• 한국주조공학회지
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• 제24권3호
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• pp.145-152
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• 2004

The eutectic Si in Al-8.5wt.%Si alloy was changed from large flake to fine lemellar(or fibrous) shape when the Sc amount in the Al-Si alloy reaches 0.2wt.%. The optimum amount of Sc for the best modification effect was 0.8wt.% and slight decrease of modification effect occurred over this value. The study on the distribution of the modifiers(Sr, Na, and Sc) and the measurement of the surface tension of the Al-8.5wt.%Si alloy melt added with Sr, Na, and Sc modifier, respectively, reveals that Sc modifies the eutectic Si by the decrease of surface tension, while Sr and Na modify the eutectic Si mainly by impurity induced twinning mechanism.

• 한국재료학회지
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• 제17권7호
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• pp.371-375
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• 2007

In-situ observation of electromigration behavior of eutectic SnPb solder was performed as a function of line length at $100^{\circ}C$, $6{\times}10^4A/cm$ condition in a scanning electron microscope chamber. The incubation time for edge drift and the edge drift velocity increase as line length increases, which are discussed with the void nucleation stage of solder bump and the electromigration back flux force, respectively. Finally, the existence of electromigration product (jL) and its line length dependency are also discussed.

• 한국주조공학회지
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• 제4권4호
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• pp.14-19
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• 1984

In order to clarify the solidification mechanism of Al-Si alloy, Mushy Degree of Eutectic Solidification (MDE) and Centerline Feeding Resistance (CFR) were systematically studied by casting with various compositions of $Al-(6{\sim}18%)$ Si alloys into several kinds of molds having different cooling rates. The results are as follows: 1. CFR% increases slightly as solute concentration increases, but decreases remarkably as the cooling rate of the mold increases, that is, the composition dependence of the alloys has more effect on the change of CFR% than that of the mold cooling rate. 2. The composition dependence of MDE value has the same tendency as that of Degree of Eutectic Solidification (DES). MDE value within the range of hypereutectic composition is larger than that of hypoeutectic and it represents the maximum value at eutectic composition. The higher the cooling rate is, the less the MDE value is.

• 한국주조공학회지
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• 제6권1호
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• pp.5-11
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• 1986

The Wear Characteristics of Al-Si alloys were investigated with various Si contents by using the not-dispersed alloys and uncoated-graphite dispersed alloys. Uncoated-graphite dispersions were accomplished by Vortex method carrying 1 hr. heating at $400^{\circ}C$ on uncoated-graphite. Wear loss were increased by increasing Si contents at the elevated final load. Hyper-eutectic alloys showed higher wear resistance values at the small final load of 2.1Kg and 3.2Kg, but at the more increased final load, hypo-eutectic alloys showed higher wear resistance values than hyper-eutectic alloys. The property of wear resistance of uncoated-graphite dispersed Al-Si alloys showed more good values than not-dispersed alloys. This peroperty of increased war resistance were resulted from lubricating action of dispersed graphite.

• 한국주조공학회지
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• 제15권3호
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• pp.262-271
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• 1995

It is well known what is impossible to refine primary and eutectic Si simultaneously by addition of both Cu-P and Sr(or Na). Because of the formation of compound $Sr_3P_2(or Na_3P)$ in the melt, in the result, both effects disappear. In this study Al-Cu-P alloy that comprises AlP compounds inside is added in the melt with Sr simultaneously. As AlP compounds that act on nucleation sites of primary Si are not formed but added directly an the melt, it is difficult to form $Sr_3P_2$ by reaction with Sr. Therefore it is possible to refine primary and eutectic Si simultaneously in the general casting process by use of Al-Cu-P alloy and Sr.

• 한국전기전자재료학회논문지
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• 제16권1호
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• pp.19-25
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• 2003

Electromigration characteristics of eutectic SnPb solder were studied using thin stripe-type test structures. Significant changes in the microstructure were observed after electromigration test, in which the temperature and the current density were varied from 80 to 100 $^{\circ}C$ and from 4.6${\times}$10$^4$A/$\textrm{cm}^2$ to 8.7${\times}$10$^4$A/$\textrm{cm}^2$. While voids or local thinning were found near the cathode end, hillocks were mainly observed near the anode end. From resistance measurements, it was calculated that the activation energy of the eutectic SnPb solder for electromigration was 0.77 eV. The dominant migrating element along the electron flow at 100$^{\circ}C$ was Pb.

• 약학회지
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• 제29권4호
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• pp.193-198
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• 1985

해열진통제 및 류마치스치료제로 널리 사용되고 있는 아스피린과 이소푸로필안티피린을 복합제로 제제화할 경우에 이 두 약물이 공융혼합물을 형성하므로 열과 압력을 수반하는 제조공정을 거치는 과정에서 제품의 품질이 변하게 된다. 본 연구에서는 상기의 두 약물을 가지고 복합제 형태의 정제로 제조할 경우에 열적 불안정으로 인한 제조상의 문제점을 제거하기 위한 방법으로 결합제의 선택, 타정압력의 변화등에 따른 공융혼합물의 생성정도, 붕해도 및 용출양상에 대하여 연구하여 지견을 얻었기에 보고하고자 한다.

• 한국기계연구소 소보
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• 통권20호
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• pp.71-78
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• 1990

This investigation was undertaken to establish the technologies of grain refinement and modification, and to characterize material properties, essential for high quality aluminum alloy castings. Grain refinement seldom changed DAS and eutectic Si size, but largely decrease grain size. The variations of grain size induced by grain refinement had a great influence on the elongation without changes in the tensile strength or yield strength. The optimum Ti level lies between 0.1% and 0.16% to achieve the best possible mechanical properties. DAS and grain size were little affected, but eutectic Si size was greatly refined by modification. The variation of eutectic Si size had a great effect on the elongation, impact value, fracture toughness and fatigue crack propagation rate without changes in the tensile strength or yield strength. The Sr content of 0.015% is optimum to modification.

• Journal of Welding and Joining
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• 제23권5호
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• pp.49-54
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• 2005

The effective charge number and the critical current density of electromigration in eutetic SnPb and Pb Free $(SnAg_{3.8}Cu_{0.7)$ flip chip solder bumps are studied. The effective charge number of electromigration in eutectic SnPb solder is obtained as 34 and the critical current density is $j=0.169{\times}({\delta}_{\sigma}/{\delta}_x})\;A/cm^2,\;where\;({\delta}_{\sigma}/{\delta}_x})$ is the electromigration-induced compressive stress gradient along the length of the line. While the effect of electromigration in Pb free solder is much smaller than that in eutectic SnPb, the product of diffusivity and effective charge number $DZ^{\ast}$ has been assumed as $6.62{\times}10^{-11}$. The critical length for electromigration are also discussed.

• 한국재료학회지
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• 제23권4호
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• pp.227-232
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• 2013

Al-based alloys have recently attracted considerable interest as structural materials and light weight materials due to their excellent physical and mechanical properties. For the investigation of the potential of Al-based alloys, a surface porous $Al_{88}Cu_6Si_6$ eutectic alloy has been fabricated through a chemical leaching process. The formation and microstructure of the surface porous $Al_{88}Cu_6Si_6$ eutectic alloy have been investigated using X-ray diffraction and scanning electron microscopy. The $Al_{88}Cu_6Si_6$ eutectic alloy is composed of an ${\alpha}$-Al dendrite phase and a single eutectic phase of $Al_2Cu$ and ${\alpha}$-Al. We intended to remove only the ${\alpha}$-Al phase and then the $Al_2Cu$ phase would form a porous structure on the surface with open pores. Both acidic and alkaline aqueous chemical solutions were used with various concentrations to modify the influence on the microstructure and the overall chemical reaction was carried out for 24 hr. A homogeneous open porous structure on the surface was revealed via selective chemical leaching with a $H_2SO_4$ solution. Only the ${\alpha}$-Al phase was successfully leached while the morphology of the $Al_2Cu$ phase was maintained. The pore size was in a range of $1{\sim}5{\mu}m$ and the dealloying depth was nearly $3{\mu}m$. However, under an alkaline NaOH, aqueous solution, an inhomogeneous porous structure on the surface was formed with a 5 wt% NaOH solution and the morphology of the $Al_2Cu$ phase was not preserved. In addition, the sample that was leached by using a 7 wt% NaOH solution crumbled. Al extracted from the Al2Cu phase as ${\alpha}$-Al phase was dealloyed, and increasing concentration of NaOH strongly influenced the morphology of the $Al_2Cu$ phase and sample statement.