp.1167-1172
    • /
    • 1995
  • A coverage of about 1 μm-sized pores of a membrane filter by four monolayers of maleic acids copolymers and poly(allylamine) (PAA) was attained by Langmuir-Blodgett (LB) technique through a covalent cross-linking followed a polyion complexation at the air-water interface. The copolymers were prepared to have side chains of hydrocarbon tail, carboxyl, and/or oligoether in the repeat unit. The surface pressure-area isotherms showed that the monolayers on an aqueous PAA have more expanded area than on pure water. The monolayers were transferable on a calcium fluoride substrate and a fluorocarbon membrane filter as Y deposition type, and the resulting LB films were characterized by FT-IR spectroscopy and scanning electron microscopy. A polymer network produced through interchain amide formation was confirmed in as-deposited films. The films were heat-treated in order to complete the cross-linking. SEM observation of the heat-treated film on a porous membrane filter showed that the four layer film was sufficiently stable to cover the filter pore of about 1 μm. Immersion of the film in water or in chloroform did not cause any change in its appearance on SEM and in FT-IR spectra.

Effect to Fillers for FKM (Fluorocarbon rubber) Gasket in Fuel Cell Stack (연료전지 스택 가스켓용 불소고무에 있어 충전제 종류에 따른 영향)

  • Hur, Byung-ki;Kang, Dong-gug;Yoo, Il-hyuk;Lee, Dong-won;Seo, Kwan-ho;Park, Lee-soon
    • Applied Chemistry for Engineering
    • /
    • v.19 no.1
    • /
    • pp.86-91
    • /
    • 2008
  • The rubber was compounded with carbon black and silica series-filler to examine the effects of the various rubber fillers on a gasket material's suitability and fuel cell stack conclusion. The evaluation of a long term heat resistance and oil resistance of the mixed rubber material was performed considering at the drive environment of PEMFC. Test results of compression set for the most influencing property of gasket showed that it was about less than 15% at long term of up to 1000 h. In this experiment, FEM analysis is carried out about the rubber material's properties depending on each filler and the stress which is produced when a gasket is contracted by using various filler. Sealing force was expected to maximum 2.5 MPa from minimum 0.2 MPa by using FEM (finite element method) at stacking gasket to gasket.

Modified Principal Component Analysis for In-situ Endpoint Detection of Dielectric Layers Etching Using Plasma Impedance Monitoring and Self Plasma Optical Emission Spectroscopy

  • Jang, Hae-Gyu;Choi, Sang-Hyuk;Chae, Hee-Yeop
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.182-182
    • /
    • 2012
  • Plasma etching is used in various semiconductor processing steps. In plasma etcher, optical- emission spectroscopy (OES) is widely used for in-situ endpoint detection. However, the sensitivity of OES is decreased if polymer is deposited on viewport or the proportion of exposed area on the wafer is too small. Because of these problems, the object is to investigate the suitability of using plasma impedance monitoring (PIM) and self plasma optical emission spectrocopy (SPOES) with statistical approach for in-situ endpoint detection. The endpoint was determined by impedance signal variation from I-V monitor (VI probe) and optical emission signal from SPOES. However, the signal variation at the endpoint is too weak to determine endpoint when $SiO_2$ and SiNx layers are etched by fluorocarbon on inductive coupled plasma (ICP) etcher, if the proportion of $SiO_2$ and SiNx area on Si wafer are small. Therefore, modified principal component analysis (mPCA) is applied to them for increasing sensitivity. For verifying this method, detected endpoint from impedance monitoring is compared with optical emission spectroscopy.

  • PDF