• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1219-1225
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• 2003

According to the increase of lifetime and efficiency, the interest in the pLED has dramatically increased recently because pLED can be applied to large-size and flexible displays. The core process in the manufacture of pLED is the printing process of red, green and blue light emitting polymers (LEP), and inkjet printing method is one of the promising technology to print red, green and blue LEP on glass substrates. In this work, we developed a multi-head inkjet patterning system with 3 heads for each color. The developed inkjet patterning system is composed of the precise positioning system, head controller circuit, real-time ink drop evaluation system, maintenance system, and stable ink supply system. Finally, we investigated the stability and reliability of the system by printing red, green and blue LEP on the dummy substrate.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.8
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• pp.43-49
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• 2020

The growth of the AR/VR market due to the advent of the 4th Industrial Revolution begins with the development of the display industry. The development of OLED and flexible displays is further accelerated by the development of R2R technology. Micro-processing technology using a fast tool servo (FTS), the core technology in R2R processes, is making technological progress in increasingly diverse ways. This paper proposes a method to develop an FTS for horizontal driving and presents this method through experiments and analyses. To develop a swing-type FTS based on a seesaw motion, a rotational moment hinge structure was designed for each type, and research was conducted to determine an effective design method. A cantilever-based swing-type FTS was developed in two variations: one with single-side hinges and another with dual-side hinges. The parameters in the design of the swing-type FTS are rotational moment, natural frequency, and material selection. In conclusion, an FTS with a single-side hinge demonstrates the high performance required for micro processing.

• Journal of Applied Reliability
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• v.17 no.1
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• pp.72-77
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• 2017

Purpose: The electrochemical corrosion behavior of tin oxide film coated on PET substrates has been studied under varying concentrations of acrylic acid to investigate possible corrosion in contact with the acidic environment. Method: Potentiodynamic test was performed for a commercial ITO/PET film in 0.1, 0.3, and 0.5 M of acrylic acid. The surface morphology was analyzed by scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). Results: Potentiodynamic test results showed an increase in Icorr and decrease in Ecorr value with increasing concentration of acid. Microscopic evaluation suggested the presence of certain deep cracks on the surface of the film in addition with a severe acidic attack. Conclusion: Exposure of ITO to acrylic acid resulted in the stress corrosion cracking of ITO film due to the mechanical mismatch between brittle inorganic ITO fim and a compliant organic PET substrate leading to the subsequent failure of the film.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.234.2-234.2
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• 2014

Organic light emitting diode (OLED) is considered as the next generation flat panel displays due to its advantages of low power consumption, fast response time, broad viewing angle and flexibility. For the flexible application, it is essential to develop thin film encapsulation (TFE) to protect oxidation of organic materials from oxidative species such as oxygen and water vapor [1]. In many TFE research, the inorganic film by atomic layer deposition (ALD) process demonstrated a good barrier property. However, extremely low throughput of ALD process is considered as a major weakness for industrial application. Recently, there has been developed a high throughput ALD, called 'spatial ALD' [2]. In spatial ALD, the precursors and reactant gases are supplied continuously in same chamber, but they are separated physically using a purge gas streams to prevent mixing of the precursors and reactant gases. In this study, the $Al_2O_3$ thin film was deposited by spatial ALD process. We characterized various process variables in the spatial ALD such as temperature, scanning speed, and chemical compositions. Water vapor transmission rate (WVTR) was determined by calcium resistance test and less than $10-^3g/m^2{\cdot}day$ was achieved. The samples were analyzed by x-ray photoelectron spectroscopy (XPS) and field emission scanning electron microscope (FE-SEM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.53-54
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• 2005

We report on plasma damage free-sputtering technologies for organic light emitting diodes (OLEDs), organic thin rim transistor (OTFT) and flexible displays by using a box cathode sputtering (BCS) method. Specially designed BCS system has two facing targets generating high magnetic fields ideally entering and leaving the targets, perpendicularly. This target geometry allows the formation of high-density plasma between targets and enables us to realize plasma damage free sputtering on organic layer without protection layer against plasma. The OLED with top cathode prepared by BCS shows electrical and optical characteristics comparable to OLED with thermally evaporated Mg-Ag cathode. It was found that TOLED with ITO or IZO top cathode layer prepared by BCS has much lower leakage current density ($1\times10^{-5}$ mA/cm2 at -6V) than that ($1\times10^{-1}\sim10^{\circ}mA/cm^2$)of OLED prepared by conventional DC sputtering system. This indicates that BCS technique is a promising electrode deposition method for substituting conventional thermal evaporation and dc/rf sputtering in fabrication process of organic based optoelectronics.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.498-503
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• 2016

Many types of robot systems are used in the mass production line of thin film solar cells and flat panel displays. There are some issues such as the deflection and the vibration of the end-effector because robots handle large and heavy substrates at high speed. Heavy payload and high speed cause much vibration because the end-effector (fork) is made of carbon fiber reinforced polymer because of its light weightiness and sufficient stiffness. This study performs a dynamic simulation of an 8.5G solar cell substrate handling robot, including rigid and flexible bodies and a vibration controller. The fifth polynomial trajectory and the zero vibration derivative input shaping algorithm are applied. The vibration reduction is also proved in the experiments.

• Journal of the Korean institute of surface engineering
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• v.40 no.3
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• pp.144-148
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• 2007

To prepare the transparent electrode for electronic devices such as flat panel or flexible displays, solar cells, and touch panels; tin doped $In_2O_3$ (ITO) films with low resistivity and a high transparency were fabricated using a facing target sputtering (FTS) system at the various oxygen gas flow rate. The carrier concentration and mobility of ITO films were measured by Hall Effect measurement. And the transmittance was measured using the UV-VIS spectrometer. As a result, we can obtain the ITO thin films prepared at 10% oxygen gas flow ratio, thickness 150 nm with transmittance 85% and resistivity $8.1{\times}10^{-4}{\Omega}cm$ and surface roughness 5.01 nm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.74-75
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• 2007

We report on the characteristics of organic light-emitting diodes with Al cathode deposited by specially designed twin target sputter(TTS) system. It was found that the Al cathode films grown by TTS system were amorphous structure with nanocrystallines due to low substrate temperature during sputtering process. Effective confinement of high-density plasma between two Al targets lead to low temperature sputtering process on organic layer. Moreover, organic light-emitting diodes with Al cathode deposited by TTS system exhibited low leakage current density of $4{\times}10^{-6}\;mA/cm2$ at -6 V indicating plasma damage due to bombardment of energetic particles such as ions and $\gamma$-electrons was effectively restricted in the ITS system. Sputtering method using ITS system is expected to be applied in organic electronics and flexible displays due to its low temperature and plasma damage free deposition process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.3
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• pp.100-109
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• 2022

In this study, calibration technology that increases the alignment accuracy in large flexible flat panels was studied. For precise of calibration, a systematization of the calibration algorithm was established, and a calibration correction technique was studied to revise calibration errors. A coordinate systems of camera and UVW stage was established to get the global position of the mark, and equations for translational and rotational calibration were systematically derived based on geometrical analysis. Correction process for the calibration data was carried, and alignment experiments were performed sequentially in cases of the presence or absence of calibration-correction. Alignment results of both calibration correction and non-calibration correction showed accuracy performance less than 1㎛. On the other hand, the standard deviation in calibration-correction is smaller than non-calibration correction. Therefore, calibration correction showed improvement of the alignment repeatability.