• 제목/요약/키워드: filler materials

검색결과 781건 처리시간 0.032초

Preparation and Properties of the Fast-Curing γ-Ray-Shielding Materials Based on Polyurethane

  • Ni, Minxuan;Tang, Xiaobin;Chai, Hao;Zhang, Yun;Chen, Tuo;Chen, Da
    • Nuclear Engineering and Technology
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    • 제48권6호
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    • pp.1396-1403
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    • 2016
  • In this study, fast-curing shielding materials were prepared with a two-component polyurethane matrix and a filler material of PbO through a one-step, laboratory-scale method. With an increase in the filler content, viscosity increased. However, the two components showed a small difference. Curing time decreased as the filler content increased. The minimum tack-free time of 27 s was obtained at a filler content of 70 wt%. Tensile strength and compressive strength initially increased and then decreased as the filler content increased. Even when the filler content reached 60 wt%, mechanical properties were still greater than those of the matrix. Cohesional strength decreased as the filler content increased. However, cohesional strength was still greater than 100 kPa at a filler content of 60 wt%. The ${\gamma}$-ray-shielding properties increased with the increase in the filler content, and composite thickness could be increased to improve the shielding performance when the energy of ${\gamma}$-rays was high. When the filler content was 60 wt%, the composite showed excellent comprehensive properties.

중전기기용 Epoxy/SiO2 나노복합재료의 유전분산 연구 (Study on Dielectric Dispersion of Epoxy/SiO2 Nanocomposites using High Voltage Generator)

  • 안준호;박재준
    • 한국전기전자재료학회논문지
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    • 제20권4호
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    • pp.348-351
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    • 2007
  • Recently, Nanotechnology becomes a major issue in most part of industries. Nanotechnology is expected to develop various application products due to nano material mired composites is improved physical and electrical properties compared to conventional composites materials. Dielectric and insulation materials need to develop and improve like other field about nanotechnology. In this paper, we reported dielectric dispersion by size(no filler, $1.2{\mu}m$, 500 nm, 10 nm), frequencies(60, 120, 1 kHz), and temperatures($30{\sim}170^{\circ}C$). Dielectric constant of composites materials with filler shows higher than composites materials without filler and increased depending on rising temperatures in low frequency region. It was the effect that nano-filler and impurities in composites contributed to electrical conductivity. And dielectric properties depending on temperatures shows to change in low frequency region dramatically We analyzed interfacial polarization in low frequency region($10^{-2}$ Hz) and oriented polarization in high frequency region($10^{-5{\sim}6}$ Hz) on composites materials.

구리-알루미늄 이종재료의 브레이징 특성 향상에 관한 연구 (Study on the Improvement of Brazeability for Copper-Aluminum Dissimilar Materials Joint)

  • 정호신;배동수;고성우
    • 한국해양공학회지
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    • 제15권3호
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    • pp.49-57
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    • 2001
  • One of the most important considerations to braze Cu-Al dissimilar materials is control of brittle metallic compound which makes it difficult to obtain a sound brazed joint. Nowdays, several attempts were made to control the metallic compound. But effective method for controlling metallic compound was not established. In this point of view, commercially pure aluminum and copper were used as base metal and Al-Si-X and Zn-Al-X alloy systems were developed as filler metal. Brazing was carried out to find optimum conditions for Cu-Al dissimilar joint. The results obtained in this study were summarized as follows: 1) The joint brazed by Al-Si-X filler metal showed good brazeability and mechanical properties. The tensile strength of the joint brazed over solidus temperature was more than 90% of Al base metal. Especially, the joint brazed at liquidus temperature was fractured in the Al base metal. 2) Fluorides fluxes(a mixture of potassium fluoro-aluminates) were used to improve surface cleanliness of base metal and wettability of Al-Si-X filler metal. It was melted at the temperature about 1$0^{\circ}C$ lower than that of the filler metal, and made appropriate brazing environment. Therefore, it could be a proper selection as flux.

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Effects of Silica Filler and Diluent on Material Properties of Non-Conductive Pastes and Thermal Cycling Reliability of Flip Chip Assembly

  • Jang, Kyung-Woon;Kwon, Woon-Seong;Yim, Myung-Jin;Paik, Kyung-Wook
    • 마이크로전자및패키징학회지
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    • 제10권3호
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    • pp.9-17
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    • 2003
  • In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

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제지공정의 유기 충전제로서 침엽수 잎 분말 적용 (Application of Conifer Leave Powder to the Papermaking Process as an Organic Filler)

  • 성용주;김동성;이지영;서영범;임창국;권완오;김진두
    • 펄프종이기술
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    • 제46권4호
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    • pp.62-68
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    • 2014
  • The application of conifer leave to the papermaking process as a functional organic filler was investigated in this study. The powder of the conifer leave after hot water extraction for the functional extract, such as phytoncide, was applied to OCC stock. The comparison between the commercial wood flour and the conifer leave powder as organic filler for OCC paper were conducted with various wet pressing conditions. The amount of the water removal by the wet pressing process and the bulk of handsheet were increased by the addition of the wood flour and the conifer leave powder, although the tensile strength was decreased. At the higher pressure condition of the wet pressing, the wet pressing efficiency was greatly increased by the wood flour and the conifer leave powder. There was a little difference in the performance of the wood flour and the conifer leave powder as an organic filler. Those results showed the conifer leave powder could be an alternative resource to the wood powder for papermaking organic filler.

오일팜 부산물을 이용한 유기충전제 제조 가능성 평가 (Effect of New Organic Filler Made From Oil Palm Biomass on Paperboard Properties)

  • 이지영;김철환;성용주;박종혜;김은혜
    • 펄프종이기술
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    • 제47권5호
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    • pp.61-67
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    • 2015
  • As the production of palm oil has been increased, the generation of oil palm biomass is also increased and the utilization of the oil palm biomass become more significant topic. One third of the oil palm biomass is empty fruit bunch (EFB) and the other two thirds are oil palm trunks and fronds. However, the effective use of oil palm biomass has not been developed and most of it is discarded near oil palm plants. In this study, we investigated the applicability of EFB to the paperboard mills, as an organic filler. The new organic filler was manufactured in a laboratory by grinding and fractionating dried EFB powder, and its properties were analyzed. The particles of EFB organic filler were larger and more spherical than those of the commercial wood powder. The use of EFB organic filler resulted in a higher bulk of the handsheets with similar trends of physical strength, compared to those made with wood powder. It was concluded that EFB could be used as a raw material to manufacture organic filler for paperboard production.

Ni기 삽입금속에 의해 진공 브레이징된 stainless steel의 특성평가 (Evaluation of the Vacuum brazed stainless steel by Ni-based filler metals)

  • 장세훈;홍지민;정창열;최세원;오익현
    • 한국재료학회지
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    • 제17권6호
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    • pp.342-346
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    • 2007
  • Microstructure and tensile strength of the vacuum brazed stainless steel were investigated in this study. For vacuum brazing of the stainless steel 303 and 304, the BNi-2, 3, 4 and 7 were used as filler metals. Among these filler metals, the BNi-2 showed excellent wettability at $1050^{\circ}C$. Indeed, the brazed stainless steel using the BNi-2 showed the highest tensile strength (483 MPa) among all brazed specimens. This is attributed to degree of interfacial reaction between the filler metal and stainless steel. Brazed stainless steel with BNi-2, 3 filler metals showed almost elastic deformation followed by plastic yielding and strain hardening up to a peak stress. On the other hand, it is likely that the fracture of the brazed specimens with BNi-4, 7 was occurred in elastic range without plastic yielding up to a peak stress.

BNi-2계 삽입금속에 의한 SUS304 스테인리스강 접합체의 강도와 조직에 미치는 브레이징 온도의 영향 : Ni기 삽입금속에 의한 브레이징 접합성의 기초적 검토(II) (Influence of Brazing Temperature on Strength and Structure of SUS304 Stainless Steel Brazed System with BNi-2 Filler Metal : Fundamental Study on Brazeability with Ni-Based Filler Metal(II))

  • 이용원;김종훈
    • 한국재료학회지
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    • 제17권3호
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    • pp.179-183
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    • 2007
  • A plate heat exchanger (PHE) normally uses vacuum brazing technology for connecting plates and fins. However, the reliability of high temperature brazing, especially with nickel-based filler metals containing boron the formation of brittle intermetallic compounds (IMCs) in brazed joints is of major concern. since they considerably degrade the mechanical properties. This research was examined the vacuum brazing of commercially SUS304 stainless steel with BNi-2 (Ni-Cr-B-Si) filler metal, and discussed to determine the influence of brazing temperatures on the microstructure and mechanical strength of brazed joints. In the metallographic analysis it is observed that considerable large area of Cr-B intermetallic compound phases at the brazing layer and the brazing tensile strength is related to removal of this brittle phase greatly. The mechanical properties of brazing layer could be stabilized through increasing the brazing temperature over $100^{\circ}C$ more than melting temperature of filler metals, and diffusing enough the brittle intermetallic compound formed in the brazing layer to the base metal.

진공브레이징에 의한 SUS304 스테인리스강과 BNi-2계 삽입금속의 접합특성 : Ni기 삽입금속에 의한 브레이징 접합성의 기초적 검토(I) (Brazing Property of SUS304 Stainless Steel and BNi-2 Filler Metal with Vacuum Brazing : Fundamental Study on Brazeability with Ni-Based Filler Metal(I))

  • 이용원;김종훈
    • 한국재료학회지
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    • 제17권3호
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    • pp.142-146
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    • 2007
  • Vacuum brazing method has been coming to an important process as one of the new fabricating techniques of metals and alloys. In this study, a vacuum brazing of SUS304 stainless steel with BNi-2 filler metal was carried out in $1{\times}10^{4}$ Torr of vacuum atmosphere. The formation of brittle intermetallic compounds in brazed joints between SUS304 stainless steel and BNi-2 filler metal is a major concern, since they considerably degrade the mechanical properties of joints. To obtain enough stable joining strength, it is necessary to understand the unique properties of brazing process with Ni-based filler metals containing boron. So, in this research we investigated the performance of SUS304/BNi-2 brazed system and the brazed joint properties were evaluated at room temperature by using tensile test. Metallurgical and fractographic analysis were used to characterize the microstructure, the mechanisms of brazing, and joint failure modes.