• 한국도로학회논문집
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• 제11권3호
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• pp.33-40
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• 2009

폐타이어 고무분말은 도로 유지 및 보수제로 아스팔트 바인더의 개질제로 사용되고 있다. 도로보수제인 폐타이어 고무분말 개질 아스팔트 (crumb rubber modified asphalt, CRMA) 실란트에 필요한 접착특성은 저온에서 아스팔트 바인더의 취성과 접착파괴특성 때문에 주목받고 있다. 본 연구에서는 저온에서 CRMAs의 개질제로서 유연제의 영향을 조사하였다. 저온에서 CRMAs의 특성은 침입도, 연화점, 인장 및 인장접착시험을 통하여 측정하였다. 유연제를 도입한 CRMAs에서 CR과 아스팔트바인더의 연성변형이 증가함에 따라 인장접착강도와 변형률이 증가하였다. 저온영역에서 CRMAs의 인장특성과 접착특성은 유연제의 함량이 중요한 요소임을 발견하였다.

• Transactions on Electrical and Electronic Materials
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• 제14권4호
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• pp.199-202
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• 2013

In order to study the effect of reactive diluents on the electrical insulation breakdown strength and mechanical properties of, a polyglycol and an aliphatic epoxy were individually introduced to an epoxy system. Reactive diluents were used in order to decrease the viscosity of the epoxy system; polyglycol acted as a flexibilizer and 1,4-butanediol diglycidyl ether (BDGE) acted as an aliphatic epoxy, which then acted as a chain extender after curing reaction. The ac electrical breakdown strength was estimated in sphere-to-sphere electrodes and the electrical breakdown strength was estimated by Weibull statistical analysis. The scale parameters of the electrical breakdown strengths for the epoxy resin, epoxy-polyglycol, and epoxy-BDGE were 45.0, 46.2, and 45.1 kV/mm, respectively. The flexural and tensile strengths for epoxy-BDGE were lower than those of the epoxy resin and those for epoxy-polyglycol were lower than those of the epoxy resin.

• Transactions on Electrical and Electronic Materials
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• 제14권6호
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• pp.317-320
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• 2013

Partial discharge resistance for the epoxy systems with two diluents was investigated in the rod-plane electrodes arrangement, and the effect of electric frequency on the partial discharge resistance was also studied. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and 1,4-butanediol diglycidyl ether (BDGE) or polyglycol (PG) as a reactive diluent was introduced to the DGEBA system, in order to decrease the viscosity of the DGEBA epoxy system. BDGE was acted as a chain extender, and PG acted as a flexibilizer, after the curing reaction. To measure the partial discharge resistance, 5 kV alternating current (ac) with three different frequencies (60, 500 and 1,000 Hz) was applied to the specimen in a rod-plane electrode arrangement, at $30^{\circ}C$. PG had a good effect, while BDGE had a bad effect on the partial discharge resistance of the DGEBA system, regardless of the electric frequency.

• Transactions on Electrical and Electronic Materials
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• 제15권2호
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• pp.77-80
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• 2014

The effect of reactive diluents on the ac electrical treeing in epoxy/nanosilicate systems was studied, in a needle-plate electrode geometry. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and layered silicate was used as a nano-sized filler. Polyglycol (PG) or 1,4-butanediol diglycidyl ether (BDGE) was introduced as a reactive diluent to the DGEBA/nanosilicate system, in order to decrease the viscosity of the nanocomposite system. PG acted as a flexibilizer, and BDGE acted as a chain extender, after the curing reaction. To measure the treeing propagation rate, a constant alternating current (ac) of 10 kV/4.2 mm (60 Hz) was applied to the specimen, in a needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. When 10 kV/4.2 mm (60 Hz) was applied, the treeing propagate rate in the DGEBA system was $1.10{\times}10^{-3}$ mm/min, and that in the DGEBA/PG system was $1.05{\times}10^{-3}$ mm/min. As 1.5 wt% of nanosilicate was added to the DGEGA/PG system, the propagation rate was $0.33{\times}10^{-3}$ mm/min. This meant that the nano-sized layered silicates would act as good barriers to treeing propagation. The effect of chlorine content was also studied, and it was found that chlorine had a bad effect on the electrical insulation property of the epoxy system.

• Transactions on Electrical and Electronic Materials
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• 제14권6호
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• pp.308-311
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• 2013

The effect of an electric field on the ac electrical treeing in various epoxy/reactive diluent systems was studied in a needle-plate electrode geometry. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and 1,4-butanediol diglycidyl ether (BDGE) or polyglycol (PG) as a reactive diluent was introduced to the DGEBA system, in order to decrease the viscosity of the DGEBA epoxy system. BDGE was acted as a chain extender, and PG acted as a flexibilizer, after the curing reaction. To measure the treeing initiation time and the propagation rate, three constant alternating currents (ac) of 10, 13 and 15 kV/4.2 mm (60 Hz) were applied to the specimen, in a needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. When 10 kV/4.2 mm (60 Hz) was applied, the treeing initiation time and the propagation rate in the DGEBA system were 356 min and $1.10{\times}10^{-3}$ mm/min, respectively, those in the DGEBA/BDGE system were 150 min and $1.14{\times}10^{-3}$ mm/min, respectively. Those in the DGEBA/PG system were 469 min and $1.05{\times}10^{-3}$ mm/min, respectively. As 15 kV/4.2 mm (60 Hz) was applied, the propagation rate in the DGEBA system was $5.41{\times}10^{-3}$ mm/min, and that in the DGEBA/PG system was $1.42{\times}10^{-3}$ mm/min. These values meant that PG could be used as a reactive diluent in the DGEBA system, without the deterioration of the insulation breakdown property.

• Korean Chemical Engineering Research
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• 제47권2호
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• pp.203-207
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• 2009

소형 반도체 접착에 쓰이는 비전도성 고분자 접착제에서 발생하는 문제점으로는 접착소재와 칩 또는 기판 간의 열 팽창계수 차이에 의한 박리, 크래킹 및 접착력 부족 등이 있다. 이러한 결점의 보완을 위하여 무기입자를 첨가한 고분자 복합소재를 통해 접착제의 열팽창계수를 낮추거나, 접착소재에 유연성 첨가제를 첨가하는 방법 등이 사용되고 있다. 본 연구에서는 양 말단에 아민기를 가지는 아미노 변성 실록산(AMS)의 함량을 1, 3, 5 phr로 변화시켜 실록산/에폭시 복합재를 제조하였다. 그 결과, 실록산의 첨가는 유리전이 온도를 $134^{\circ}C$에서 $122^{\circ}C$까지, 모듈러스를 2,425 MPa에서 2,143 MPa까지 감소시켰으며, 열팽창계수는 67 ppm/에서 71 ppm/까지 상승시켰다. 실록산은 유연성 부여에는 효과를 나타냈지만, 유리전이온도의 감소를 가져오는 것을 확인하였다.