• 제목/요약/키워드: etching solution.

검색결과 531건 처리시간 0.027초

Metal bracket과 ceramic bracket의 전단 결합 강도와 debonding 상태에 관한 연구 (A STUDY OF THE SHEAR BOND STRENGTH OF METAL BRACKETS AND CERAMIC BRACKETS AND THE CONDITION AFTER DEBONDING)

  • 윤정진;유영규
    • 대한치과교정학회지
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    • 제22권2호
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    • pp.327-343
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    • 1992
  • Metal brackets and ceramic brackets were bonded to natural teeth, porcelain crowns and gold crowns After stored in artificial saliva solution for 72 hours at $37^{\circ}C$, the shear bond strengths were measured by Instron and compared with them, the bonding sites and bracket bases were examined by scanning electron microscope and light optical stereomicroscope. The results were as follows: 1. The shear bond strengths of the group which metal brackets were bonded to natural teeth and the groups which ceramic brackets were bonded to natural teeth and porcelain crowns were comparable to each other, the shear bond strength of the group which metal brackets were bonded to gold crowns was significantly low. 2. The bond failed predominantly at the bracket base/adhesive interface with the bulk of adhesive remaining on enamel in the group which metal brackets were bonded to natural teeth. 3. The bond failed consistently at the crown/adhesive interface with all of adhesive remaining on the bracket babes in the group which metal brackets were bonded to gold crowns. 4. The bond failed at the enamel or crown/adhesive interface with the bulk of adhesive remaining on the bracket bases in the groups which cramic brackets were bonded to natural teeth and porcelain crowns. 5. The shear bond strengths of the groups which ceramic brackets were bonded to porcelain crowns were not affected by etching time.

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저손실 Ti : $LiNbO_3$ 광도파로의 주기적 분극 반전과 광학특성 (Periodically domain inversion and optical properties of low-loss Ti : $LiNbO_3$ waveguides)

  • 양우석;권순우;이형만;김우경;윤대호;이한영
    • 한국결정성장학회지
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    • 제16권2호
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    • pp.49-52
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    • 2006
  • 저손실 Ti:$LiNbO_3$ 광도파로 기판에 외부전계 인가법을 사용하여 주기적으로 도메인을 반전시켰다. $LiNbO_3$의 -Z 면에 Ti 패턴 형성 후 약 $1060^{\circ}C$에서 열처리 과정을 통해 광도파로를 형성하였으며, 제작된 광도파로의 광전송 손실은 ${\sim}0.1dB/cm$ 였다. 도메인 반전을 위해 +Z면에 주기적인 전극 패턴을 형성하였으며, 외부전계의 균일한 인가를 위해 LiCl 전해 용액을 사용하여 도메인을 반전 시켰다. 선택적 화학식각을 통해, 약 $16{\mu}m$의 도메인 반전 주기를 확인 할 수 있었으며, 주기적 도메인 반전구조를 갖는 Ti : $LiNbO_3$ 도파로의 비선형 특성을 측정하였다.

Polished Wafer와 Epi-Layer Wafer의 표면 처리에 따른 표면 화학적/물리적 특성 (Comparison on the Physical & Chemical Characteristics in Surface of Polished Wafer and Epi-Layer Wafer)

  • 김진서;서형탁
    • 한국재료학회지
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    • 제24권12호
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    • pp.682-688
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    • 2014
  • Physical and chemical changes in a polished wafer and in $2.5{\mu}m$ & $4{\mu}m$ epitaxially grown Si layer wafers (Epilayer wafer) after surface treatment were investigated. We characterized the influence of surface treatment on wafer properties such as surface roughness and the chemical composition and bonds. After each surface treatment, the physical change of the wafer surface was evaluated by atomic force microscopy to confirm the surface morphology and roughness. In addition, chemical changes in the wafer surface were studied by X-ray photoemission spectroscopy measurement. Changes in the chemical composition were confirmed before and after the surface treatment. By combined analysis of the physical and chemical changes, we found that diluted hydrofluoric acid treatment is more effective than buffered oxide etching for $SiO_2$ removal in both polished and Epi-Layer wafers; however, the etch rate and the surface roughness in the given treatment are different among the polished $2.5{\mu}m$ and $4{\mu}m$ Epi-layer wafers in spite of the identical bulk structural properties of these wafers. This study therefore suggests that independent surface treatment optimization is required for each wafer type, $2.5{\mu}m$ and $4{\mu}m$, due to the meaningful differences in the initial surface chemical and physical properties.

GaAs/AlxGa1-xAs 이차원 전자계 기반 양자소자의 Switching Noise 억제 (Suppression of Switching Noise in a Quantum Device Based on GaAs/AlxGa1-xAs Two Dimensional Electron Gas System)

  • 오영헌;서민기;정윤철
    • 한국진공학회지
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    • 제21권3호
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    • pp.151-157
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    • 2012
  • GaAs/$Al_xGa_{1-x}As$ 이차원 전자계는 양자점, QPC (quantum point contact), 전자 간섭계 등 다양한 형태의 양자구조 제작에 널리 사용된다. 하지만 일반적으로 GaAs 기반 양자소자는 극저온에서 소자의 전도도가 시간에 따라 변하거나 두 가지의 전 상태 사이를 왔다 갔다 하는 random telegraph noise 때문에 소자의 동작 특성이 상당히 불안하다. 이러한 문제점을 해결하기 위하여 산소 플라즈마를 이용한 소자의 표면처리가 소자의 안정성에 미치는 영향을 연구하였다. 이를 통해 소자의 표면을 산소 플라즈마를 이용하여 50 W~120 W 사이의 출력으로 30 초간 처리한 후 HCl : $H_2O$ (1 : 3) 용액을 이용하여 10초간 습식식각한 경우 전도도의 안정성이 매우 향상됨을 알 수 있었다.

석영 유리의 파괴 거동에 관한 연구(II) (A Study on the Fracture Behavior of Quartz Glass(II))

  • 최성대;정선환;권현규;정영관;홍영배
    • 한국산업융합학회 논문집
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    • 제10권4호
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    • pp.213-219
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    • 2007
  • Glass-to-metal contact should be prevented in the design of any structural glass component. Because glass is extremely brittle and will fracture readily if even a small point load is applied. If the assembly includes a glass component supported by metallic structure, designers should provide a pliable interface of some kind between the two parts. But there happens high demand of glass-to metal contact in semiconductor industries due to adoption of dry cleaning process as one of the good solution to reduce running cost - carry out equipments cleaning with high corrosive and etching gas such as CF4 with keeping process temperature as the same as high service temperature. Therefore the quartz glass have to be received compression by direct contact with metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process during the process. In this paper investigation will be carried out on fracture behavior of quartz glass contacted with metal directly under local load and fatigue given by process vibration with apparatus which can give $lox{\backslash}cal$ load and vibration through PZT ceramics to give guideline to prevent unintended fracture of quartz glass.

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Mechanical Properties and Microstructure of the Leucite-Reinforced Glass-Ceramics for Dental CAD/CAM

  • Byeon, Seon-Mi;Song, Jae-Joo
    • 치위생과학회지
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    • 제18권1호
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    • pp.42-49
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    • 2018
  • The computer-aided design/computer-aided manufacturing (CAD/CAM) system was introduced to shorten the production time of all-ceramic restorations and the number of patient visits. Among these types of ceramic for dental CAD/CAM, they have been processed into inlay, onlay, and crown shapes using leucite-reinforced glass-ceramics to improve strength. The purpose of this study was to observe the mechanical properties and microstructure of leucite-reinforced glass-ceramics for dental CAD/CAM. Two types of leucite-reinforced glass-ceramic blocks (IPS Empress CAD, Rosetta BM) were prepared with diameter of 13 mm and thickness of 1 mm. Biaxial flexural testing was conducted using a piston-on-three-ball method at a crosshead speed of 0.5 mm/min. Weibull statistics were used for the analysis of biaxial flexural strength. Fracture toughness was obtained using an indentation fracture method. Specimens were observed by field emission scanning electron microscopy to examine the microstructure of the leucite crystalline phase after acid etching with 0.5% hydrofluoric acid aqueous solution for 1 minute. The results of strength testing showed that IPS Empress CAD had a mean value of $158.1{\pm}8.6MPa$ and Rosetta BM of $172.3{\pm}8.3MPa$. The fracture toughness results showed that IPS Empress CAD had a mean value of $1.28{\pm}0.19MPa{\cdot}m^{1/2}$ and Rosetta BM of $1.38{\pm}0.12MPa{\cdot}m^{1/2}$. The Rosetta BM sample exhibited higher strength and fracture toughness. Moreover, the crystalline phase size and ratio were increased in the Rosetta BM sample. The above results are expected to elucidate the basic mechanical properties and crystal structure characteristics of IPS Empress CAD and Rosetta BM. Additionally, they will help develop leucite-reinforced glass-ceramic materials for CAD/CAM.

도재브라켓 접착면의 처리방식이 전단결합강도에 미치는 영향 (EFFECTS OF THE DIFFERENT CERAMIC BRACKET BASES ON SHEAR BOND STRENGTH)

  • 김진오;이기수
    • 대한치과교정학회지
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    • 제24권4호
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    • pp.957-967
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    • 1994
  • The purpose of this study was to evaluate the effects of different bases of ceramic brackets on shear bond strength and to observe failure patterns of bracket bondings. Lower bicuspid brackets whose bases designed for the macromechanical and silane treated chemical bonding those for silane treated chemical bonding, those for micromechanical bonding, and those for macromechanical bonding were tested as experimental groups, and foil mesh-backed metal brackets as a control group. All the brackets were bonded with $Mono-Lok\;2^{(TM)}$ on the labial surface of extracted human lower bicuspids after etching the enamel with $38\%$ phosphoric acid solution for 60 seconds. The shear bond strengths were measured on the universal test machine after 24 hours passed in the $37^{\circ}C$ water bath. The gathered data were evaluated and tested by ANOVA and Duncan's multiple range test, and those results were as follows. The shear bond strengths of brackets for macromechanical and chemical bonding, those for chemical bonding, and those for micromechanical bonding were not different (p>0.05), but showed statistically higher than those of metal bracket and those of ceramic bracket for micromechanical bonding(p<0.05). The shear bond strengths of ceramic bracket for micromechanical bonding showed statistically lower than those of metal bracket(p<0.05). The enamel fractures and/or ceramic bracket fractures were observed in the cases of higher bond strength than that of metal bracket. These results supported that silane treated base of ceramic bracket show higher shear bond strength than that of metal bracket, and suggested that micromechanical form of ceramic bracket bases show higher shear bond strength than that of macromechanical form.

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Meltback을 이용한 mesa shape의 형성과 평면매립형 반도체레이저의 제작 (The mesa formation and fabrication of planar buried heterostructure laser diode by using meltback method)

  • 황상구;오수환;김정호;김운섭;김동욱;홍창희
    • 한국광학회지
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    • 제10권6호
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    • pp.518-523
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    • 1999
  • 본 연구에서는 meltback 방법으로 mesa 모양을 형성하기 위하여 여러 가지 농도의 용액으로 meltback을 하였으며 InP 기판위에 InGaAsP 활성층과 InP cap층을 가지는 웨이퍼에 mesa 모양을 형성하기 위해서는 성장온도에서 성장용액의 80%인 InGaAsP(1.55$\mu$m)용액이 가장 적합한 것으로 확인되었다. meltback 방법만으로 PBH-LD(planar buried heterosturcture laser diode)를 제작하기 위한 완전한 mesa를 형성하기는 어려우며, 따라서 본 연구에서는 화학에칭에 이어 Meltback 방법을 이용하여 mesa 모양을 형성하고 연속하여 전류 차단층을 형성시킨 PBH-LD(planar buried heterosturcture laser diode)를 제작하였다. 이렇게 제작된 MQW-PBH-LD의 전기 광학적 특성은 공진기 길이가 $300{\mu}m$일 때 임계전류는 10mA, 내부양자효율은 82%, 내부손실은 $9.2cm^{-1}$, 특성온도는 $25~45^{\circ}C$ 사이에서는 65K, $45~65^{\circ}C$사이에서는 42K이었다.

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마이크로 피라미드 패턴 응용 도광판 제작을 위한 니켈 스탬퍼 제작에 관한 연구 (Fabrication of Ni Stamper based on Micro-Pyramid Structures for High Uniformity Light Guide Panel (LGP))

  • 김성곤;유영은;서영호;제태진;황경현;최두선
    • 한국정밀공학회지
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    • 제23권9호
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    • pp.174-178
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    • 2006
  • Pyramid shape of micro pattern is applied to the light guide panel (LGP) to enhance the uniformity of the brightness of the LCD. The micro pyramids are molded in intaglio on the surface of the LGP. The size of each pyramid is 5$\mu$m $\times$ 5$\mu$m on bottom and the height is about 3.5$\mu$m. The pyramids are distributed on the LGP surface randomly to be sparser where the light comes in and denser at the opposite side as a result of a simulation using lightools$^{TM}$ Based on this design, a silicon pattern master and a nickel stamper are fabricated by MEMS process and electro plating process. Intaglio micro pyramids are fabricated on the 6' of silicon wafer from the anisotropic etching using KOH and the process time, temperature of the KOH solution, etc are optimized to obtain precise shape of the pattern. A Wi stamper is fabricated from this pattern master by electro plating process and the embossed pyramid patterns turns out to be well defined on the stamper. Adopting this stamper to the mold base with two cavities, 1.8' and 3.6' LGPs are injection molded.

Sinfony 간접복합수지와 비귀금속합금간의 전단결합강도와 파절양상 (Shear Bond Strength and Failure Mode between Sinfony Indirect Composite Resin and Non Precious Metal)

  • 민병록;정인성
    • 대한치과기공학회지
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    • 제30권2호
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    • pp.79-86
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    • 2008
  • The purpose of this study was to investigate the effect retention element formed by metal surface treatment method on the bond strength of indirect composite resin and metal. The metal specimens were cast from Ni-Cr alloy($Rexillium^{(R)}$ III). They were divided into 5 groups by applied retention element: $50{\mu}m$ aluminium oxide sandblasting group, $250{\mu}m$ aluminium oxide sandblasting group, 0.2mm retention crystal group, 10% $H_{2}SO_{4}$ solution etching group, $110{\mu}m$ $Rocatec^{TM}$ Plus system group. Total 50 metal specimens were veneered with Sinfony indirect composite resin system. Specimens were tested for shear bond strength on an Instron universal testing machine and fracture mode of fractured specimens were analyzed by SEM and EDS. 1. 0.2 mm retention crystals were most effective in improving the resin-metal shear bond strength (p<0.05). 2. Sandblasting by $250{\mu}m$ aluminium oxide were more effective than sandblasting by $50{\mu}m$ aluminium oxide in improving the resin-metal shear bond strength(p<0.05). 3. Fracture mode of resin-metal fractured surface were cohesive failure mode in 0.2mm retention crystal, mixed failure mode in sandblasted specimens, etched specimens and the specimens sandblasted with $110{\mu}m$ $Rocatec^{TM}$ Plus system.

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