• Title/Summary/Keyword: etching solution.

Search Result 531, Processing Time 0.027 seconds

Morphology of Si Etching Structure Using KOH Solution with IPA and Ethanol (KOH를 이용한 Si 식각에서 IPA와 Ethanol을 사용한 경우의 표면 비교)

  • Lee, Gwi-Deok;Roh, Yong-Han
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2006.11a
    • /
    • pp.123-124
    • /
    • 2006
  • 본 연구에서는 KOH 용액을 사용한 Si 습식 이방성 식각실험 진행 후, 나타나는 표면의 거친 현상을 완화하는 데에 중점을 두고 연구를 진행하였다. 이를 위해 $SiO_2$ 웨이퍼 위에 Photo-lithography 공정으로 형성시킨 PMER 패턴을 Mask로 사용하여 HF 용액으로 $SiO_2$를 식각시켰으며, 형성된 $SiO_2$를 Mask로 사용하여 KOH 용액으로 Si을 식각시켰다. 이 때, KOH와 혼합하는 용액으로 IPA와 Ethan이을 각각 사용하여 실험을 진행하였으며, ESEM을 이용하여 표면을 비교하였다.

  • PDF

Polarity of freestanding GaN grown by hydride vapor phase epitaxy

  • Lee, Kyoyeol;Auh, Keun-Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
    • /
    • v.11 no.3
    • /
    • pp.106-111
    • /
    • 2001
  • The freestanding GaN substrates were grown by hydride vapor phase epitaxy (HVPE) on (0001) sapphire substrate and prepared by using laser induced lift-off. After a mechanical polishing on both Ga and N-surfaces of GaN films with 100$\mu\textrm{m}$ thick, their polarities have been investigated by using chemical etching in phosphoric acid solution, 3 dimensional surface profiler and Auger electron spectroscopy (AES). The composition of the GaN film measured by AES indicted that Ga and N terminated surfaces have the different N/Ga peak ratio of 0.74 and 0.97, respectively. Ga-face and N-face of GaN revealed quite different chemical properties: the polar surfaces corresponding to (0001) plane are resistant to a phosphoric acid etching whereas N-polar surfaces corresponding to(0001) are chemically active.

  • PDF

Dry-etch Characteristics of InP/InGaAsP Photonic Crystal Structure (InP/InGaAsP 광자결정 구조 제작을 위한 건식 식각 특성)

  • Lee, Ji-Myon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.17 no.12
    • /
    • pp.1271-1276
    • /
    • 2004
  • Two-dimensionally arrayed nanocolumn lattices were fabricated by using double-exposure laser holographic method. The hexagonal lattice was formed by rotating the sample with 60 degree while the square lattice by 90 degree before the second laser-exposure. The reactive ion etching for a typical time of 30 min using CH$_4$/H$_2$ plasma enhanced the aspect-ratio by more than 1.5 with a slight increase of the bottom width of columns. The etch-damage was observed by photoluminescence (PL) spectroscopy which was removed by the wet chemical etching using HBr/$H_2O$$_2$/$H_2O$ solution, leading into the enhanced PL intensities of the PCs.

Fabrication of $0.25 \mu\textrm{m}$ P-HEMT for X-band Low Noise Amplifier (X-밴드 저잡음 증폭기용 $0.25 \mu\textrm{m}$ T-형 게이트 P-HEMT 제작)

  • 이강승;정윤하
    • Proceedings of the IEEK Conference
    • /
    • 2000.11b
    • /
    • pp.17-20
    • /
    • 2000
  • We have enhanced the yield of 0.25 ${\mu}{\textrm}{m}$ T-gate $Al_{0.25}$G $a_{0.75}$As/I $n_{0.2}$G $a_{0.8}$As P-HEMT using three-layer E-beam lithography process and selective etching process. The three-layer resist structure (PMMA/copolymer/ PMMA=2000 $\AA$/3000 $\AA$/2000 $\AA$) and three developers (Benzene:IPA=1:1,Methanol:IPA =1:1,MIBK:IPA=1:3) were used for fabrication of a wide-head T-gate by the conventional double E-beam exposure technology. Also 1 wt% citric acid: $H_2O$$_2$:N $H_{4}$OH(200m1:4ml:2.2ml) solution were used for uniform gate recess. The etching selectivity of GaAs over $Al_{0.25}$G $a_{0.75}$As is measured to be 80. So these P-HEMT processes can be used in X-band MMIC LNA fabrication.ion.ion.ion.

  • PDF

Grating fabrication for DFB laser diode using holographic interferometer system (DFB 레이저 다이오드를 위한 홀로그래픽 시스템을 이용한 회절격자 제작)

  • 강명구;오환술
    • Journal of the Korean Institute of Telematics and Electronics A
    • /
    • v.33A no.6
    • /
    • pp.108-113
    • /
    • 1996
  • Periodic gratings for 1.55$\mu$m distributed feedback laser diode (DFB LD) have been fabricated by a holographic interference exposure system using an etalon stabilized Ar ion laser. We obtain a good development condition at developer concentration of 65% and obtain etching rate of 1000$\AA$/min at 20.deg. C by the mixed solution HBr:HNO$_{3}$:H$_{2}$O(1:1:10 in volume ratio). We obtain good first order grating with period of 2400${\AA}[\pm}2{\AA}$ at etching time of 45 sec from grating period and diffraction efficiency measurement, and SEM observation of grating fabricated on InP substrate.

  • PDF

Optical Characterization of DBR Porous Silicon by Changing of Applied Current Density (전류세기의 변화에 따른 DBR 다공성 실리콘의 광학적 특성)

  • Choi, Tae-Eun;Park, Jaehyun
    • Journal of Integrative Natural Science
    • /
    • v.2 no.2
    • /
    • pp.82-85
    • /
    • 2009
  • Distributed Bragg reflector (DBR) porous silicon (PSi) was generated by an electrochemical etching a bragg structure into a silicon wafer through electrode current in aqueous ethanolic HF solution. DBR PSi exhibiting unique reflectivity was successfully obtained by an electrochemical etching of silicon wafer using square current waveform. The multilayered photonic crystals of DBR PSi exhibited the reflection of a specific wavelength with high reflectivity in the optical reflectivity spectrum. In this work, we have developed a method to create refractive index in Si substrate through intensity of an electric current. The electrochemical process allows for precise control of the structural properties of DBR PSi such as thickness of the porous layer, porosity, and average pore diameter. The number of reflection peak of DBR PSi and its pore size increased as the intensity of electric current increased. This might be a demonstration for the fabrication of specific reflectors or filters.

  • PDF

Fabrication and Characterization of Silole and Biotin-functionalized Rugate Porous Silicon

  • Kwon, Hyungjun
    • Journal of Integrative Natural Science
    • /
    • v.3 no.1
    • /
    • pp.24-27
    • /
    • 2010
  • Multi-functionalized rugate porous silicon (PSi) for biosensor was developed by hydrosilylation with silole and its further reaction with biotin groups. PSi was generated by an electrochemical etching of silicon wafer in aqueous ethanolic HF solution PSi prepared by using etching conditions showed that many sharp spectral lines can be obtained in the optical reflectivity spectrum. 1,1-hydrovinyl-2,3,4,5-tetraphenylsilole was obtained from the reaction of 1,1-dilithio-2,3,4,5-tetraphenyl-1,3-butadiene with dichlorovinylsilane. Multi-functionalized PSi with silole and biotin groups was characterized by UV-vis absorption spectroscopy, Ocean optics 2000 spectrometer, and fluorescence spectroscopy. Optical characteristics such as reflectivity and photoluminescence (PL) were observed. An increase of the reflection wavelength in the reflectivity spectrum by 20 nm was observed, indicative of a change in refractive indices induced by hydrosilylation of the silole and biotin groups to the rugate PSi. This red-shift was attributed to the replacement of some of the Si-H group of fresh rugate PSi with silole and biotin group.

Holder Design for the Bottle Etching Machine Using TRIZ Tools (TRIZ도구를 이용한 유리병 표면부식장치 홀더 설계)

  • Suh S.W.;Park K.;Kim B.J.
    • Korean Journal of Computational Design and Engineering
    • /
    • v.10 no.5
    • /
    • pp.365-374
    • /
    • 2005
  • Most of people who are engaged in research and development find it difficult to solve the engineering problems creatively due to the lack of ideas. TRIZ is one of the emerging problem solving techniques that leads us to a very useful and clear solution. TRIZ consists of several tools such as ideal final result (IFR), physical and technical contradictions, 40 invention principles, resource, effect, etc. However, many designers think that TRIZ is hard to be applied to a design problem since there are several tools in TRIZ. Machine designers may want to see which tool is more effective than others. Thus, this paper provides sample solutions of a design problem: holder design for the bottle etching machine by applying several TRIZ tools. Difficulties in applying TRIZ to a design problem are discussed.

Comparison & Analysis of Anti-Reflection Coatings for Crystalline Si Solar cells (결정질 실리콘 태양전지의 반사방지막 비교 분석)

  • Cho, Kyeong-Yeon;Lee, Ji-Hun;Lee, Soo-Hong;Lee, Kyu-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.06a
    • /
    • pp.221-222
    • /
    • 2008
  • In Crystalline Si solar cells, Anti-Reflection Coating is contribute to improvement in energy conversion efficiency due to decrease of optical loss and recombination owing to surface passivation. Porous Si is formed electrochemical etching that uses chemical solution and anodization etching. So It gives that advantage in rapid process time and without high cost equipment. In this paper, We compare Porous Si with $SiO_2$/SiNx ARC and analyze that by anti-reflection coating.

  • PDF

2-dimensional hologram formation by selective etching on amorphous As-Ge-Se-S thin film (비정질 As-Ge-Se-S 박막에서 선택적 에칭을 통한 2차원 홀로그램 제작)

  • Kim, Jin-Hong;Kang, Jin-Won;Chung, Hong-Bay
    • Proceedings of the KIEE Conference
    • /
    • 2006.07c
    • /
    • pp.1430-1431
    • /
    • 2006
  • We investigated the formation of 2-dimension hologram grating by means of selective etching characteristic and photo-expansion effect according to photo irradiation on amorphous As-Ge-Se-S thin film. By method of phase holography, we made the 2-dimensional hologram grating by each (S:P) and ($+45^{\circ}:-45^{\circ}$) polarized beam with DPSS laser(532nm) and He-Ne laser(632nm). A recording property was observed at each polarized beam through 2-dimensional hologram surface relief grating. Chalcogenide thin film was etched selectively by NaOH solution after the formation of 1-dimensional diffraction grating. And then etched sample was rotated 90 degree to fabricate 2 dimensional hologram grating. We found that it was observed the formation of 2-dimensional hologram grating by AFM(Atomic Force Microscopy).

  • PDF