• Elastomers and Composites
• /
• 제56권4호
• /
• pp.234-242
• /
• 2021

The demand for truck bus radial (TBR) tires with enhanced fuel efficiency and wear resistance have grown in recent years. In addition, as the issue of particulate matter and air pollution increases, efforts are being made to reduce the generation of particulate matter. In this study, the properties of epoxidized natural rubber (ENR) containing a silica-friendly functional group were evaluated by considering it as a base rubber and varying the silica ratio in this binary filler system. The results showed that the wear resistance of the NR/BR blend compound decreased as the silica ratio increased. In contrast, the ENR/BR blend compound exhibited an increase in wear resistance as the silica ratio was increased. In particular, the ENR-50/BR blend compound showed the best wear resistance due to the presence of several epoxide groups. Furthermore, we observed that for tan 𝛿 at 60℃, higher epoxide content resulted in the higher T_g of the rubber, indicating a higher tan 𝛿 at 60℃. On the other hand, it was confirmed that increasing the silica ratio decreased the value of tan 𝛿 at 60℃ in all compounds. In addition, we measured the amount of wear particulate matters generated from the compound wear. These measurements confirmed that in the binary filler system, regardless of the filler type, the quantity of the generated wear particulate matters as the filler-rubber interaction increased. In conclusion, the silica filled ENR/BR blend compound exhibited the lowest generation of wear particulate matters.

• 폴리머
• /
• 제25권6호
• /
• pp.774-781
• /
• 2001

폐타이어와 폐석분 재활용을 위하여, 불포화 폴리에스터 수지에 폐석분과 폐타이어 분말의 충전량을 변화시켜 폐타이어-폐석분/폴리에스터 혼성 복합재료를 제조하였다. 매트릭스 내에서 충전제의 계면결합력과 분산력을 향상시키기 위하여 실란 커플링제[${\gamma}$-methacryloxy propyl trimethoxy silane(${\gamma}$-MPS)]를 사용하여 표면처리하고 복합재를 제조한 후 구조와 물성을 확인하였다. 실란 커플링제로 충전제를 표면처리한 경우 초기 열분해온도가 상승하고 중량감소율이 감소하였다. 커플링제로 표면처리된 경우 높은 기계적 물성을 얻었으며, 실란 농도 2 wt%에서 매트릭스 및 WTC의 함량에 관계없이 최대값을 나타내었다. 유기 충전제 증가에 따라 복합재의 기공도는 증가하나 표면처리에 의해 감소시킬 수 있으며 유기 충전제의 함량에 따라 기공 크기분포도 변화한다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
• /
• pp.9-15
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
• /
• 제7권1호
• /
• pp.41-49
• /
• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 대한치과보철학회지
• /
• 제31권3호
• /
• pp.317-349
• /
• 1993

This study investigated the effect of filler particle size and weight% on mechanical properties of dental core porcelain. In alumina, variation in particle size and weight% and in zirconia, variation in weight%, all specimens were tested three-point bending strength, transmittance, thermal expansion coefficient, porosity and shrinkage and observed with SEM and analysed with X-ray diffractometer. In order to develop shrink-free porcelain, after firing alumina only, glass wasinfiltrated. And aluminum was added to alumina with the expanding character of aluminum oxidize into alumina, and was followed by second firing of glass infiltration procedure. Then mechanical properties were observed. The results of this study were obtained as follows. 1. The bending strength of zirconia was higher than that of alumina, and $5{\mu}m$ alumina had highest strength in variation of particle size of alumina. Except for $5{\mu}m$ alumina, increased with weight%, bending strength increased up to 80% and decreased at 90%. In case of glass infiltration, bending strength was slight higher than 80% and 90% of $5{\mu}m$ alumina. 2. Transmittance increased with increase of shrinkage, decrease of porosity, and with increase of filler size and had no direct correlation with weight%. 3. Thermal expansion coefficient of alumina group was $7.42\sim8.64\times10^{-6}/^{\circ}C$ and that of zirconia group was $9.83\sim12.11\times10^{-6}/^{\circ}C$ and the latter was higher than the former. 4. In x-ray diffraction analysis, alumina group and zirconia group increased $Al_2O_3$ peak and $t-ZrO_2$ peak with increase of weight%. The second phase(cristobalite peak) was observed in zirconia 40% group. 5. Porosity of zirconia was lower than that of alumina and $5{\mu}m$ alumina group had many pores with SEM. In case of low filler content, fracture occurred in glass and high filler content, in glass and filler. In case of aluminum addition to alumina, small oxidised aluminum was observed. 6. Zirconia group had high shrinkage than alumina group, and mixed group of alumina group had high shrinkage. In case of glass infiltration, shrinkage decreased and aluminum addition to alumina group was almost shrink-free.

• 한국세라믹학회지
• /
• 제43권9호
• /
• pp.552-557
• /
• 2006

A low temperature processing route for fabricating porous SiC ceramics by carbothermal reduction has been demonstrated. Effects of expandable microsphere content, sintering temperature, filler content, and carbon source on microstructure, porosity, compressive strength, cell size, and cell density were investigated in the processing of porous silicon carbide ceramics using expandable microspheres as a pore former. A higher microsphere content led to a higher porosity and a higher cell density. A higher sintering temperature resulted in a decreased porosity because of an enhanced densification. The addition of inert filler increased the porosity, but decreased the cell density. The compressive strength of the porous ceramics decreased with increasing the porosity. Typical compressive strength of porous SiC ceramics with ${\sim}70%$ porosity was ${\sim}13 MPa$.

• 접착 및 계면
• /
• 제9권3호
• /
• pp.7-13
• /
• 2008

열전도도가 유사한 입자형 필러인 silicon carbide (SiC)와 섬유형 필러인 carbon fiber (CF)를 polyetheretherketone (PEEK) 고분자에 첨가하여 복합재료의 열확산도에 미치는 영향을 연구하였다. 전자현미경을 통해 얻은 단면사진으로부터 SiC와 CF가 PEEK 매트릭스 안에 균일하게 분산되어 있고 필러들이 부분적으로 서로 네트워크를 형성한 것을 관찰하였다. 레이저 섬광법을 이용하여 상온에서 $200^{\circ}C$까지 PEEK/SiC와 PEEK/CF 복합재료의 열확산도를 측정하였으며, 열확산도는 온도가 상승함에 따라 PEEK-필러와 필러-필러 계면에서의 포논산란 증가에 의하여 감소하였다. 필러함량이 증가함에 따라 복합재료의 열확산도가 증가하였으며, 2상계에 대하여 유도된 Maxwell 및 Nielson 예측식을 실험값과 비교함으로써 매트릭스 내의 필러 분포, 방향성, 종횡비 및 필러간의 상호작용 등을 유추할 수 있었다. Nielson 예측식은 PEEK/SiC 복합재료에 대하여 열전도도를 잘 예측하였다. 입자형 필러인 SiC에 비하여 섬유형 필러인 탄소섬유가 동일한 함량에서 열확산에 기여하는 필러 네트워크를 효과적으로 형성하여 높은 열확산도를 가지는 것으로 추정된다.

• 한국재료학회지
• /
• 제27권1호
• /
• pp.12-18
• /
• 2017

Transparent organic-inorganic hybrid hard coating films were prepared by the addition of $SiO_2$ or $ZrO_2$, as an inorganic filler to improve the hardness property, filler was highly dispersed in the acrylic resin. To improve the compatibility in the acrylic resin, $SiO_2$ or $ZrO_2$ is surface-modified using various silanes with variation of the modification time and silane content. Depending on the content and kind of the modified inorganic oxide, transparent modified inorganic sols were formulated in acryl resin. Then, the sols were bar coated and cured on PET films to investigate the optical and mechanical properties. The optimized film, which has a modified $ZrO_2$ content of 4 wt% markedly improved in terms of the hardness, haze, and transparency as compared to neat acrylate resin and acrylate resin containing modified $SiO_2$ content of 8 wt%. Meanwhile, the low transparency and high haze of these films slowly appeared at $SiO_2$ content above 10 wt% and $ZrO_2$ content of 5 wt%, but the hardness values were maintained at 2H and 3H, respectively, in comparison with the HB of neat acrylate resin.

• 폴리머
• /
• 제31권3호
• /
• pp.221-227
• /
• 2007

폴리(비닐 알코올)(poly(vinyl alcohol), PVA)을 충전제로 사용하여 용액 블렌딩 방법을 통해 라이오셀(Lyocell) 블렌드 필름을 만들고 각각의 기계적 성질과 모폴로지를 비교했다. 각 블렌드 필름의 물성들은 첨가된 PVA 양에 따라 다양하게 변하였다. 특히 라이오셀 중에서 30 wt%의 PVA를 포함하는 블렌드(PVA/Lyocell (w/w=30/70)) 필름의 최대 인장 강도가 가장 높은 값을 나타냈으며 40 wt%가 되면 오히려 감소했다. 초기 탄성률 값에서도 비슷한 결과를 보였는데, 역시 30 wt%의 PVA가 포함된 필름이 가장 높은 초기탄성률을 보였다. 유기화 점토인 도데실트리페닐포스포늄-마이카($C_{12}PPh$-Mica)를 이용하여 PVA가 30wt% 포함된 블렌드된 라이오셀 나노복합체 필름을 용액 Intercalation 법을 이용하여 제조한 후에 각 나노복합체 필름의 기계적 성질을 유기화 점토의 양에 따라 조사하였다. 순수한 라이오셀의 경우에는 기계적 성질이 5 wt% 점토를 첨가했을 때 가장 높은 값을 가졌으며, 소량의 점토만으로도 순수한 라이오셀보다 높은 기계적 성질을 나타내었다. 그러나 PVA를 포함한 라이오셀 블렌드(PVA/Lyocell(w/w=30/70))의 나노복합체 필름의 경우에는 유기화점토의 첨가된 양이 1에서 5wt%까지 증가해도 기계적 물성은 오히려 일정하게 감소하였다.

• Advanced Composite Materials
• /
• 제18권4호
• /
• pp.315-326
• /
• 2009

PCC (precipitated calcium carbonate) and ground calcium carbonate have been widely used in alkaline papermaking. Unfortunately, although increasing filler level in papers can improve the paper properties such as brightness, opacity, stiffness gloss, smoothness, porosity, and printability, as well as decrease cost, some strength of the paper is negatively affected. In this research, needle-like aragonite was synthesized using $Ca(OH)_2$ and $CO_2$ as reactants in the presence of $MgCl_2$ and characterized with scanning electronic microscopy (SEM) and X-ray diffraction (XRD). The physical and optical properties of the paper handsheets containing these needle-like aragonite fillers were evaluated. Results indicated that tensile strength, Z-direction tensile strength and folding endurance of the paper were improved by the needle-like aragonite crystals compared to the paper using commercial PCC (precipitated calcium carbonate) as filler. The stiffness of the paper handsheet on the machine direction was increased, but no evident difference in the cross direction was found. The improvement of paper strength mainly resulted from the twining effect between the aragonite whiskers and paper fibers. The optical properties of the paper were slightly decreased with the use of the needle-like aragonites compared to commercial PCC. These results suggest that paper cost can be decreased by increasing the content of needle-like aragonite filler while paper strength will not be decreased compared to PCC filler.