• 대한화학회지
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• 제17권4호
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• pp.247-255
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• 1973

$Li^{+},\;Na^{+},\;K^{+}, Ca^{2+},\;Ni^{2+},\;Al^{3+}$, 과 $F^{3+}$의 陽이온을 포화시킨 Wyoning montmorillonite에 acetone, methyl-ethyl ketone. diethyl ketone을 加熱用 i.r. gas cell 內에서 各各 다른 壓力아래 吸着시켜 $4000{\sim}1200cm^{-1}$에서spectra를 얻었다.두가지 형태의 C=O결합변화가$1713cm^{-1}$과 $1690cm^{-1}$ 나타났으며 이들은 陽이온의 水酸基 및 吸着水와 그리고 表面水酸基와 水素結合을 일으키는 결과로 나타났다. OH 吸收 spectra의 强度는 陽이온의 水酸基의 resonance 理論을 뒷받침해 주었다. coordinate bond를 일으키는 경향은 計算한 C=O기의 酸素의 formal charge의 크기와 잘 맞았다.

• 한국진공학회지
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• 제6권4호
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• pp.326-336
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• 1997

트랜지스터의 소오스/드레인 접합 특성에 가장 큰 영향을 미치는 인자는 이온 주입 시 발생한 실리콘 내에 발생한 결합이라는 사실에 착안하여, 기존 소오스/드레인 접합 형성 공정과 다른 새로운 방식을 도입하여 이온 주입에 의해 생긴 결함의 제어를 통해 고품질 초 저접합 $p^+$-n접합을 형성하였다. 기존의 $p^+$소오스/드레인 접합 형성 공정은 $^{49}BF_2^+$ 이온 주입 후 층간 절연막들인 TEOS(Tetra-Ethyl-Ortho-Silicate)막과 BPSG(Boro-Phospho-Silicate-Glass)막을 증착 후 BPSG막 평탄화를 위한 furnace annealing 공정으로 진행된다. 본 연구에서는 이러한 기존 공정과는 달리 층간 절연막 증착 전 저온 RTA첨가 방법, $^{49}BF_2^+$와 $^{11}B^+$ 을 혼합하여 이온 주입하는 방법, 그리고 이온 주입 후 잔류 산화막을 제거하고 MTO(Medium temperature CVD oxide)를 증착하는 방법을 제시하 였으며, 각각의 방법은 모두 이온 주입에 의한 실리콘 내 결합 농도를 줄여 기존의 방법보 다 더 우수한 양질의 초 저접합을 형성할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.171-174
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• 2000

We have investigated the CMP slurry properties of silicate oxide thin films surface on CMP cleaning process. The metallic contaminations by CMP slurry were evaluated in four different oxide films, such as plasma enhanced tetra-ethyl-ortho-silicate glass(PE-TEOS), $O_3$ boro-phospho silicate giass( $O_3$-BPSG), PE-BPSG, and phospho-silicate glass(PSG). All films were polished with KOH-based slurry prior to entering the post-CMP cleaner. The Total X-Ray Fluorescence(TXRF) measurements showed that all oxide surfaces are heavily contaminated by potassium and calcium during polishing, which is due to a CMP slurry. The polished $O_3$-BPSG films presented higher potassium and calcium contaminations compared to PE-TEOS because of a mobile ions gettering ability of phosphorus. For PSG oxides, the slurry induced mobile ion contamination increased with an increase of phosphorus contents.

• 한국문화재보존과학회:학술대회논문집
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• 한국문화재보존과학회 2006년도 제24회 학술대회발표 논문집
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• pp.139-144
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• 2006

• 한국세라믹학회지
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• 제33권6호
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• pp.679-685
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• 1996

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권3호
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• pp.116-121
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• 2006

Most high-k materials are well known not to be etched easily, Some problems such as low etch rate poor sidewall angle, plasma damage, and process complexity were emerged from the high-density DRAM fabrication. Chemical mechanical polishing (CMP) by a damascene process was proposed to pattern this high-k material was polished with some commercial silica slurry as a function of pH variation. Sufficient removal rate with adequate selectivity to realize the pattern mask of tera-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible. The planarization was also achieved for the subsequent multi-level processes. Our new CMP approach will provide a guideline for effective patterning of high-k material by CMP technique.

• 한국세라믹학회지
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• 제26권2호
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• pp.195-200
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• 1989

The Silica-Carbon mixture was made with addition of carbon black in the composition which monodispersed spherical fine silica was formed by the hydrolysis of ethylsilicate, mole ratio of Carbon/Alkoxide was 3.1 and $\beta$-SiC powder was synthesized by reacting this mixture at 1,350~1,50$0^{\circ}C$ in Ar atmosphere. The results of this study are as follow : (1) The purity of synthesized $\beta$-SiC powder was above 99.98% and it was in cubic modification with lattice constant of 4.3476$\AA$. (2) The rate-controlling steps varied with the reaction temperature for the syntehsis of $\beta$-SiC in this study ; nucleation and growth of $\beta$-SiC at 1,350~1,40$0^{\circ}C$, interfacial reaction at 1,45$0^{\circ}C$ and diffusion described by Jander Equation at 1,50$0^{\circ}C$. (3) When the rate-determining step was nucleation and growth, the activation energy was about 87.8kcal/mol.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.541-541
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• 2008

반도체 소자가 차세대 초미세 공정 기술 도입의 가속화를 통해 고속화 및 고집적화 되어 감에 따라 나노(Nano) 크기의 회로 선폭 미세화를 극복하고자 최적의 CMP (Chemical Mechanical Polishing) 공정이 요구되어지고 있다. 이처럼 CMP 공정이 반도체 제조 공정에 적용됨으로써 공정 마진 확보에 진일보 하였으나 CMP 장비의 공정 조건, 슬러리의 종류, 연마패드의 종류 등에 의해 CMP 성능이 결정된다. 특히 슬러리는 연마 공정의 성능에 중요한 영향을 미치는 요인이다. 고가의 슬러리가 차지하는 비중이 40% 이상을 넘고 있어 슬러리 원액의 소모량을 줄이기 위한 연구들이 현재 활발히 진행되고 있다. 본 연구에서는 새로운 연마제의 특성을 알아보기 위해 탈이온수(De-ionized water; DIW) 에 $CeO_2$, 연마제를 첨가한 후 분산시간에 따른 연마 특성과 AFM, EDX, XRD, TEM분석을 통해 그 가능성을 알아보았다.

• 한국세라믹학회지
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• 제26권3호
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• pp.416-422
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• 1989

The particle size of synthesized SiC powders was decreased with increasing carbon content when the mixture of carbon and silica was carbonized at 1, 45$0^{\circ}C$ after hydrolysis of the mixture with the ranges of 3.1 to 3.5 in the mole ratio of Carbon/Alkoxide. The reacted fraction of $\beta$-SiC nearly had nothing to do with the mole ratio of Carbon/Alkoxide. When the reaction was made by adding 0.5wt% additives in the composition of 3.1 in the mole ratio of carbon/alkoxide, the additives decreased the yield of $\beta$-SiC and its sequence was Ba2O3>B>Fe>Al>Al2O3>Si. The effect of additives promoted the transformation of $\beta$-SiC to $\alpha$-SiC form and shwoed the increasing tendency of lattice constant. The two colors of $\beta$-SiC powder came out : one was the black grey with addition of Al, Al2O3 and B the other the light grey with addition of Fe, B2O3 and Si.

• Macromolecular Research
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• 제13권5호
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• pp.418-426
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• 2005

One-pack cross-linkable nanocomposites of waterborne methyl ethyl ketoxime (MEKO)-blocked aromatic polyurethane dispersion (BPUD) reinforced with organoclay (quaternary ammonium salt of Cloisite 25A) were synthesized by the acetone process using 4,4'-methylenedi-p-phenyl diisocyanate (MDl), poly(tetramethylene) glycol (PTMG), dimethylol propionic acid (DMPA), and methyl ethyl ketoxime (MEKO). Particle size, viscosity, and storage stability of these nanocomposites were investigated. TEM and XRD studies confirmed that the silicate layers of organophilic clay were exfoliated and intercalated at a nanometer-scale in the BPUD matrix.