• The monthly packaging world
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• s.107
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• pp.180-184
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• 2002

• The monthly packaging world
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• s.339
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• pp.58-67
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• 2021

• The monthly packaging world
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• s.148
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• pp.148-151
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• 2005

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.29-36
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• 2004

A flexible packaging scheme, which includes chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending tests and finite element analysis. Thinned silicon chips (t<30 $\mu\textrm{m}$) are fabricated by chemical etching process to avoid possible surface damages on them. And the chips are stacked directly on $Kapton^{Kapton}$film by thermal compressive bonding. The low height difference between the thinned silicon chip and $Kapton^{Kapton}$film allows electroplating for electrical interconnection method. Because the 'Chip' is embedded in the flexible substrate, higher packaging density and wearability can be achieved by maximized usable packaging area.

• Food Science and Industry
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• v.50 no.2
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• pp.12-26
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• 2017

Processing steps such as washing and cutting, involved in preparing fresh-cut produce causes tissue damage, leading to rapid quality deterioration. Major defects of fresh-cut produce are discoloration, softening, off-odor development, and microbial growth. Packaging of fresh-cut produce has been changed to reduce these quality problems. Flexible packaging film is widely used to pack fresh-cut produce. Vacuum packaging was the popular packaging method in the beginning of fresh-cut industry in Korea. Vacuum packaging creates high $CO_2$ and low $O_2$ levels to control browning of fresh-cut produce. However, these conditions induce some visual defects and off-odor development. Discoloration problem was also found when fresh-cut produce was packaged with conventional packaging film or plastic tray. Modified atmosphere (MA) packaging is effective for prolonging shelf-life of fresh-cut produce by decreasing $O_2$ and increasing $CO_2$ concentration in the package. Retail MA packaging using different oxygen transmission rate (OTR) film and micro-perforated film has started to be applied to fresh-cut produce in Korea. Proper MA package design that provides optimum range of $O_2$ and $CO_2$ partial pressures is one of the major challenges in the industry. An initial package flushing with $N_2$ or an low $O_2$/high $CO_2$ atmosphere is also used to more rapidly establish steady-state MA condition. Film OTR and $O_2$ flushing affects the fermentative volatile production, off-odor development, electrolyte leakage, discoloration, $CO_2$ injury, microbial population of fresh-cut produce. There is also a demand for convenient packaging to attract consumers. Rigid fresh-cut produce container for retail market has increased since the packaging provides excellent protection from physical damage during transport. Rigid tray used as actual serving vessel for the consumer is increasing in Korea. The tray with flexible lid to wrap or seal fresh-cut produce is more and more gaining popularity. Further practical technology to control quality change and microbial growth for each fresh-cut product has been studied since various fresh-cut items were required. The fresh-cut industry also focuses on searching for more convenient and environmentally friendly packaging.

• The monthly packaging world
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• s.258
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• pp.45-53
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• 2014

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.10-17
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• 2024

This paper discusses Chip On Film (COF) technology, one of the key technologies in flexible packaging to enable miniaturization and flexibility of electronic devices. COF attaches Display Driver IC (DDI) directly to a flexible polyimide substrate, enabling lightweight and reduced thickness for high-resolution displays. COF technology is primarily used in high-performance display panels, such as organic light emitting diode (OLED) displays, and plays a key role in portable electronic devices, such as smartphones and wearable devices. This study analyzes the key components of COF and advances in bonding technology. In particular, the introduction of modern bonding techniques, such as thermo-compression bonding and thermo-sonic bonding, has led to significant improvements in bonding reliability and electrical performance. These bonding techniques enhance the mechanical stability of COF packages while maintaining high electrical connectivity in fine-pitch structures. This paper will discuss the future development of COF bonding technology and its challenges and explore its potential as a next-generation display and advanced packaging technology.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.1
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• pp.15-22
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• 2002

We received 2 types flexible packaging films from two companies that laminated PET $16{\mu}m/dry$ lamination/aluminium foil $7{\mu}m/dry$ lamination/CPP $80{\mu}m$ films. For the reason of hot sealing's trouble through filling process, We separated each layer and compared thicks, film types and tested IR, DSC and sensory test. At the result, one sample's thick is different but film types is same between samples. Optimum hot-sealing conditions between two samples is $195^{\circ}C\;and\;210^{\circ}C$. The difference is $15^{\circ}C$. According to test of direct filling packaging process by four face fluid filling machine, two sample's sealing strength of hot-sealing is $4.76kg/cm2/15mm$(sample of optimum hot-sealing condition is $195^{\circ}C$) and $3.84kg/cm2/15mm(210^{\circ}C)$.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.62-65
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• 2018

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.178-178
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• 2009

전자제품의 고속화, 고집적화, 고성능이 요구되어짐에 따라 IC's 성능 향상을 통해 패키징 기술의 소형화를 필요로 하고 있어 소재나 칩 부품을 이용해 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브 기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 3D 패키징이 가능한 flexible 소재에 능, 수동 소자를 내장하기 위한 다층 flexible 기판 공정 기술에 대한 연구를 수행하였다. 기판제작을 위해 flexible 소재에 미세 형성이 가능한 폴리머 필름을 접착하였고 flexible 위에 후막 저항체 패턴을 퍼|이스트를 이용하여 형성하였다. 또한, 능동소자 내장을 위해 test chip을 제작하여 플립칩 본더를 이용해 flexible 기판에 접합한 후에 bonding film을 이용한 build up 공정을 통해 via를 형성하고 무전해 도금 공정을 거쳐 전기적인 연결을 하였다. 위의 공정을 통해 앓고 가벼울 뿐만 아니라 자유롭게 구부러지는 특성을 갖고 있는 능, 수동 소자 내장형 flexible 기판의 변형에 따른 전기적 특성을 평가하였다.