• 한국유체기계학회 논문집
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• 제14권6호
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• pp.61-67
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• 2011

The study is to analyze the chemical and heat-flow reactions in the hydrogen generation unit(autothermal reformer), using computational numerical tools. Autothermal reformer(ATR) is involved in complex chemical reaction, mass and heat transfer due to exothermic and endothermic reactions. Therefore it is necessary to reveal the effects of various operation parameters and geometries on the ATR performance by using numerical analysis. Numerical analysis needs to dominant chemical reactions that includes Full Combustion(FC) reaction, Steam Reforming(SR) reaction, Water-Gas Shift(WGS) reaction and Direct Steam Reforming(DSR) reaction. The objective of the study is to improve theoretically the reformer design capability for the goal of high hydrogen production in the autothermal reformer using methane. Hydrogen production reached maximum in a certain value of Oxygen to Carbon Ratio(OCR) or Steam to Carbon Ratio(SCR). When the longitudinal distance to dimeter ratio(L/D) is increased, hydrogen production increases.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 추계학술대회 초록집
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• pp.97.1-97.1
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• 2011

Dimethyl ether (DME) is an attractive fuel as a hydrogen carrier for mobile PEMFC applications. However, its reforming technologies are rarely studied especially by using autothermal reforming (ATR) method. This work explored the impact of operating conditions to the performance of DME ATR. Temperature, Steam to carbon ratio(SCR), Oxygen to carbon ratio(OCR) and Gas hourly space velocity(GHSV) were considered as the operating conditions. As results, conversion efficiency was increased as the temperature increased, but saturated around $700^{\circ}C$. There was no significant effect of SCR on conversion efficiency, but high SCR led reactions in endothermic manner. High OCR substantially suppressed conversion efficiency, but it helped to sustain the temperature by stimulating exothermic reactions. Conversion efficiency was decreased as GHSV increased. The optimized operating conditions was suggested: $700^{\circ}C$, SCR of 1.5, OCR of 0.45 and GHSV below 15000/h and conversion efficiency was ~85% at the conditions.

• Elastomers and Composites
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• 제50권2호
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• pp.92-97
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• 2015

A study on reaction kinetics for a PTMG/TDI prepolymer with 2,2'-dichloro-4,4'-methylenedianiline (MOCA), of which formulations may be generally used for fabricating high performance polyurethane elastomers, was peformed using non-isothermal differential scanning calorimetry (DSC). A number of thermograms were obtained at several constant heating rates, and analysed using Flynn-Wall-Ozawa (FWO) isoconversional method for activation energy, $E_a$ and extended-Avrami equation for reaction order, n. Urea formation reaction of the present system was observed to occur through the simple exothermic reaction process in the temperature range of $100{\sim}130^{\circ}C$ for the heating rate of $3{\sim}7^{\circ}C/min$. and could be well-fitted with generalized sigmoid function. Though activation energy was nearly constant as $53.0{\pm}0.5kJ/mol$, it tended to increase a little at initial stage, but it decreases at later stage by the transformation into diffusion-controlled reaction due to the increased viscosity. Reaction order was evaluated as about 2.8, which was somewhat higher than the generally well-known $2^{nd}$ order values for the various urea reactions. Both the reaction order and reaction rate explicitly increased with temperature, which was considered as the indication of occurring the side reactions such as allophanate or biuret formation.

• 전기화학회지
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• 제14권2호
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• pp.117-124
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• 2011

We demonstrate a new surface modification of high-voltage lithium cobalt oxide ($LiCoO_2$) cathode active materials for lithium-ion batteries. This approach is based on exploitation of a polarity-tuned gel polymer electrolyte (GPE) coating. Herein, two contrast polymers having different polarity are chosen: polyimide (PI) synthesized from thermally curing 4-component (pyromellitic dianhydride/biphenyl dianhydride/phenylenediamine/oxydianiline) polyamic acid (as a polar GPE) and ethylene-vinyl acetate copolymer (EVA) containing 12 wt% vinyl acetate repeating unit (as a less polar GPE). The strong affinity of polyamic acid for $LiCoO_2$ allows the resulting PI coating layer to present a highly-continuous surface film of nanometer thickness. On the other hand, the less polar EVA coating layer is poorly deposited onto the $LiCoO_2$, resulting in a locally agglomerated morphology with relatively high thickness. Based on the characterization of GPE coating layers, their structural difference on the electrochemical performance and thermal stability of high-voltage (herein, 4.4 V) $LiCoO_2$ is thoroughly investigated. In comparison to the EVA coating layer, the PI coating layer is effective in preventing the direct exposure of $LiCoO_2$ to liquid electrolyte, which thus plays a viable role in improving the high-voltage cell performance and mitigating the interfacial exothermic reaction between the charged $LiCoO_2$ and liquid electrolytes.

• Bulletin of the Korean Chemical Society
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• 제35권2호
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• pp.357-364
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• 2014

Size controlled, $LiNi_{0.8}Co_{0.15}Al_{0.05}O_2$ cathode powders were prepared by co-precipitation method followed by heat treatment at temperatures between 750 and $850^{\circ}C$. The synthesized samples are characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and electrochemical performance. The synthesized $LiNi_{0.8}Co_{0.15}Al_{0.05}O_2$ after calcined at $750^{\circ}C$ has a good electrochemical performance with an initial discharge capacity of $190mAhg^{-1}$ and good capacity retention of 100% after 30 cycles at 0.1C ($17mAg^{-1}$). The capacity retention of $LiNi_{0.8}Co_{0.15}Al_{0.05}O_2$ after calcined at $750^{\circ}C$ is better than that at 800 and $850^{\circ}C$ without capacity loss at various high C rates. This is ascribed to the minimized cation disorder, a higher conductivity, and higher lithium ion diffusion coefficient ($D_{Li}$) observed in this material. In the differential scanning calorimetry DSC profile of the charged sample, the generation of heat by exothermic reaction was decreased by calcined at high temperature, and this decrease is especially at $850^{\circ}C$. This behavior implies that the high temperature calcinations of $LiNi_{0.8}Co_{0.15}Al_{0.05}O_2$ prevent phase transitions with the release of oxygen.

• 한국도로학회논문집
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• 제7권4호
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• pp.113-123
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• 2005

본 연구에서는 기존의 염화물계 제설제인 염화칼슘$(CaCl_2)$ 및 염화나트륨(NaCl)과 비염화물계 제설제(NS 100) 초산화합물 함유 염화물 제설제(NS 40), 그리고 이들 제설제를 중량대비 일정비율로 혼합$(NaCl\;70%+CaCl_2\;30%,\;NS\;40\;70%+CaCl_2\;30%,\;NaCl\;70%+NS\;40\;30%,\;NS\;40\;70%+NaCl\;30%)$하였을 때 제설성 능과 특성, 콘크리트의 동결융해저항성 및 강재의 부식에 미치는 영향을 실내시험을 통하여 비교 검토하였다. 이상의 시험결과를 바탕으로 동절기 구조물이 동해를 받을 수 있는 지역에서 염화물계 제설제를 사용할 경우 제설성능 및 효과, 강재의 부식성 콘크리트의 동결융해저항성 및 스켈링저항성에 미치는 영향을 고려해 볼 때 하나의 제석제를 사용하기 보다는 두가지 제설제를 적정 비율로 혼합하여 사용하는 것이 바람직한 방법임을 알 수 있었다. 혼합 사용시에는 제설성능 강재 및 콘크리트에 미치는 영향을 고려해 볼 때 NS40(70%)+염화칼슘(30%)이 가장 효과적인 것으로 나타났다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Smart Structures and Systems
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• 제12권1호
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• pp.41-54
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• 2013

Concrete is known as a heterogeneous product which is composed of complex chemical composition and reaction. The development of concrete thermal effect during early age is critical on its future structural health and long term durability. When cement is mixed with water, the exothermic chemical reaction generates hydration heat, which raises the temperature within the concrete. Consequently, cracking may occur if the concrete temperature rises too high or if there is a large temperature difference between the interior and the exterior of concrete structures during early age hydration. This paper describes the contribution of novel Fabry-Perot (FP) fiber optic temperature sensors to investigate the thermal effects of concrete hydration process. Concrete specimens were manufactured under various water-to-cement (w/c) ratios from 0.40 to 0.60. During the first 24 hours of concreting, two FP fiber optic temperature sensors were inserted into concrete specimens with the protection of copper tubing to monitor the surface and core temperature change. The experimental results revealed effects of w/c ratios on surface and core temperature developments during early age hydration, as well as demonstrating that FP fiber optic sensors are capable of capturing temperature variation in the concrete with reliable performance. Temperature profiles are used for calculating the apparent activation energy ($E_a$) and the heat of hydration (H(t)) of concrete, which can help us to better understand cement hydration.

• 전기화학회지
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• 제17권2호
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• pp.79-85
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• 2014

리튬2차전지용 음극활물질로 연구되고 있는 실리콘은 흑연에 비하여 높은 이론용량 (4200mAh/g for $Li_{4.4}Si$)을 가지기 때문에 고용량 음극소재로 각광받고 있다. 이러한 실리콘 음극은 반복적인 충방전에 의해 활물질 입자의 심각한 부피변화와 균열에 의한 새로운 표면이 전해액에 계속적으로 노출되는 문제로 인하여 두껍고 불안정한 피막생성을 유도한다. 불안정한 구조의 피막은 실리콘 음극의 전기화학적 성능뿐만 아니라 고온 열안정성을 저해할 수 있기 때문에 본 연구에서는 실리콘의 열안정성 향상을 위해 전해액 첨가제를 도입하여 피막구조를 변경하고자 한다. 전해액 첨가제인 lithium bis(oxalato)borate (LiBOB)가 실리콘 음극표면에 피막을 효과적으로 형성하였으며, 만충전 상태의 실리콘 음극의 $60^{\circ}C$ 저장시 용량유지 특성을 개선하였으며 고온에서의 열안정성 크게 향상시켰다.