• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집C
• /
• pp.519-524
• /
• 2001

These days, $Al_[2}O_{3}$ ceramic use all over the industry because dynamic function and special properties to compare traditional material. But $Al_[2}O_{3}$ ceramic is high hardness and brittleness materials. For this reason, it is very difficult to process. Therefor, In this paper, it was investigated that laser process parameter, which can produce appropriate quality of $Al_[2}O_{3}$ ceramic microhole machining utilized Nd:YAG laser and Excimer laser.

• 한국기계가공학회지
• /
• 제11권5호
• /
• pp.99-103
• /
• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 춘계학술대회 논문집
• /
• pp.366-370
• /
• 1997

This paper descibes a micro groove machining process on the polyurethane biopolymer by KrF excimer laser. To investigate the etch charcteristics of polyurethane biopolymer quantitatively,laser system for ablation was installed with high precison moter and then polymer ablation experiment, in which paramteters were fluence,pulse repetition rate,numbers of pulses and assist gas, was carred out. In this experiment, we found out that the value of critical energy density for ablation is 30mJ/cmsup2/ and the etching rate is more dependent on the pulse number and fluence than any other pamameter. Finally, we machined micro grooves for fiexibility as width 300.mu.m depth 100.mu.m and port for micro-devices mounting as length 100.mu.m width 300.mu.m depth .mu.m on the outer wallof polyurethane biopolymer tube which is used as medical device.

• 전자공학회논문지A
• /
• 제33A권6호
• /
• pp.172-177
• /
• 1996

We have characterized XeCl excimer-laser-induced crystallization of thin amorphous silicon films deposited by PECVD (${\alpha}$-Si:H) and LPCVD (${\alpha}$-Si). The electrical properties, surface roughness and crystallinity of crystallized thin films have been measured. The dc conductivities, crystallinity andsurface roughness of the films increased as the laser energy density and shot density were increased. The properties of laser annealed films deposited by LPCVD were better than those of thin films deposite by PECVD. We have also found that the multiple shots with relative low energy density were more benifical to the improsvement of surface roughness than the single shot with high energy density preserving the crystallinity.

• 열처리공학회지
• /
• 제13권5호
• /
• pp.318-323
• /
• 2000

The planarization of rough polycrystalline diamond films synthesized by DC arc discharge plasma jet CVD (chemical vapor deposition) was attempted using KrF excimer laser pulses. The effects of laser incidence angle and reaction gases (ozone and oxygen) on etching rate of diamond were studied. The temperature change of diamond and graphite with different laser fluences was calculated by computer simulation to explain the etching behavior of diamond films. The threshold energy density from the experiment for etching of pure crystalline diamond was about $1.7J/cm^2$ and fairly matched the simulation value. Preferential etching of a particular crystallographic plane was observed through scanning electron microscopy. The etching rate of diamond with ozone was lower than that with oxygen. When the angle of incidence was $80^{\circ}$ to the diamond surface normal, the peak-to-valley surface roughness was Significantly reduced from $20{\mu}m$ to $0.5{\mu}m$.

• Journal of the Optical Society of Korea
• /
• 제5권1호
• /
• pp.1-4
• /
• 2001

The results of investigating $SiL_{2,3}$/ X-ray emission valence spectra of amorphous silicon films irradiated by excimer laser are presented. It is found that laser annealing leads to crystallization of amorphous silicon films and the crystallinity increases with the laser energy density from 250 to 400 mJ/$\textrm{cm}^2$. The vertical structure of the film is investigated by changing the accelerating voltage on the X-ray tube, and the chemical and structural state of Si$_3$N$_4$ buffer layer is found not to be changed by the excimer laser treatment.

• 한국자동차공학회논문집
• /
• 제2권4호
• /
• pp.91-99
• /
• 1994

Tunable KrF Excimer Laser is used here for measuring OH and $O_2$ density distribustion in an open $H_2$/air premixed flame and in a combustion bomb. Laser Rayleigh Scattering(LRS) and Planar Laser Induced Predissociative Fluorescence(PLIPF) methods are used to obtain two-dimensional images of total and specific densities. Laser Excitation wavelengths are calibrated via flame images and combustion bomb images show good qualitative a greement with theoretical calculation. Furthermore images in a combustion bomb can be developed to study real Spark-Ignition engine combustions. Our experimental images show that there are no more collisional quenching problem at high pressure environment(including atmospheric pressure) using predissociative fluorescence technique. Further development to obtain two-dimensional temperature dustribution is ready to use eventhough it is not reported in this paper.

• 한국레이저가공학회지
• /
• 제6권3호
• /
• pp.19-28
• /
• 2003

The manufacturing process for the microfluidic device can include sequential steps such as master fabrication, electroforming, and injection molding. The laser ablation, using masks, has been applied to the fabrication of channels in microfluidic devices. In this research, an excimer laser was used to engrave microscopic channels on the surface of PET (polyethylene terephthalate), which shows a high absorption ratio for an excimer laser beam with a wavelength of 248 m. When 50-${\mu}{\textrm}{m}$-wide rectangular microscopic channels are ablated with a 500 ${\times}$ 500 ${\mu}{\textrm}{m}$ square mask at a magnification ratio of 1/10, ditch-shaped defects were found in both corners. The measurement of laser beam intensity showed that a coherent image in the PET target caused such defects. Analysis based on the Fourier diffraction theory enabled the prediction of the coherent shape at the image surface as well as the diffraction beam shape between the mask and the image surface. It also showed that the diameter of the aperture had a dominant effect. The application of aperture with a diameter of less than 3 mm helped to eliminate such defects in the ablated rectangular microscopic channels on PET without such ditch-shaped defects.

• 한국레이저가공학회지
• /
• 제8권2호
• /
• pp.21-32
• /
• 2005

The excimer laser ablation of a polymer occurs by the excitation of chemical bonds to energy levels that are above the dissociation energy. In this process, however, fragmented debris is finally ejected explosively by the scission of bonds and accumulates on the material surface. In the present work, a process for eliminating surface debris contamination generated by the laser ablation of a polymer is developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on a polymide. The ink pasted polyimide is ablated by KrF excimer laser. The surface debris ejected from the polyimide is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer are removed using adhesive tape or alcohol solvent. The results suggest that the erasable ink method is a simple, low cost, and extremely effective debris eliminating process.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
• /
• pp.540-543
• /
• 2006

LTPS TFT backplanes for AM OLED displays have advantages in regard to reliability and performance compared to TFT backplanes based on amorphous silicon. However, the requirements for homogeneous laser crystallization during LTPS process are much higher than for LCD backplanes. Most important is the energy stability of the laser source. In this paper we describe a new excimer laser which meets the requirements of LTPS manufacturing process with high homogeneity.