• Vacuum Magazine
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• v.1 no.2
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• pp.24-29
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• 2014

Display is a key component in electronic devices. OLED is growing very fast recently due to the explosion of the smart phone market although still LCD is the dominating display technology in the display market at the moment. Also needs for the large area and high resolution TVs and flexible displays are increasing these days. Especially flexible display is expected to be one of the key technologies in mobile devices requiring small device size and large display size. Contrary to the conventional displays, flexible display requires organic materials for the substrate, the active driving element and also for the display element. Plastic film as a substrate, organic semiconductor as an active component of the transistor and organic light emitting materials or electronic paper as a display element are studied actively. In this article, mainly backplane technologies such as substrates and the transistor materials for flexible display will be introduced.

• Information Display
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• v.9 no.4
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• pp.29-36
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• 2008

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.5
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• pp.533-538
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• 2011

A plastic-compatible low-temperature metal deposition and patterning process is essential for the fabrication of flexible electronics because they are usually built on a heat-sensitive flexible substrate, for example plastic, fabric, paper, or metal foil. There is considerable interest in solution-processible metal nanoparticle ink deposition and patterning by selective laser sintering. It provides flexible electronics fabrication without the use of conventional photolithography or vacuum deposition techniques. We summarize our recent progress on the selective laser sintering of metals and metal oxide nanoparticles on a polymer substrate to realize flexible electronics such as flexible displays and flexible solar cells. Future research directions are also discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.313-313
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• 2016

Transparent conductive oxide (TCO) films have many disadvantages, such as rarity, possible exhaustion, process temperature limitations, and brittleness on a flexible substrate. In particular, as display technology moves toward flexible displays, TCO will become completely unsuitable due to its brittleness. To address theses issue, many researchers have been studying TCO substitutes. In recent efforts, metal nanowires, conducting polymers, carbon nanotube networks, graphene films, hybrid thin films, and metal meshes/grids have been evaluated as candidates to replace TCO electrodes. In this study, we fabricated the TCO film with Ag meshes shape using polystyrene (PS) beads monolayer on the substrate. The PS beads were used as a template to create the mesh pattern. We fabricated the monolayer on the flexible substrate (PES) with the well-aligned PS beads. Electrodes with Ag mesh shape were formed using this patterned monolayer. We could fabricated the Ag mesh electrode with the sheet resistance with $8ohm{\Omega}/{\Box}$.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.657-659
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• 2008

Barrier coating properties of PVA/$SiO_2$ on the flexible substrates (PEN) have been investigated. Thin layer of PVA/$SiO_2$ organic-inorganic hybrid materials were deposited on PEN substrate by the spin-coating. The optical properties and surface roughness of barrier layer on flexible substrate were characterized by AFM, UV-Vis and WVTR/ OTR.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.439-442
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• 2006

We evaluated a-Si:H TFTs fabricated on polyimide substrate (PI) at the highest temperature of $160^{\circ}C$ with uniaxial and tensile strain to imitate flexible display. With tensile strain, the threshold voltage of a-Si:H TFTs have positive shift due to extra dangling bond formation in a-Si:H layer. However, no significant degradation of the subthreshold swing and effective mobility with tensile strain of a-Si:H TFTs indicates the similar level of band tail state. The metal wire with the width of $10\;{\mu}m$ for connection on flexible substrate can sustain with curvature radius 2.5 cm.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.614-615
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• 2005

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, roll-to-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate ($LEXAN^{(R)}$) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen,chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate ($LEXAN^{(R)}$) films and its compatibility with OLED device fabrication processes.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.121-123
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• 2007

Energy harvesting from the vibration through the piezoelectric effect has been studied for powering the wireless sensor node. As piezoelectric unimorph cantilever structure can transfer low vibration to large displacement, this structure was commonly deployed to harvest electric energy from vibrations. Piezoelectric unimorph structure was composed of small stiff piezoelectric ceramic on the large flexible substrate. As there is the large Young's modulus difference between the flexible substrate and stiff piezoelectric ceramic, flexible substrate could not homogeneously transfer the vibration to stiff piezoelectric ceramic. As a result, most piezoelectric ceramics had been broken at the certain point. We measured and analyzed the stress distribution on the piezoelectric ceramic on the cantilever.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.348-351
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• 2007

A pure polyimide substrate and polyimide substrate with nano-silica additive have been formed on glass by coating. The a-Si:H TFT arrays have been formed on such polyimide substrate for driving TNLCD.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.524-524
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• 2006

For decades, the pursuit of volume commercialization of low-power reflective displays with a paper-like look has been an unfulfilled dream. While steady technical progress was made throughout the late 1990s, there were still no volume products incorporating electronic paper displays (EPD) on the market. Now, microencapsulated electrophoretic display technology, also called electronic ink, has moved into volume production with a frontplane laminate (FPL) display component called E Ink Imaging Film™. This film is coated roll to roll on a flexible plastic substrate and integrated into a display module. Today, all-plastic segmented displays are being shipped as well as displays with electronic ink FPL being driven by glass TFT backplanes. A roadmap to active matrix flexible electrophoretic displays is being enabled by rapid technical progress on flexible TFT backplanes by a variety companies. Each of the approaches to these backplanes and flexible active matrix displays has different advantages for the various market segments being pursued including large format flexible displays for e-news and other reader applications, rollable displays for compact readers, and high resolution small format displays up to 400 ppi that can have fully integrated drive electronics to reduce size and drive down costs. Backplane approaches include Si on plastic, organic transistors on plastic, and Si transistors on flexible stainless steel substrate. Progress is also being made on next generation inks, including more reflective inks with higher contrast ratios. A full color 6 inch, 170 pixel per inch (PPI) active matrix display using a newer generation ink has been developed and this will be described and demonstrated. Large format segmented flexible displays will also be described.