• Journal of the Korean Society of Safety
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• v.19 no.2
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• pp.21-25
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• 2004

This study deals with the characteristics of wire-cut EDM(Electrical Discharge Machining)process in aluminum alloys. Besides 2 series and 7 series of aluminum alloys for aerospace applications, porous aluminum is tested, which is used for sound absorbing matherial and interior and exterior material of building. Jinyoung JW-30 wire cutting machine was used in this experiment. Tap wate passed a filter and ionization was used as the discharging solution. An immerision method was applied as a cooling method because it separates chips effectively and machinability is good even with low value of electric current. The speed of fabrication was estimated by measuring the travel distance of the work piece and time spent for the movement. As pulse-on-time increased the fabrication speed decreased. On the other hand, as peak voltage of peak current increased the fabrication speed increased. In general 7075 aluminum alloy resulted in higher fabrication speed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.7
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• pp.602-609
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• 2008

This paper presents experimental optimization of process parameters for a newly developed SFF(Solid Freeform Fabrication) system. Two critical process parameters, layering thickness and curing period, which have a large effect on the quality of the product, are optimized through experiments. Specimens are produced using layering thicknesses of 60, 80, 100, 120, 140, and $160\;{\mu}m$ and curing periods of 0, 10, 20, and 30 minutes under the same processing conditions, i.e., build-room temperature, feed-room temperature, roller speed, laser power, scan speed, and scan spacing. The specimens are tested to compare and analyze performance indices such as thickness accuracy, flatness, stress-strain characteristics, and porosity. The experimental result indicates that layering thickness of $80{\sim}100\;{\mu}m$ and curing period of $20{\sim}30$ minutes are recommended for the developed industrial SFF system.

• IE interfaces
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• v.16 no.3
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• pp.344-351
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• 2003

Critical dimension is one of the most important characteristics of up-to-date integrated circuit devices. Hence, critical dimension control in a semiconductor wafer fabrication process is inevitable in order to achieve optimum device yield as well as electrically specified functions. Currently, in complex semiconductor wafer fabrication processes, statistical methodologies such as Shewhart-type control charts become crucial tools for practitioners. Meanwhile, given a critical dimension sampling plan, the analysis of variance technique can be more effective to investigating critical dimension variation, especially for on-chip and on-wafer variation. In this paper, relating to a typical sampling plan, linear statistical models are presented for the analysis of critical dimension variation. A case study is illustrated regarding a semiconductor wafer fabrication process.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1259-1264
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• 2007

Microstereolithography technology has potential capability for fabrication of 3D microstructures. It evolved from conventional SLA which is one of the RP processes. In a microstereolithography process, 3D microstructures can be easily fabricated by continuously stacking 2D layer which is photopolymerized using a liquid prepolymer. Combination between biocompatible/biodegradable photocurable prepolymer and 3D complex fabrication in microstereolithography makes broad application areas such as medical, pharmaceutic, and bio devices. In particular, a 3D microneedle for transdermal drug delivery and a scaffold for tissue engineering are fabricated using this technology. In this paper, the authors address development of microstereolithography system adapted to large surface and fabrication of various microstructures. In addition, to apply human body we suggest a biodegradable 3D microneedle and a scaffold using biodegradable photocurable prepolymer.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.89-91
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• 2006

An analysis of a multi-pin remote welding for a DUPIC fuel fabrication was made to establish the optimum welding processes in a hot cell environment. An initial investigation for hands-on fabrication outside the hot cell was performed, and the constraints of a hot cell welding were considered. Preliminary welding performances to improve the RW process were also examined. The RW process was determined to be the best in a hot cell environment for joining the end plate to the end caps. This paper presents an outline of the developed RW machine for a DUPIC fuel fabrication and compares the characteristics of a Zr-4 end plate welding by using electrical resistance and LB methods. The weld nuggets of RW specimens and torque strengths of resistant and LB welded zones were also investigated.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1101-1106
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• 2005

The purpose of this study was to develop a process management system to manage ingot fabrication and the quality of the ingot. The ingot is the first manufactured material of wafers. Operating data (trace parameters) were collected on-line but quality data (measurement parameters) were measured by sampling inspection. The quality parameters were applied to evaluate the quality. Thus, preprocessing was necessary to extract useful information from the quality data. First, statistical methods were employed for data generation, and then modeling was accomplished, using the generated data, to improve the performance of the models. The function of the models is to predict the quality corresponding to the control parameters. The dynamic polynomial neural network (DPNN) was used for data modeling that used the ingot fabrication data.

• Journal of Institute of Control, Robotics and Systems
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• v.17 no.2
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• pp.131-134
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• 2011

In this study, we propose an optimal design and new fabrication method for a slim tactile sensor. Slim tactile sensor can detect 3-axial forces and has suitable flexibility for intelligent robot fingers. To amplify the contact signal, a unique table-shaped structure was attempted. A new layer-by-layer fabrication process for polymer micromachining that can make a 3D structure by using a sacrificial layer was proposed. A table-shaped epoxy sensing plate with four legs was built on top of a flexible polymer substrate. The plate can convert an applied force to a concentrated stress. Normal and shear forces can be detected by combining responses from metal strain gauges embedded in the polymer substrate. The optimal positions of the strain gauges are determined using the strain distribution obtained from finite element analysis.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.280-287
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• 2002

We present technical issues involved in the development of actuators and sensors for applications to high-precision Micro Electro Mechanical System (MEMS). The technical issues include fabrication uncertainty and noise disturbance, causing major difficulties for MEMS to achieve high-precision actuation and detection functions. For nano-precision actuators, we solve the fabrication instability and electrical noise problems using digital actuators coupled with nonlinear mechanical modulators. For the high-precision capacitive sensors, we present a branched finger electrodes using high-amplitude anti-phase sensing signals. We also demonstrate the potential applications of the nanoactuators and nanodetectors to high-precision positioning MEMS.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.484-485
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• 2003

We report on the optimization of the fabrication process of hybrid sol-gel thin film deposition to produce low cost $1 {\times} 16$ splitters for optical communications. We learn that sol-gel film thickness is dependent upon the spinning speeds and viscosity of the sol-gel solutions and refractive index upon the dopant concentrations of Al and Zr in the sol solutions. We could find the optimized physical conditions to achieve the desired thickness of core and cladding layers. We will further carry out the fabrication and measurements of insertion loss, polarization dependent loss (PDL), etc. for the performance of fabricated splitter devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1046-1049
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• 2006

We proposed a simplified fabrication structure and method which can provide separate Red (R), Green (G), Blue (B), and White (W) OLED pixels with 2 metal-mask changes in emitting layer fabrication inspired from the structure of multi-layer white OLED and carrier blocking mechanism. A red emission layer for the R and W pixel with 1st mask, and then a blue emission layer with hole blocking layer for the B and W pixel with 2nd mask, and finally a common green emission layer were deposited sequentially. We expect that this concept would be very useful to the actual fabrication of multi-color OLED display although additional optimization is needed.