• Nuclear Engineering and Technology
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• 제48권1호
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• pp.182-188
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• 2016

In this paper, a feasible strategy for the recycling of nuclear graphite is reported, based on the formation mechanism and the removal of carbon-14 by micro-oxidation. We investigated whether ground micro-oxidation graphite could be used as a filler to make new recycled graphite and which graphite/pitch coke ratio will give the recycled graphite outstanding properties (e.g., apparent density, flexural strength, compressive strength, and tensile strength). According to the existing properties of nuclear graphite, the ratio of graphite to pitch coke should not exceed 3. The recycled reactor graphite has been proven superior in density, strength, and thermal conductivity. The micro-oxidation process enhances the strength of the recycled graphite because there are more pores and unsmooth surfaces on the oxidized graphite particles, which is beneficial for the access of the pitch binder and leads to efficient joint adhesion among the graphite particles.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.333-336
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• 2008

We have studied on optical properties of advanced S-IPS with a fine pitch electrode and a new finger design. Transmittance of panel increases with decreasing of width and angle of finger electrode. In order to improve transmittance, fine pitch electrode of ${\sim}2{\mu}m$ and rubbing angle of 10 degree have been adopted. Various optical performances are defined as the function of finger design and field intensify across the IPS pixel electrodes. We have developed the advanced electrode structures with a high performance. As a result, the optical properties of 42" full HD with 120Hz frequency shows high transmittance over 5%, contrast ratio of 1800:1, gray-to-gray response time of 4.4ms, respectively. And also we have studied that the moving picture quality of IPS LCD is related with design parameters of IPS cells and finger shape.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.61-64
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• 2008

We investigated experimentally the influence of the generation efficiency for excited Xe atoms on ultra-fine horizontal cell pitch AC PDPs. In the case of a 0.1 mm cell pitch, the sustain voltage increased; however, the generation efficiency was equal to or higher than for the conventional 0.22 mm cell pitch.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.189-195
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• 2004

A 10 Gb/s limiting amplifier IC with the emitter area of $1.5{\times}10{\mu}m^2$ for optical transmission system was designed and fabricated with a AIGaAs/GaAs HBTs technology. In this stud)', we evaluated fine pitch bump using WL-CSP (Wafer Level-Chip Scale Packaging) instead of conventional wire bonding for interconnection. For this we developed WL-CSP process and formed fine pitch solder bump with the $40{\mu}m$ diameter and $100{\mu}m$ pitch on bonding pad. To study the effect of WL-CSP, electrical performance was measured and analyzed in wafer and package module using WL-CSP. In a package module, clear and wide eye diagram openings were observed and the riselfall times were about 100ps, and the output" oltage swing was limited to $600mV_{p-p}$ with input voltage ranging from 50 to 500m V. The Small signal gains in wafer and package module were 15.56dB and 14.99dB respectively. It was found that the difference of small signal gain in wafer and package module was less then 0.57dB up to 10GHz and the characteristics of return loss was improved by 5dB in package module. This is due to the short interconnection length by WL-CSP. So, WL-CSP process can be used for millimeter wave GaAs MMIC with the fine pitch pad.

• Design & Manufacturing
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• 제14권3호
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• pp.17-22
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• 2020

As devices such as smartphones, tablet PC, and wearable devices have been miniaturized, the connectors that go into the devices are also designed to be very small. The connector combines the plug and the receptacle to transfer electricity. As devices are miniaturized, the contact shape is formed by partially thinning the thickness of the raw material of the terminal in order to lower the coupling height of the plug and receptacle. The product used in this study is a receptacle terminal used for 0.4mm pitch board to board connector among fine pitch connectors. When the material thickness is reduced by forging the receptacle terminal, the width change of the pin is checked. To reduce the thickness of the material by forging, pre-notching is applied in the first step, forging in the second step, and notching in the third step. After forming the width dimension of the pin to 0.28 mm in the pre-notching process, in the forging process, the material thickness 0.08 mm and 0.02 mm (25%) were forged and the thickness was changed to 0.06 mm and the width change amount of the pin was measured. The facility produced 10,000 pieces at 400 SPM using a Yamada Dobby (MXM-40L) press, and thirty pins were measured and the average value was shown. After forging by using C5210-H (HP) and NKT322-EH, which are frequently used in connectors, analyze the amount of change in each material. The effect of punching oil on forging is investigated by appling FM-200M, which is highly viscous, and FL-212, fast drying oil. This study aims to minimize mold modification by predicting the amount of material change after forging.

• 한국음향학회지
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• 제42권1호
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• pp.7-15
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• 2023

최근 차량 내 공기 질에 대한 관심이 증가함에 따라 공기 질 측정을 위한 미세먼지 감지 센서의 사용이 보편화되고 있다. 차량 내 에어컨 시스템에 설치되는 미세먼지 감지 센서 내에는 센서에 직접적으로 먼지가 가라앉지 않도록 하기 위한 축류팬이 삽입되어 있다. 센서 작동 시 축류팬의 회전으로 인한 유동 소음은 미세먼지 감지 센서의 주요 소음원으로 작용한다. 차량의 전동화가 급격화가 진행되면서 이러한 유동소음은 미세먼지센서의 제품 경쟁력의 하나로 인식되고 있다. 본 연구에서는 이러한 미세먼지센서용 소형 축류팬의 유동 성능을 개선하여 동일 유량에서 소음을 점감하였다. 먼저 대상 소형 축류팬의 공기역학적 성능을 분석하기 위해 약 2000만 개의 격자로 구성된 가상 팬 성능시험기를 구축하였다. 또한, 유량의 정확한 예측 뿐만 아니라 유동소음의 직접 계산을 위하여 압축성 대와류모사법을 사용하여 유동장을 모사하였다. 수치방법의 유효성은 예측결과와 실험 결과와의 비교를 통하여 확인하였다. 유효성이 검증된 수치 기법을 이용하여 피치각이 유동 성능에 미치는 영향을 분석하였고, 유량을 최대화할 수 있는 피치각을 도출하였다. 최적 피치각을 적용한 축류팬을 사용했을 때 유량은 8.1 % 증가하고 동일 유량에서 소음이 0.8 dBA 감소함을 확인하였다.

• 공업화학
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• 제24권4호
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• pp.402-406
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• 2013

본 연구에서는 납사 크래킹 잔사유로부터 용융전기방사용 핏치가 열처리 개질 방법에 의하여 제조되었다. 개질된 핏치의 연화점과 물성은 질소유량, 열처리 온도 및 반응시간 같은 개질 조건에 따라 영향을 받았다. 이중에서 열처리온도가 핏치의 분자량 분포 및 연화점에 큰 영향력을 미쳤다. 열처리 온도가 증가함에 따라서 표면 작용기들의 분해와 고리화 반응으로 C/H 몰비와 평균분자량이 증가하였다. 또한, 벤젠 불용분(BI)과 퀴놀린 불용분(QI)값이 감소되었고, 분자량 분포의 폭이 더 좁아지는 것으로 보여주었다. 연화점이 $155^{\circ}C$인 개질 핏치로부터 용융전기방사법을 이용하여 $4.8{\mu}m$의 직경을 갖는 탄소섬유를 얻을 수 있었다. 용융전기방사법이 저섬경화 섬유를 제조하는데 기존의 용융방사법보다 더 용이할 것으로 여겨진다.

• 한국전기전자재료학회논문지
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• 제33권2호
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• pp.105-108
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• 2020

In this study, experiments and simulations were conducted for a 1,200-V-class trench Si insulated-gate bipolar transistor (IGBT) with a small cell pitch below 2.5 ㎛. Presently, as a power device, the 1,200-V-class trench Si IGBT is used for automotives including electric vehicles, hybrid electric vehicles, and industrial motors. We obtained a breakdown voltage of 1,440 V, threshold of 6 V, and state voltage drop of 1.75 V. This device is superior to conventional IGBTs featuring a planar gate. To derive its electrical characteristics, we extracted design and process parameters. The cell pitch was 0.95 ㎛ and total wafer thickness was 140 ㎛ with a resistivity of 60 Ω·cm. We will apply these results to achieve fine-pitch gate power devices suitable for electrical automotive industries.

• 한국음향학회:학술대회논문집
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• 한국음향학회 1994년도 FIFTH WESTERN PACIFIC REGIONAL ACOUSTICS CONFERENCE SEOUL KOREA
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• pp.963-970
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• 1994

In speech signal processing, it is very important to detect the pitch exactly. The algorithms for pitch extraction that have been proposed until now are not enough to detect the fine pitch in speech signal. Thus we propose the new algorithm which takes advantage of the G-peak extraction. It is the method to find MZCI(maximum zer-crossing interval) which is defined as cut-off bandwidth rate of LPF (low pass filter)and detect the pitch period of the voiced signals. This algorithm performs robustly with a gross error rate of 3.63% even in 0 dB SNR environment. The gross error rate for clean speech is only 0.18%. Also it is able to process all course with speed.