• Journal of Korea Foundry Society
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• v.21 no.2
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• pp.119-126
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• 2001

Al/15%Gr. composite have been manufactured by mixing, compacting, and extruding aluminium powder and graphite powder. Then, Al-6%Si/x%Gr., Al-12%Si/x%Gr., and Al-18%Si/x%Gr.(x: 0, 2, 4, 6, 8) composites have been manufactured by remelting the extruded materials(Al/15%Gr.), Al-33.3%Si alloy, and Al ingot, etc. We conducted experiments to chracterize the microstructure, and damping properties and hardness. The result of microstructure experiment on Al-x%Si/y%Gr. composites reveals the good dispersion of graphite. As to Al-Si/y%Gr. composites, the more the graphite contents, the less the tensile strength. And the tensile strength varied according to contents of Si: with its highest value in Al-18%Si/y%Gr. composites and lowest in Al-6%Si/y%Gr. composites. As to Al-x%Si/y%Gr. composites, the more the contents of graphite, the more the vibration damping properties. And we can get the highest vibration damping rate in Al-12%Si/y%Gr. composites which matrix structure is an eutectic component.

• Journal of Korea Foundry Society
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• v.21 no.2
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• pp.127-134
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• 2001

Misch metal (rare earth element, Ce, La, Nd, Pr) which has large influence on high-temperature stability and toughness was added to the Al-5%Ni-5%Mg alloy, and squeeze casting was used for Al-5%Ni-5%Mg-(Mm) alloys. The effect of applied pressure and misch metal additions on mechanical properties in Al-5%Ni-5%Mg alloy by direct squeeze casting has been investigated. The applied pressure were 0 MPa(gravity casting), 25, 50 and 75 MPa. Squeeze-cast Al-5%Ni-5%Mg-(Mm) alloys had better mechanical properties than those of non-pressurized cast alloys because of the increased cooling rate by the application of pressure during solidification. By the addition of misch metal in Al-5%Ni-5%Mg alloy, better combination of strength and elongation was obtained. The addition of 0.3%Mm in Al-5%Ni-5%Mg alloy improved the heat resistant property due to the formation of fine eutectic phases.

• Journal of Korea Foundry Society
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• v.22 no.4
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• pp.192-199
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• 2002

Dimensional defects of castings are mainly due to the stresses and strains caused by a nonuniform temperature distribution and phase transformation during solidification and cooling, and by mechanical constraint between the mold and casting. It is, however, nearly impossible to trace movements of the casting and mold during solidification and cooling by experimental measurements for castings with complex shape. Two and three dimensional deformation analyses of the casting and the mold were performed using commercial finite element code, MARC. It was possible to calculate deformation and temperature distribution in the casting and mold simultaneously. Cooling curves of the casting obtained by calculation were close to that measured in the field since it was possible to treat latent heat evolution of the casting which could be divided into two parts, primary and eutectic parts. Mold bent inward just after pouring due to the temperature gradient across the mold thickness, and mold returned to its previous position with time. Plastic deformation occurred at the part of the casting where solidification was slow.

• Journal of Korea Foundry Society
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• v.18 no.6
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• pp.570-577
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• 1998

An investigation has been conducted to describe solidification characteristics in Sn-Zn binary system and Sn-Zn-Ag ternary system added by Ag produced by the continuous casting process using heated mold as a basic study for developing Pb-free solder materials. To obtain the continuous casting rods with mirror surface and near net shape at higher casting speed, water flow rates must be increased and mold temperature must be lowered. However, surface tearing in the casting rods occured at lower continuous casting speed while break out occured at higher continuous casting speed even if optimum conditions such as water flow rate and heated mold temperature are determined. Primary ${\alpha}Sn$ and eutectic structure in unidirectioally solidified Sn-Zn alloys were finer with increased casting speed. But, directionality may not be expected for primary Zn in hypereutectic Sn-Zn alloy. It was found that the addition of $0.2{\sim}0.8%$ Ag promoted the growth of primary ${\alpha}Sn$ dendrites. The changes of tensile strength and elongation in Sn-Zn binary alloys were not observed while the increase of tensile strength and the decrease of elongation in Sn-Zn-Ag ternary alloys were observed with increased casting speed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.545-550
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• 2000

In order to synthesize Ba-ferrite particles by molten salt method KCl and NaCl were added to basic composition to 50% by weight. X was varied from 0.0 to 1.0 to control the magnetic properties in $BaFe_{12-2x}$/ $Co_{x}$ / $Ti_{x}$ / $O_{19}$ and 1 mol% of $SiO_2$was added to control the aspect ratio of hexagonal platelets. And the effects of reaction temperatures were examined by varying the temperature from 85$0^{\circ}C$ to 120$0^{\circ}C$ with 5$0^{\circ}C$ intervals. Eutectic composition of NaCl and KCl lowered the crystallizing temperature of Ba-ferrite in molten salts than using KCl and NaCl separatly. The morphology of resulting Ba-ferrite particles was clearly hexagonal-shaped plates. $H_{c}$ and $M_{r}$ were decreased when F $e^{3+}$ was substitued with $Co^{2+}$ and $Ti^{4+}$ from x=0 to x=1.0 in $BaFe_{12-2x}$/ $Co_{x}$ / $Ti_{x}$ / $O_{19}$ . Adding 1mol% $SiO_2$in molten salt method increased the size but shortened c-axis of the hexagonal ferrites and this result is an opposite phenomenon compared with the result in solid-statge reaction.n.ion.n.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• Journal of Welding and Joining
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• v.19 no.5
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• pp.520-525
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• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.821-827
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• 2004

Titanium oxide thin films were prepared on Si(100) substrates by R.F. magnetron reactive sputtering at $30\sim200watt$ R.F power range, and annealed at $600^{\circ}C\sim800^{\circ}C$ for 1 hour. The properties of $TiO_2$ thin films were analyzed using x-ray, ${\alpha}-step$, ellipsometer, scanning electron microscopy, and FT-IR spectrometer. Upon in-situ depositions, the initial phase of $TiO_2$ thin film showed non-crystalline phase at R.F. power $30\sim100$ watt. The crosssection of $TiO_2$ thin films were sbserved to be the columnar structure. With the increasing R.F power and annealing temperature, the grain size, crystallinity, refractive index, and void size of titanium oxides showed a tended to increase. The FT-IR transmittance spectra of titanium oxide thin films have the obsorption band of Ti-O bond, Si-O bond, Si-O-Ti bond and O-H bond. With the increase of R.F. power and annealing temperature, these films have the stronger bond structures. It is considered that such a phenomena is due to phase transition and good crystallinity

• Journal of Hydrogen and New Energy
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• v.18 no.4
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• pp.399-405
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• 2007

The hyper-eutectic Mg-33.5%Ni alloy was rapidly solidified by melt spinning process. The melt-spun Mg-33.5%Ni has amorphous structure and crystallization occurred above $162^{\circ}C$. The hydriding and dehydriding rates of melt-spun Mg-33.5%Ni increased with cycle and high rate of hydrogen storage occurred at 3rd cycle. The maximum hydrogen amount absorbed in melt-spun Mg-33.5%Ni at $300^{\circ}C$ is about 4.5%.