• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2001년도 정기학술대회
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• pp.337-337
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• 2001

High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.

• Journal of Power Electronics
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• 제17권3호
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• pp.811-820
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• 2017

The reliability issue of IGBT is a concern for researchers given the critical role the device plays in the safety of operations of the converter system. The reliability of power devices can be estimated from the intermittent life test, which aims to simulate typical applications in power electronics in an accelerated manner to obtain lifetime data. However, the test is time-consuming, as testing conditions are not well considered and only rough provisions have been made in the current standards. Acceleration of the test by changing critical test conditions is controversial due to the activation of unexpected failure mechanisms. Therefore, full investigations were conducted on critical test conditions of intermittent life test. A design optimization process for IGBT intermittent life testing program was developed to save on test times without imposing additional failure mechanisms. The applicability of the process has been supported by a number of tests and failure analysis of the test results. The process proposed in this paper can guide the test process for other power semiconductors.

• 한국항공우주학회지
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• 제45권1호
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• pp.21-29
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• 2017

복합재료 적층판 기계적 체결부(ASTM D5961 Proc. A, B)에 대하여 치구 설계에서 시험 결과의 해석까지 전체 과정을 제시하였다. 복합재료 적층판 기계적 체결부를 유한요소법을 사용하여 분석하였으며 시험 결과와 비교하였다. 시험편의 파손 거동을 분석하기 위해 점진적 파손해석 방법을 유한요소법에 적용하였다. 시험 파손 하중을 예측하기 위해 3가지 파손이론(최대 응력, 최대 변형률, Tsai-Wu)을 FEM에 적용하였다. 기계적 체결부의 일반적인 변수들을 검토하였으며 주요 변수에 대하여 베어링 강도 차이를 비교하였다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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• pp.163-167
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• 2001

A two-dimensional progressive failure analysis method is presented for the strength characterization of the composite joints under pin loading. The eight-nodes laminated she]1 element is utilized based on the updated Lagrangian formulation. The criteria by Yamada-Sun, Tsai-Wu, and the maximum stress are used for the failure estimation. The stiffness of failed layer is degraded by the complete unloading method. No factor depending on test is included in the finite element analysis except for the material strength and stiffness. Total 20 plate specimens with and without hole are tested to validate the finite element prediction. The Tsai-Wu failure criterion most conservatively estimates the strength of laminate, and the maximum stress criterion yields the highest strength because it does not consider the coupling of the failure modes. The strength by Yamada-Sun method neglecting the matrix failure effect are located between other two methods and shows best agreement with test result for laminate with hole.

• 한국신뢰성학회지:신뢰성응용연구
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• 제4권2호
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• pp.121-131
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• 2004

HALT (Highly Accelerated Life Test) was performed to improve the reliability by removing the potential failure for newly developing PCB used for the vibration condition from 2OHz to 2OOHz. During HALT, it is found that the lead of Al electrolytic capacitor of SMD type is detached from PCB. As the result for the failure analysis and FEM (Finite Element Method), it is clarified that the root cause for this failure is the improper attachment of an Al electrolytic capacitor on PCB by the mistake of a PCB design. HALT was performed in previous condition to verify the failure analysis after molding an epoxy resin to overcome the PCB design mistake and it is not observed the same failure. Therefore, it is assumed that the same failure in field will be not occurred by the proper implementation.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 추계학술발표대회 논문집
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• pp.128-133
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• 2000

The objective of this research is to develop real-time failure detection techniques for damage assessment of composite materials using optical fiber sensors. Signals from matrix cracking or fiber fracture in composite laminates are treated by signal processing unit in real-time. This paper describes the implementation of time-frequency analysis such as the Short Time Fourier Transform(STFT) to determine the time of occurrence of failure. In order to verify the performance of the optical fiber sensor for stress wave detection, we performed pencil break test with EFPI sensor and compared it with that of PZT. The EFPI sensor was embedded in composite beam to sense the failure signals and a tensile test was performed. The signals of the fiber optic sensor when damage occurred were characterized using STFT and wavelet transform. Failure detection system detected the moment of failure accurately and showed good sensitivity with the infinitesimal failure signal.

• Journal of Welding and Joining
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• 제31권5호
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Nuclear Engineering and Technology
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• 제51권2호
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• pp.561-572
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• 2019

In the design criterion for the nuclear power plant piping system, the limit state of the piping against an earthquake is assumed to be plastic collapse. The failure of a common piping system, however, means the leakage caused by the cracks. Therefore, for the seismic fragility analysis of a nuclear power plant, a method capable of quantitatively expressing the failure of an actual piping system is required. In this study, it was conducted to propose a quantitative failure criterion for piping system, which is required for the seismic fragility analysis of nuclear power plants against critical accidents. The in-plane cyclic loading test was conducted to propose a quantitative failure criterion for steel pipe elbows in the nuclear power plant piping system. Nonlinear analysis was conducted using a finite element model, and the results were compared with the test results to verify the effectiveness of the finite element model. The collapse load point derived from the experiment and analysis results and the damage index based on the stress-strain relationship were defined as failure criteria, and seismic fragility analysis was conducted for the piping system of the BNL (Brookhaven National Laboratory) - NRC (Nuclear Regulatory Commission) benchmark model.

• 한국신뢰성학회지:신뢰성응용연구
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• 제16권2호
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• pp.125-133
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• 2016

Purpose: The purpose of this study is to evaluate durability of platform safety step system in railway. Method: We performed finite element analysis & durability analysis of platform safety step system with VPD (Virtual Product Development) techniques and examined the durability standard & qualification life through the rig test during no failure test time in reliability qualification test. We continued to test 1 million cycles in KRS (Korea Railway Standard) for system's robust design performance. Result: FEM analysis results are 14.9MPa & 14.7MPa of pin-joint, pivot and durability analysis result is above 1 million cycles. we calculated theoretically no failure test time 855,000 cycles and through the 1 million cycles durability rig test in KRS standard we confirmed product quality. Conclusion: This platform safety step system was designed very safe in terms of a mechanical strength & durability.

• 한국신뢰성학회지:신뢰성응용연구
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• 제12권1호
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• pp.47-56
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• 2012

Reliability demonstration tests with zero-failure acceptance criterion are most commonly used in the field of reliability application since they require fewer test samples and less test time compared to other test methods that guarantee the same reliability with a given confidence level. For products with lognormal lifetime distribution, an economic zero-failure test plan is developed that minimizes the total cost related to perform a life test to guarantee a specified reliability of a product with a given confidence level. A numerical example is provided to illustrate the use of the proposed test plan.