• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.11-15
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• 2017

실리콘 칩을 적층하는 3D 멀티 플립칩 패키지의 경우 방열문제가 대두됨에 따라 접착 접합부의 열전도도 향상이 요구되고 있다. 본 연구에서는 플립칩 본딩용 비전도성 접착제(NCP)에 있어서 알루미나 필러의 첨가가 NCP의 물성 및 열전도도에 미치는 영향을 조사하였다. 알루미나 필러는 미세피치 플립칩 접속을 위해 평균입도 400 nm의 미세분말을 사용하였다. 알루미나 필러 함량이 0~60 wt%까지 증가함에 따라 60 wt% 첨가 시 0.654 W/mK에 도달하였다. 이는 동일 첨가량 실리카의 0.501 W/mK보다는 높은 열전도도이지만, 동일 함량의 조대한 알루미나 분말을 첨가한 경우에 비해서는 낮은 열전도도로, 미세 플립칩 본딩을 위해 입도가 미세한 분말을 첨가하는 것은 열전도도에 있어서는 불리한 효과로 작용함을 알 수 있었다. NCP의 점도는 40 wt% 이상에서 급격히 증가하는 현상을 나타내었는데, 이는 미세 입도에 따른 필러 간 상호작용의 증가에 기인하는 것으로, 미세피치 플립칩 본딩을 위해 열전도도가 우수한 미세 알루미나 분말을 사용하기 위해서는 낮은 점도를 유지하면서 필러 첨가량을 증가시킬 수 있는 분산방안이 필요한 것으로 판단되었다.

• Journal of Welding and Joining
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• 제25권5호
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• pp.45-50
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• 2007

The Ni-base superalloy GTD111 DS is used in the first stage blade of high power land-based gas turbines. Advanced repair technologies of the blade have been introduced to the gas turbine industry over recent years. The effect of the filler metal powder on Transient Liquid Phase bonding phenomenon and tensile mechanical properties was investigated on the GTD111 DS superalloy. At the filler metal powder N series, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid filler metal powder was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solids in the bonded interlayer grew from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The bond strength of N series filler metal powder was over 1000 MPa. and ${\gamma}'$ phase size of N series TLP bonded region was similar with base metal by influence of Ti, Al elements. At the insert metal powder M series, the Si element fluidity of the filler metal was good but microstructure irregularity on bonded region because of excessive Si element. Nuclear of solids formed not only from the base metal near the bonded interlayer but also from the remained filler metal powder in the bonded interlayer. When the isothermal solidification was finished, the content of the elements in the boned interlayer was approximately equal to that of the base metal. But boride and silicide formed in the base metal near the bonded interlayer. And these boride decreased with the increasing of holding time. The bond strength of M series filler metal powder was about 400 MPa.

• 펄프종이기술
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• 제39권4호
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• pp.7-13
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• 2007

Effects of pulp type, refining and filler type on the pore characteristics and physical properties of paper were investigated. HwBKP, SwBKP and BCTMP are used to study the effect of pulp type in this study. The effects of each filler (PCC, GCC and talc) and the combination of PCC/GCC were also studied. Highest bulk, pore volume and light scattering are obtained from BCTMP and PCC. It was found that the pore size and pore volume are important in light scattering in paper structure. It was found that PCC was the most effective filler for the improvement of the bulk and light scattering because of the increase in pore volume which can scatter light, but the increase of PCC content was not so effective in the improvement of bulk.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.814-817
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• 2003

The sintering behavior of $BaO-B_{2}O_{3}-ZnO$, which is Pb-free glass-ceramic system, was examined as functions of the composition and the amount and particle size of $Al_{2}O_{3}$ filler. Different kinds of modifiers were added and $Al_{2}O_{3}$ fillers with different particle sizes ($1.5{\mu}m$ and $4.5{\mu}m$) were added. The glass frit-filler composites were sintered in the temperature range $520{\sim}580^{\circ}C$. X-ray diffraction results revealed that some of the composites crystallized during sintering. Dielectric constant and thermal expansion coefficient the glass-ceramics were analyzed.

• Restorative Dentistry and Endodontics
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• 제29권6호
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• pp.520-531
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• 2004

The aim of this study was to investigate the effect of monomer and filler compositions on the rheological properties related to the handling characteristics of resin composites. Methods. Resin matrices that Bis-GMA as base monomer was blended with TEGDMA as diluent at various ratio were mixed with the Barium glass (0.7 um and 1.0 um), 0.04 um fumed silica and 0.5 um round silica. All used fillers were silane treated. In order to vary the viscosity of experimental composites, the type and content of incorporated fillers were changed, Using a rheometer, a steady shear test and a dynamic oscillatory shear test were used to evaluate the viscosity ($\eta$) of resin matrix, and the storage shear modulus (G'), the loss shear modulus (G"), the loss tangent ($tan{\delta}$) and the complex viscosity (${\eta}^*$) ofthe composites as a function of frequency ${\omega}{\;}={\;}0.1-100{\;}rad/s$. To investigate the effect of temperature on the viscosity of composites, a temperature sweep test was also undertaken. Results. Resin matrices were Newtonian fluid regardless of diluent concentration and all experimental composites exhibited pseudoplastic behavior with increasing shear rate. The viscosity of composites was exponentially increased with increasing filler volume%. In the same filler volume, the smaller the fillers were used, the higher the viscosities were. The effect of filler size on the viscosity was increased with increasing filler content. Increasing filler content reduced $tan{\delta}$ by increasing the G' further than the G". The viscosity of composites was decreased exponentially with increasing temperature.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.348-351
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• 2007

Recently, Nanotechnology becomes a major issue in most part of industries. Nanotechnology is expected to develop various application products due to nano material mired composites is improved physical and electrical properties compared to conventional composites materials. Dielectric and insulation materials need to develop and improve like other field about nanotechnology. In this paper, we reported dielectric dispersion by size(no filler, $1.2{\mu}m$, 500 nm, 10 nm), frequencies(60, 120, 1 kHz), and temperatures($30{\sim}170^{\circ}C$). Dielectric constant of composites materials with filler shows higher than composites materials without filler and increased depending on rising temperatures in low frequency region. It was the effect that nano-filler and impurities in composites contributed to electrical conductivity. And dielectric properties depending on temperatures shows to change in low frequency region dramatically We analyzed interfacial polarization in low frequency region($10^{-2}$ Hz) and oriented polarization in high frequency region($10^{-5{\sim}6}$ Hz) on composites materials.

• Elastomers and Composites
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• 제44권1호
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• pp.47-54
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• 2009

본 연구에서는 다양한 종류의 보강제를 혼합한 EPDM 컴파운드의 원적외선에 의한 가교 반응을 조사하였다. 보강제가 원적외선에 의한 가교 반응에 미치는 영향을 평가하기 위하여 컴파운드의 발열 온도 및 DSC 분석에 의한 가교도를 측정하였으며, 특히 원적외선에 의한 가교 특성을 비교하기 위하여 동일 조건에서 열풍에 의한 가교 반응을 조사하였다. 원적외선 가교 조건에서 카본블랙을 혼합한 EPDM 컴파운드는 입자크기가 증가함에 따라 열전도도가 증가하며 이에 따라 원적외선에 의한 가교도 역시 증가하였으나, 열풍에 의한 가교도의 변화에는 거의 영향을 주지 못하였다. 보강제 종류에 따른 원적외선 가교 특성 평가 결과, 열전도도가 높은 아세틸렌 블랙을 함유한 컴파운드의 가교도가 가장 높게 나타났으며, 열전도도가 유사한 카본블랙 및 침강실리카의 경우 상대적으로 원적외선 흡수 특성이 우수한 침강실리카 배합 컴파운드의 경우 원적외선에 의한 가교도가 높게 나타났다.

• 대한의용생체공학회:의공학회지
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• 제18권1호
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• pp.1-8
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• 1997

This study was performed to evaluate the effect of resin and filler type on the compressive strength of light-activated composite resins. Experimental composite resins containing either amorphous spherical silica or crushed quartz in two matrix resins of BisGMA/TEGDMA and UTMA/TEGDMA were prepared and the specimens of 3 m in diameter and 6m in length were made. Compressive test was subjected to a crosshead speed of 0.5 mm/min, and the fracture surFaces were examined by SEM. The compressive strength of UTMA-based composite resin was higher than that of BisGMA-based composite resin. The loading rate of spherical silica was higher than that of crushed silica when the size dis- tribution of fillers was same. Strength decrease of Bis-GMA-based composite resin was severer than that of UTMA-based composite resin in a $37^{\circ}$c water environment. Fracture surface showed that the composite resin failure developed along the matrix resin and the filler/resin interface region.

• Journal of the Korean Wood Science and Technology
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• 제37권4호
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• pp.310-319
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• 2009

대표적인 친환경 소재인 바이오복합재(bio-composite)의 제조를 위해 기질 고분자로는 생분해성 고분자인 polybutylene succinate (PBS)를 그리고 충전제(filler)로는 대나무 분말(bamboo flour, BF)을 사용하였다. 본 연구에서는 BF의 함량 및 입자 크기가 바이오복합재의 기계적 점탄성적 특성 및 열적 특성에 미치는 영향을 평가하였는데 천연충전제인 BF의 첨가에 따라 인장강도는 감소하였지만 점탄성적 및 열적 특성은 고분자와의 상호작용을 통해 보다 안정적인 결과를 보였다. 또한, 소수성을 나타내는 PBS와 친수성인 BF 사이의 낮은 계면 결합이 바이오복합재의 물성 저하에 영향을 미친다는 사실이 확인되었다.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• 제39권4호
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• pp.193-196
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• 2013

Artecoll (Artes Medical Inc., San Diego, CA, USA) has recently been developed as a permanent synthetic cosmetic filler. We experienced an inflammatory granuloma resulting from a previous injection of Artecoll at the upper lip, which was regarded as a rare side effect of this filler. A 50-year-old female patient complained of swelling, dull pain, and heat in the right upper nasolabial fold area, which had started one week before her visit to Kyungpook National University Hospital. The patient received topical steroid therapy at a local clinic, which was not effective. At the injection site, a hard nodule was palpated and erythema was observed with mild tenderness. Antibiotic treatment and subsequent incision and drainage did not result in complete cure of the facial swelling, and the facial swelling and pain persisted. Computed tomography showed a lesion approximately 1-cm in size without clear boundaries and relatively increased nodular thickening. Finally, a subdermal lesion was removed via an intraoral vestibular approach. The lesion was diagnosed as inflammatory granuloma by a permanent biopsy. The patient had healed at two months after the filler injection. Although the soft tissue filler is widely used for cosmetic purposes, there is potential for complication, such as the inflammatory granuloma should be considered before treatment.