Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Effect of Reactive Diluents on the AC Electrical Treeing in Epoxy/Nanosilicate Systems

  • Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
  • Received : 2014.01.22
  • Accepted : 2014.02.03
  • Published : 2014.04.25
Download PDF
⟨ Previous Next ⟩

Abstract

The effect of reactive diluents on the ac electrical treeing in epoxy/nanosilicate systems was studied, in a needle-plate electrode geometry. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and layered silicate was used as a nano-sized filler. Polyglycol (PG) or 1,4-butanediol diglycidyl ether (BDGE) was introduced as a reactive diluent to the DGEBA/nanosilicate system, in order to decrease the viscosity of the nanocomposite system. PG acted as a flexibilizer, and BDGE acted as a chain extender, after the curing reaction. To measure the treeing propagation rate, a constant alternating current (ac) of 10 kV/4.2 mm (60 Hz) was applied to the specimen, in a needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. When 10 kV/4.2 mm (60 Hz) was applied, the treeing propagate rate in the DGEBA system was $1.10{\times}10^{-3}$ mm/min, and that in the DGEBA/PG system was $1.05{\times}10^{-3}$ mm/min. As 1.5 wt% of nanosilicate was added to the DGEGA/PG system, the propagation rate was $0.33{\times}10^{-3}$ mm/min. This meant that the nano-sized layered silicates would act as good barriers to treeing propagation. The effect of chlorine content was also studied, and it was found that chlorine had a bad effect on the electrical insulation property of the epoxy system.

Keywords

References

  1. J. Y. Lee, M. J. Shim and S. W. Kim, Polym. Eng. Sci., 39, 1993 (1999) [DOI: http://dx.doi.org/10.1002/pen.11592].
  2. Y. S. Cho, M. J. Shim and S. W. Kim, Mater. Chem. Phys., 66, 70 (2000) [DOI: http://dx.doi.org/10.1016/S0254-0584(00)00272-8].
  3. R. Sarathi, R. K. Sahu and P. Rajeshkumar, Mater. Sci. Eng.: A, 445, 567 (2007) [DOI: http://dx.doi.org/10.1016/j.msea.2006.09.077].
  4. P. O. Henk, T. W. Kortsen and T. Kvarts, High Perform. Polym., 11, 281 (1999) [DOI: http://dx.doi.org/10.1088/0954-0083/11/3/304].
  5. M. Ehsani, Z. Farhadinejad, S. Moemen-bellah, S. M. Bagheralavi, M. M. S. Shrazi and H. Borsi, 26th Internal Power System Conference, Tehran, Iran, 11-E-CAM-2359 (2011).
  6. P. Bajaj, N. K. Jha and A. Kumar, J. Appl. Polym. Sci., 56, 1339 (1995) [DOI: http://dx.doi.org/10.1002/app.1995.070561015].
  7. Y. Xu, D. D. L. Chung and C. Mroz, Composites: Part A, 32, 1749 (2001) [DOI: http://dx.doi.org/10.1016/S1359-835X(01)00023-9].
  8. A. A. Wazzan, H. A. Al-Turaif and A. F. Abdelkader, Polymer- Plastics Technology and Engineering, 45, 1155 (2006) [DOI: http://dx.doi.org/10.1080/03602550600887285].
  9. T. Tanaka, G. C. Montanari and R. Mulhaupt, IEEE Trans. Dielectr. Electr. Insul., 11, 763 (2004) [DOI: http://dx.doi.org/10.1109/TDEI.2004.1349782].
  10. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, Intern. Sympos. Electr. Insulating Materials, Kitakyushu, Japan, pp. 239 (2005).
  11. J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul. 17, 1516 (2010) [DOI: http://dx.doi.org/10.1109/TDEI.2010.5595553].
  12. D. J. Suh and O. O. Park, J. Appl. Polym. Sci., 83, 2143 (2002) [DOI: http://dx.doi.org/10.1002/app.10166].
  13. J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul. 17, 1516 (2010) [DOI: http://dx.doi.org/10.1109/TDEI.2010.5595553].
  14. J. J. Park, Trans. Electr. Electron. Mater., 14, 278 (2013) [DOI: http://dx.doi.org/10.4313/TEEM.2013.14.5.278].
  15. L. P. Witnauer, H. B. Knight, W. E. Palm, R. E. Koos, W. C. Ault, and D. Swern, Ind. Eng. Chem., 47, 2304 (1955) [DOI: http://dx.doi.org/10.1021/ie50551a034].