• 유체기계공업학회:학술대회논문집
• /
• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
• /
• pp.561-564
• /
• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of Welding and Joining
• /
• 제17권1호
• /
• pp.77-81
• /
• 1999

Through-hole PCB(Printed Circuit Board) was soldered by flow soldering process using cleaning or noncleaning fluxes. Preheating temperature and conveyor speed were changed in the range of 323∼413K and 0.3∼2m/min respectively. The soldered joints were tensile tested in order to evaluated bonding strength. As experimental results, relatively high tensile fracture load, 120∼140N, were obtained in case of preheating temperature of 383K, and conveyor speed was 0.6∼1.0 m/min. Fractured surfaces of higher tensile strength show some dimple area, while those of lower tensile fracture load show brittle fracture.

• Journal of Welding and Joining
• /
• 제16권6호
• /
• pp.77-85
• /
• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2009년도 추계학술대회 논문집
• /
• pp.464-466
• /
• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.

• 반도체디스플레이기술학회지
• /
• 제5권3호
• /
• pp.29-32
• /
• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• 한국기계가공학회지
• /
• 제20권2호
• /
• pp.93-100
• /
• 2021

Copper sheets has been used widely in electric and electron industry fields because they have good electric and heat conduction property of the material. And, in order to bond copper material, a kind of soldering process is generally used. But, because it is difficult to bond by soldering between overlapped thin copper sheets, so, another kind of brazing bonding process can be used in that case. But, because the brazing process needs wide bonding area, it needs heat treatment process in electric furnace. Generally, for spot welding of sheets, a conventional electric Resistance Spot Welding process(RSW) has been used, it has welding characteristics using contact resistance heating induced by electric current flow between sheets. But, because copper sheets has the low electric resistance, it is difficult to weld by electric resistance spot welding. So, in this study, an electric Resistance heated Surface Friction Spot Welding process(RSFSW) is suggested and is testified for the spot welding ability of thin copper sheets. It is known from the experimental results and simulation that the suggested spot welding process will be able to improve the spot welding ability of copper sheets by the combined three kinds of heating generated by surface friction by rotating pin, and conducted from heated steel electrode, and generated by contact resistance of electricity.

• 한국표면공학회지
• /
• 제36권2호
• /
• pp.168-175
• /
• 2003

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

• 화약ㆍ발파
• /
• 제22권1호
• /
• pp.33-43
• /
• 2004

본 연구에서는 철근콘크리트(reinforced connote) 구조물에 대해 발파해체 축소모형실험을 수행하고 이를 전산실험결과와 비교하였다. 적용된 발파해체 공법은 파괴거동을 비교적 쉽게 확인할 수 있는 점진붕괴공법이며, 차원해석(Hobbs(1969))을 실시하여 축소모형실험에 적용될 강도특성을 계산하였다. 이에 따라 석고, 모래, 물의 혼합하여 콘크리트를 대용할 재료로 사용하였으며, 연성을 지니며 축소강도가 철근과 유사한 땜용 납선을 철근 대용 재료로 사용하였다. 이 때 모래와 석고의 중량 비를 다양하게 변화시키면서 이에 따른 강도의 변화를 측정하고 최적의 강도 값을 갖는 배합 비를 결정하여 사용하였다. 모형의 제작은 실내에서 미리 양생된 부재들을 현장으로 옮겨 연결부만을 타설하여 일체화시키는 방법으로 구조물을 축조하였다. 축소모형실험을 전산실험결과와 비교하기 위하여 요소의 파괴거동을 육안으로 확인할 수 있는 개별요소법에 의해 수행되는 상용코드인 PFC2D(Particle Flow Code 2-Dimension)를 사용하여 전산해석을 수행하였다. 먼저 3차원 무근 콘크리트 라멘 구조의 모형을 설계하고 그 축소모형을 발파해체하여 거동을 촬영하였다. 이를 전산실험결과와 비교하여 2차원 해석의 한계는 존재하나 대체로 유사한 형태의 거동을 보임을 알 수 있었다. 그리고, 무근 콘크리트 라멘 구조 해석의 경험과 철근콘크리트 보의 실내 굴곡실험결과를 근거로 하여 철근콘크리트 구조모형의 발파해체 사전해석을 실시하였다. 그 결과, 2차원 해석이라는 한계에도 불구하고 900ms 까지는 거의 유사한 거동을 보이며 붕괴됨을 확인하였다.