• Title/Summary/Keyword: flexible PCB

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Effect of surface treatment on thermo-compression bonding properties of electrodes between printed circuit boards (표면처리에 따른 인쇄회로기판의 열압착 접합 특성 평가)

  • Lee, Jong-Gun;Lee, Jong-Bum;Choi, Jung-Hyun;Jung, Seong-Boo
    • Proceedings of the KWS Conference
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    • 2010.05a
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    • pp.81-81
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    • 2010
  • 전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

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Automatic Optical Inspection of PCB PADs for AFVI (AFVI를 위한 PCB PAD의 자동 광학 검사)

  • Mun, Sun-Hwan
    • Proceedings of the Optical Society of Korea Conference
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    • 2006.07a
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    • pp.469-471
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    • 2006
  • This paper describes a efficient insepction method of PCB PADs for AFVI. The methods for PCB inspection have been tried to detect the defects in PCB PADs, but their low detection rate results from pattern variations that are originating from etching, printing and handling processes. The adaptive inspection method has been newly proposed to extract minute defects based on dynamic segments and filters. The vertexes are extracted from CAM master images of PCB and then a lot of segments are constructed in master data. The proposed method moves these segments to optimal directions of a PAD contour and so adaptively matches segments to PAD contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Experimental results show that proposed methods are found to be effective for flexible defects detection.

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Electric Circuit Fabrication Technology using Conductive Ink and Direct Printing

  • Jeong, Jae-U;Kim, Yong-Sik;Yun, Gwan-Su
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.12.1-12.1
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    • 2009
  • For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

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Fabrication and Reliability Test of Device Embedded Flexible Module (디바이스 내장형 플렉시블 전자 모듈 제조 및 신뢰성 평가)

  • Kim, Dae Gon;Hong, Sung Taik;Kim, Deok Heung;Hong, Won Sik;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.84-88
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    • 2013
  • These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

Fabrication of Folded Monopole Antenna for Quintuple Band Mobile Phone Handset (5밴드 휴대폰용 폴디드 모노폴 안테나 제작)

  • Jang In-Seok;Son Tae-Ho;Lee Jae-Ho
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.8 s.111
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    • pp.713-718
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    • 2006
  • We designed and fabricated, in this paper, a quintuple band folded monopole antenna for the mobile phone handset that can be provided multiple mobile services. Antenna design was based on the compensation of series antenna capacitance with the expansion of physical antenna length by the proper folding structure. It's shown that this antenna satisfies quintuple service band as CDMA/GSM/DCS/USPCS/WCDMA, and is more cost competitive than conventional metal plate pressing method by applying on flexible PCB technology. Measured maximum gain on quintuple band were $-2.51{\sim}+1.82 dBi$, and radiation patterns were also shown nearly omnidirectional on all bands.

Design of flexible assembly line for printed circuit board(PCB) manufacturing of amdahl company

  • Park, Kwangtae;Adiga, Sadashiv
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 1992.04b
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    • pp.159-168
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    • 1992
  • 생산라인의 line balancing이 흐름생산에 있어서 일관된 생산을 하기 위한 필수조건이다. 여러 다양한 제품을 생산하는 printed circuit board(PCB) 공장에서의 line balancing을 얻기 위해서는 mixed model line balancing절차를 설명하고자 한다.

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Reconfigurable Beam-Steering Antenna Using Dipole and Loop Combined Structure for Wearable Applications

  • Ha, Sang-Jun;Jung, Young-Bae;Kim, Yong-Jin;Jung, Chang-Won
    • ETRI Journal
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    • v.34 no.1
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    • pp.1-8
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    • 2012
  • This paper proposes a reconfigurable beam-steering antenna using a bended dipole and a loop. The radiation patterns of the two antennas are cancelled or compensated, and headed towards a specific direction when the dipole and loop antenna are combined at a reasonable ratio. The proposed antenna can steer the beam directions by controlling the operation of two artificial switches. The proposed antenna was manufactured on a PCB (FR-4) and a flexible PCB (polyimide). In the case of the antenna that was fabricated on a PCB, the maximum beam directions were $+50^{\circ}$, $0^{\circ}$, and $-50^{\circ}$ in the azimuth direction using the two artificial switches, and the antenna gain was 1.96 dBi to 2.48 dBi in the operation bandwidth of 2.47 GHz to 2.53 GHz. Also, the antenna was fabricated on a flexible PCB and measured under various bending conditions for wearable applications.

Wireless Audio-visual Interface over UWB

  • Cui, Wei
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1491-1494
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    • 2008
  • Typically internal mobile LCD display modules are connected to the mobile product baseband PCB with flexible printed circuit board equipped with board-to-board connector. This solution has a drawback of limiting the product concept work to certain solutions that are based on connector size, location, flexible PCB length, bending, etc. in the display module. Also flexible printed circuit board based solutions are not completely optimized from reliability point of view, causing flex circuit board breakings. For the external displays in the PC or Home entertainment market, the cable solution is too expensive and resource demanding. The wireless solution has obvious advantages over reliability, low cost and flexibility. This paper describes a wireless audio-visual interface solution.

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Development of a Dipstick Gage Type Small Engine oil Deterioration Detection Sensor (딥스틱게이지형 소형 엔진열화감지센서 개발)

  • Chun, Sang Myung
    • Tribology and Lubricants
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    • v.29 no.2
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    • pp.77-84
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    • 2013
  • A small engine-oil-deterioration detection sensor was developed and installed at the tip of a dipstick gage. The sensor part was manufactured using printed circuit board (PCB) manufacturing technology. A set of sensor covers was installed in order to protect the sensor and realize good signal stability. The small engine-oil-deterioration detection sensor system comprised a dual sensor having etched copper electrodes coated with gold and ceramic, a flexible PCB (FPCB) acting as electric wire, and a dummy PCB with only a lock connector. The sensor can easily be installed by insertion through the guide tube of a dipstick gage. Thus, a driver can easily handle it without further installation equipment. The sensor can determine the level of deterioration in the engine oil by estimating the corresponding dielectric constant of the engine oil.