• Tribology and Lubricants
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• v.11 no.4
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• pp.28-34
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• 1995

PTFE has good mechanical and chemical stability at wide temperature range, and more over, shows a low value of friction coefficient. On the other hand, it shows cold flow and high wear rate. However, these short comings can be overcome by adding various fillers. In this experiment, PTFE and polyimide powder were mixed into composite and its tribological characteristics was investigated. 100% polyimide was also tested for comparison. The countefface material was a stainless steel (SUS304). Friction and wear tester of ring-on-block type was used at room temperature and under atmosphere. After the wear test, the worn surfaces were examined by optical microscope. The test results show that PTFE-polyimide composite generates. the wear transfer film on both sides of the friction surfaces, and, the friction coefficient and the wear rates are relatively low. 100% polyimide generated little wear transfer films, showed high friction and wear rates, and also showed some problems of vibration and noise. It even damaged the stainless steel countefface. It was concluded that 100% polyimide does not generate transfer film well because its shear resistanbe is high and it stickslips, thus, friction coefficients and wear rates are high. In case of PTFE-polyimide composite, on the other hand, transfer film containing sufficient PTFE adheres and remains on both wear surfaces well enough because PTFE has low shear resistance. Polyimide particles in the composite were proved to be able to bear normal load and does not show stick-slip because they are covered with transfer film containing much PTFE.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.6-11
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• 2019

For a wider application of laser direct patterning, selective laser ablation of indium tin oxide (ITO) film on transparent oxide semiconductor (TOS) thin film was carried out using a diode-pumped Q-switched Nd:YVO₄ laser at a wavelength of 1064 nm. In case of the laser ablation of ITO on indium gallium zinc oxide (IGZO) film, both of ITO and IGZO films were fully etched for all the conditions of the laser beams even though IGZO monolayer was not ablated at the same laser beam condition. On the contrary, in case of the laser ablation of ITO on zinc oxide (ZnO) film, it was possible to etch ITO selectively with a slight damage on ZnO layer. The selective laser ablation is expected to be due to the different coefficient of thermal expansion (CTE) between ITO and ZnO.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.9
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• pp.835-842
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• 2000

Film boiling heat transfer of the subcooled turbulent liquid film flow on a horizontal plate was investigated by theoretical and experimental studies. In the theoretical analysis, by solving the integral energy and momentum equations analytically, some generalized expressions for Nusselt number was deduced. Next, by comparing the deduced equations with the experimental data on the turbulent film boiling heat transfer of the subcooled thin liquid film flow, the semi-empirical relation between the Nusselt number based on the modified heat transfer coefficient and the Reynolds number was obtained. The correlating equation was very similar to that of the turbulent heat transfer in a single phase flow, and it was found that the heat transfer was dissipated to increase the liquid temperature.

• 유체기계공업학회:학술대회논문집
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• 2001.11a
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• pp.334-338
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• 2001

In order to investigate the effects of various injection hole shapes on the film cooling of turbine blade, three test models having cylindrical and shaped holes were used. A three-dimensional Navier-Stokes code with standard k-$\epsilon$ model was used to compute the film cooling coefficient on the film cooled turbine blade. Over 330,000 grids were used to compute the flow over the blade. Mainstream Reynolds number based on the cylinder diameter was $7.1{\times}10^4$. The turbulence intensity kept at $5.0\%$ for all inlets. The effect of coolant blowing ratio was studied for various blowing ratios. For each blowing ratios, wall temperatures around the surface of test model were calculated. Temperature was visualized using cartesian cut-cell method to obtain traces of the injected secondary air on the test surface, so we could interpret the film effectiveness as temperature distributions.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.430-431
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• 2006

Thermoelectric thick film was fabricated by screen printing process with using p-type Bi-Te-Sb powders. The powder was synthesized by melting, milling and sintering process and hydrogen reduced to enhance the thermoelectric property. The thick film of Bi-Te-Sb powder was fabricated by screen printing method and baked at the optimized conditions. The thermal conductivity, the electrical resistivity and Seeback coefficient of thick film were measured and the thermoelectric performance was analyzed in terms of film characteristics and its microstructure. Finally, the feasibility of thermoelectric thick film into micro cooling device on CPU chip was discussed in this study.

• Polymer(Korea)
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• v.34 no.3
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• pp.220-225
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• 2010

The optical properties and dimensional stability of polyethersulfone(PES) retardation film have been studied as function of chain orientation and the temperature applied to PES retardation film. It was confirmed that the appropriate retardation values of $R_e$ and $R_{th}$ for the retardation film application were able to obtain by the chain orientation and these values could be controlled by the chain relaxation through the thermal annealing process. It was found that unstable $R_e$ and $R_{th}$ values were shown by the repeated cooling and heating applied to the retardation films but this could be stabilized by means of the annealing process after stretching of PES film. The dimensional shrinkage due to the chain orientation was found as temperature increase and the intrinsic thermal expansion of PES appeared after shrinking. The shrinkage of PES films affected by the chain orientation and thermal annealing dramatically but the effect on the coefficient of thermal expansion was found to be negligible.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.1-7
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• 2005

The effect of trimming process to adjust accurate resistance of a thin-film resistor was studied with respect to low temperature coefficient of resistance(TCR) and high precision. The characteristics of a thin-film resistor fabricated by sputtering were investigated depending on trimming condition and annealing temperature. Measured results showed that the characteristic of a thin-film resistor was degraded with increased trimming speed. However, an average resistance deviation and a TCR were improved to $0.26\%$ and 52.77[ppm/K], respectively, through annealing treatment. Also, thin-film resistors with 1 k$\Omega$ and 10k$\Omega$ showed better performance compared to a resistor with 100k$\Omega$. The Optimal trimming speed and annealing temperature were 20mm/sec and 539K, respectively, and under this optimal condition, a thin-film resistor with an average resistance deviation of $0.31\%$ and a TCR of below 10[ppm/K] was obtained.

• Journal of the Korean institute of surface engineering
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• v.33 no.5
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• pp.319-328
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• 2000

Silver is known to have such characteristics as low shear strength, good transfer-film forming tendency, and good corrosion resistance. Silver thin films have been prepared by ion plating of physical vapour deposition (PVD) using both argon gas pressure and bias voltage of processing condition. After the silver films were prepared, the properties in them were examined by gas pressure and bias voltage of substrate. Their morphology and crystal orientation were investigated by scanning electron microscopy (SEM) and X-ray diffractor. The properties of film were, also, studied to relate with morphology, X-ray diffraction pattern, and friction coefficient at vacuum ambient. The friction coefficient was stabilized remarkably on deposited films with increasing argon pressure for deposition. Also, the effect of increasing of the bias voltage for deposition resulted in lower friction coefficient and stability in $1.7$\times$10^{-4}$ torr. On the contrary, behavior of friction coefficient was stabilized on deposited films with decreasing the bias voltage in $1.7$\times$10^{-5}$ torr for deposition.

• Nuclear Engineering and Technology
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• v.56 no.2
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• pp.536-545
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• 2024

Radioactive iodine is a representative fission product to be quantified for the safety assessment of nuclear facilities. In integral severe accident analysis codes, the iodine behavior is usually described by a multi-physical model of iodine chemistry in aqueous phase under radiation field and mass transfer through gas-liquid interface. The focus of studies on iodine source term evaluations using the combination approach is usually put on the chemical aspect, but each contribution to the iodine amount released to the environment has not been decomposed so far. In this study, we attempted the decomposition by revising the two-film theory of molecular-iodine mass transfer. The model involves an effective overall mass transfer coefficient to consider the iodine chemistry. The decomposition was performed by regarding the coefficient as a product of two functions of pH and the overall mass transfer coefficient for molecular iodine. The procedure was applied to the EPICUR experiment and suppression chamber in BWR.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.6
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• pp.674-682
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• 1998

In this study, thin film evaporation of water on low-fin tubes were experimentally investigated. Five low-fin tubes with different fin spacing and fin height were tested. Test range covered 0.146kg/ms $\leq$$\Gamma$$\leq$0.219kg/ms and 10㎾/$\m^2$$\leq$q $\leq$70㎾/$\m^2$. Saturation temperature was loot. Compared with the plain tube, low fin tubes enhanced the water film evaporation from 60% to 100%. Tubes with fin spacing smaller than 2mm and fin height higher than 1mm performed better than tubes with other fin configuration. However, when fin spacing was too small at high film flow or fin height was too high at low film flow, the performance decreased. The heat transfer coefficient slightly increased as the flow rate increased. Correlations are developed based on present data.