• 한국지반환경공학회 논문집
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• 제6권2호
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• pp.31-38
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• 2005

유동성 재료는 자기수평능력을 갖고 있으며, 액체와 같은 물질로 최대단위중량의 95~100 %의 자기 다짐율을 발휘할수 있다. 유동성 재료는 노동력이 적게 들고, 시공속도를 높일수 있으며, 접근이 어려운 장소에도 적용이 가능하면서도 재굴착이 용이한 장점이 있다. 따라서 각종 트렌치, 굴착작업, 지중구조물, 오수 및 유틸리티 관과 지중의 공동충전 등에 이용된다. 본 연구의 목적은 고함수비의 점성토와 폐스티로폼 입자, 안정재 등으로 구성된 유동성 재료의 공학적 특성을 평가하는 것이다. 이를 위하여 일축압축실험, 유동성 시험 및 모형충전성 실험을 실시하였으며 폐기물을 활용한 혼합토는 안정재의 양을 $1.0(kN/m^3){\sim}1.2(kN/m^3)$이상을 사용하면 유동성재료로서 사용가능한 것으로 나타났다.

• 한국세라믹학회지
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• 제51권6호
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• pp.549-553
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• 2014

$CoSb_3$-based skutterudite compounds are candidate materials for thermoelectric power generation in the mid-temperature range (600 - 900 K) because their thermoelectric properties can be enhanced by doping and filling. The joining property of thermoelectric module electrodes containing thermoelectric materials is of great importance because it can dominate the efficiency of the thermoelectric module. This study examined the properties of $CoSb_3$/Al/Ti/CuMo joined by the spark plasma sintering technique. Titanium thin foil was used to prevent the diffusion of copper into $CoSb_3$ and Aluminum thin foil was used to improve the adhesion between $CoSb_3$ and Ti. The insertion of an Aluminum interlayer between the Ti and $CoSb_3$ was effective for joining $CoSb_3$ to Ti by forming an intermediate layer at the Al-$CoSb_3$ boundary without any micro cracks. Specifically, the adhesion strength of the Ti/Al/$CoSb_3$ joining interface showed a remarkable improvement compared with our previous results, without deterioration of electrical property in the interface.

• 폴리머
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• 제38권2호
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• pp.144-149
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• 2014

일반사출성형은 공정 중 보압단계에서 캐비티에 높은 압력이 작용하여 성형품에 큰 잔류응력이 남게 된다. 또한 캐비티 내 위치 별로 압력분포가 달라 균일한 물성의 제품을 얻는데 한계가 있다. 다수 개 빼기 일반사출성형에서는 캐비티간 충전 불균형이 일어나 캐비티간 품질의 편차를 일으킨다. 이와 같은 한계를 극복하기 위해 사출압축성형 공정을 사용하는 경우가 많다. 본 연구에서는 다수 개 캐비티를 갖는 금형을 이용하여 일반사출성형과 사출압축성형을 비교 분석하였다. 실험과 해석을 통하여 연구를 수행하였으며 투명한 수지인 PC와 PS를 이용하여 시편에 나타나는 복굴절을 관찰하여 일반사출성형과 사출압축성형에서 나타나는 성형특성을 비교하였다. 연구결과, 사출 압축성형으로 제작된 시편에서 캐비티 내의 압력이 균일하여 복굴절과 성형수축률이 낮고 균일하게 나타났다. 그리고 일반사출성형에서 나타나는 캐비티간 충전 불균형에 의한 캐비티간 물성의 편차가 사출압축성형에서는 크게 줄어들었다. 본 연구를 통하여 사출압축성형은 다수 개 빼기 사출성형에서 캐비티 내 균일한 물성확보뿐만 아니라 캐비티간 품질 불균형을 해소하는데 유용함을 확인할 수 있었다.

• 한국의류학회지
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• 제17권2호
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• pp.301-306
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• 1993

Since the underquilt has an important role of supporting the human body in sleeping, it needs to sustain ample degrees of hardness, elasticity, humidity absorption, and warmth retention property and also to have the two ergonimical requirements : It should not be too soft to allow human bodies to sink in, and that it should be comfortable for humans to tum over in sleeping. This study aims to investigate the effect of the thermal insulation of the variation in weight applied to the underquilt. For this purpose, six items were selected as filling materials for the underquilt : cotton, wool, silk, down, polyester, cotton/ployester. Various weights were applied to each of the underquilts to survey the reduction tendency of its thermal insulation effect. The results are as follow : 1. The Thermal insulation effect of each underquilt decreased in an exponetial function as the weight on the underquilt was increased. 2. The thermal reduction curves according to the load weight insrease were shown to be constant in shape regardless of the weight increase. 3. At the weight of more than $25kg/m^2$ the degree of the thermal insulation effect of each underquilt was found to be in order of down>cotton>silk>polyester>wool>cotton/ployester. 4. The variation in load weight applied to each underquilt was shown to be in reverse correlation with the thermal insulation effect. An estimated regression formula can be made on the data.

• 한국표면공학회지
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• 제38권1호
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• pp.28-36
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• 2005

In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal organic chemical vapor deposition (MOCVD) and annealed at the temperature between 250℃ and 550℃ in various ambient gases. When the Cu thin films were annealed in the hydrogen ambience compared with oxygen ambience, sheet resistance of Cu thin films decreased and the breakdown of TaN diffusion barrier was not occurred and a stable Cu/TaN/Si structure was formed at the annealing temperature of 450℃. In addition, reflow properties of Cu thin films could be enhanced in H₂ ambient. With Cu reflow process, we could fill the trench patterns of 0.16～0.24 11m with aspect ratio of 4.17～6.25 at the annealing temperature of 450℃ in hydrogen ambience. It is expected that Cu reflow process will be applied to fill the deep pattern with ultra fine structure in metallization.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 추계 학술발표회
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• pp.749-758
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• 2010

Embankment Slope (or Fill Slope) is defined as artificial slope formed by the filling of soil or rocks on the original ground. Recently a lot of embankment failures and collapse has occurred due to the increase of torrential rainfall and typhoons. Embankment collapse has lead to a great loss of lives and property therefore there is a need to establish a systematic embankment slope management system that will handle the maintenance and repair of risky embankment slopes. The objective of this study is to establish an "Embankment Slope Management Method" for embankment slopes located along national highways all over Korea. The method for field investigation of embankment slopes was recommended and the system for investment priority determination was also developed. The factors that lead to the collapse of embankment slopes caused by natural calamities were also determined through the initial survey of embankment slopes located along river fronts and mountainous areas.

• 한국분말재료학회지
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• 제21권1호
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• pp.50-54
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• 2014

A powder-in-sheath rolling method was applied to a fabrication of a carbon nano tube (CNT) reinforced aluminum composite. A STS304 tube with an outer diameter of 34 mm and a wall thickness of 2 mm was used as a sheath material. A mixture of pure aluminum powders and CNTs with the volume contents of 1, 3, 5 vol was filled in the tube by tap filling and then processed to 73.5% height reduction by a rolling mill. The relative density of the CNT/Al composite fabricated by the powder-in-sheath rolling decreased slightly with increasing of CNTs content, but exhibited high value more than 98. The grain size of the aluminum matrix was largely decreased with addition of CNTs; it decreased from $24{\mu}m$ to $0.9{\mu}m$ by the addition of only 1 volCNT. The average hardness of the composites increased by approximately 3 times with the addition of CNTs, comparing to that of unreinforced pure aluminum. It is concluded that the powder-in-sheath rolling method is an effective process for fabrication of CNT reinforced Al matrix composites.

• 한국분말재료학회지
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• 제21권5호
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• pp.343-348
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• 2014

A powder-in-sheath rolling (PSR) process utilizing a copper alloy tube was applied to a fabrication of a multi-walled carbon nanotube (CNT) reinforced aluminum matrix composite. A copper tube with an outer diameter of 30 mm and a wall thickness of 2 mm was used as a sheath material. A mixture of pure aluminum powders and CNTs with the volume contents of 1, 3, 5 vol% was filled in the tube by tap filling and then processed to 93.3% height reduction by a rolling mill. The relative density of the CNT/Al composite fabricated by the PSR decreased slightly with increasing of CNTs content, but showed high value more than 98%. The average hardness of the 5%CNT/Al composite increased more than 3 times, compared to that of unreinforced pure Al powder compaction. The hardness of the CNT/Al composites was some higher than that of the composites fabricated by PSR using SUS304 tube. Therefore, it is concluded that the type of tube affects largely on the mechanical properties of the CNT/Al composites in the PSR process.

• Journal of electromagnetic engineering and science
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• 제6권4호
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• pp.235-243
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• 2006

In this paper, the fractal shape is applied to microstrip band pass filters and integrated on a high-resistivity Si substrate to solve conventional $2^{nd}$ harmonic problem. Conventional microstrip coupled line filters are popular in RF front ends, because they can be easily fabricated and integrated with other RF components. However, they typically have large second harmonics that can cause unwanted interference in interested frequency bands. Without any additional filters, the proposed Koch shape filters have suppressed the $2^{nd}$ harmonics by about -40 dB, so they can be used in systems such as direct conversion receiver with stringent harmonic suppression requirements.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.