• Title/Summary/Keyword: etching solution.

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Fabrication of Superoleophobic Surface with Anisotropic Wettability Using Silicon Wafer (실리콘 웨이퍼를 이용한 이방성의 젖음성을 가지는 초소유성 표면 제작)

  • Lee, Dong-Ki;Lee, Eun-Haeng;Cho, Younghak
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.6
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    • pp.533-538
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    • 2014
  • We fabricated grooved mushroom structures with anisotropic wettability on silicon substrates using basic MEMS processes. The geometry of these grooved mushroom structures could be changed by controlling the additional IPA solution during Si etching by TMAH solution. To understand anisotropic wettability, contact angles (CAs) of hexadecane droplets were measured in the orthogonal and parallel directions to grooved lines. The CA measurement results displayed anisotropic wetting on the grooved mushroom structures. However, specimens with $80{\mu}m$ distance between top layers displayed isotropic and superoleophobic wetting. This study demonstrates that the thickness of the top layer is more critical than the width or height of the ridge when determining the wettability of organic solvent. Despite the wide distance between top layers ($80{\mu}m$), the specimen with a thin top layer (100 nm) showed highly anisotropic wetting and low CA due to the pinning of droplets at the edge of the top layer.

Improvement of Reaction Yield in the Shadow Mask Green Recycling Process (Shadow Mask GRS 공정에서의 반응수율 향상을 위한 기술개발)

  • Yoon, Mun-Kyu;Koo, Kee-Kahb;Lee, Moon-Yong
    • Clean Technology
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    • v.13 no.3
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    • pp.188-194
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    • 2007
  • In the present study, we developed a methodology to minimize a waste solution produced in the etching process. The condition for the optimization of the GRS process was studied on the basis of laboratory experiment and field test as well as pilot test. Through the study, we analyse the relation of the main process variables and the yield of the GRS process. The application of the new operation condition and the reactor internal modification results in 10% yield improvement in the GRS process and accordingly decreases a wasted solution.

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CMP (Chemical Mechanical Polishing) characteristics of langasite single crystals for SAW filter applications

  • Jang, Min-Chul;An, Jin-Ho;Kim, Jong-Cheol;Auh, Keun-Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.4
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    • pp.309-317
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    • 2000
  • Langasite is a promising new piezoelectric material for SAW filter application. Little was known until recently about the methods needed to mechanically polish and chemically polish/etch this material. In this experiment, polishing, slurry chemistry and chemical wet etching for langasite is described. Conventional quartz and LN ($LiNbO_3$) polishing methods did not produce satisfactory polished surfaces, and polishing with a colloidal silica slurries has shown to be most effective. The optimum condition was investigated by changing the slurry chemistry. As the planarization effect is very important in SAW filter applications, the examination of the effective particle number effect and the particle size effect was carried out. Z-cut langasite surface which had been polished with the colloidal silica slurries was etched in a variety of etchants. Conventional quartz etchants destroyed the polished surface. Other etchants formed a thin film on the surfaces. In this experiment, the reaction between langasite and a few etching solution was analysed. And an appropriate selective etchant solution for analyzing the defects was synthesized.

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A Study on Fabrication of La0.5Sr0.5CoO3Thin Films as an Electrode for Ferroelectric Memory by Self-patterning Technique (Self-patterning 기술을 이용한 강유전체 메모리 전극용La0.5Sr0.5CoO3박막의 제조에 관한 연구)

  • 손현수;김병호
    • Journal of the Korean Ceramic Society
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    • v.40 no.2
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    • pp.153-158
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    • 2003
  • Self-patterning of thin films using photosensitive sol solution has advantages such as simple manufacturing process compared to photoresist/dry etching process. In this study,$La_{0.5}SR_{0.5}CoO_3$(LSCO) thin films as an electrode material for ferroelectric memories have been prepared by spin coating method using photosensitive sol solution. La-2methoxyethoxide, Sr-ethoxide, Co-2methoxyethoxide were used as starting materials. As UV exposure time to the LSCO gel thin film increased, the UV absorption peak intensity of metal${beta}$-diketonate decreased due to reduced solubility by M(metal)-O-M bond formation. Solubility difference by UV irradiation on LSCO gel thin film allows to obtain a fine patterning of thin film. The LSCO thin films annealed over$680{\circ}C$ in air showed perovskite phase and the lowest resistivity$(4{ imes}10^{-3}{Omega}cm)$ of the thin films were obtained by annealing at$740{\circ}C$.

A Study on Fabrication of Photosensitive Sr0.9Bi2.1Ta2O9 Thin Film by Sol-gel Self-patterning Technique (Sol-gel Self-patterning 기술을 이용한 광감응성 Sr0.9Bi2.1Ta2O9 박막의 제조기술에 관한 연구)

  • Yang, Ki-Ho;Park, Tae-Ho;Lim, Tae-Young;Auh, Keon-Ho;Kim, Byong-Ho
    • Journal of the Korean Ceramic Society
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    • v.39 no.8
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    • pp.750-757
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    • 2002
  • Self-patterning of thin films using photosensitive sol solution has advantages such as simple manufacturing process compared to photoresist/dry etching process. In this study, ferroelectric $Sr_{0.9}Bi_{2.1}Ta_2O_9$ thin films have been prepared by spin coating method using photosensitive sol solution. Strontium ethoxide, tertramethylheptanedionato bismuth and tantalum ethoxide were used as starting materials. As UV exposure time to the SBT thin film increased, the UV absorption peak intensity of metal ${\beta}$-diketonate decreased due to reduced solubility by M-O-M bond formation. Solubility difference by UV irradiation on SBT thin film allows to obtain a fine patterning of thin film. Also, The ferroelectric properties of the UV irradiated SBT thin films were superior to those of the no-UV irradiated films.

Effect of 20 % EDTA Aqueous Solution on Defective Tubes (Alloy600) in High Temperature Chemical Cleaning Environments (고온화학세정환경에서 20 % EDTA 용액이 결함 전열관 (Alloy600)에 미치는 영향)

  • Kwon, Hyuk-chul
    • Corrosion Science and Technology
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    • v.15 no.2
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    • pp.84-91
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    • 2016
  • The transport and deposition of corrosion products in pressurized water nuclear reactor (PWR) steam generators have led to corrosion (SCC, denting etc.) problems. Lancing, mechanical cleaning and chemical cleaning have been used to reduce these problems. The methods of lancing and mechanical cleaning have limitations in removing corrosion products due to the structure of steam generator tubes. But high temperature chemical cleaning (HTCC) with EDTA is the most effective method to remove corrosion products regardless of the structure. However, EDTA in chemical cleaning aqueous solution and chemical cleaning environments affects the integrity of materials used in steam generators. The nuclear power plants have to perform the pre-test (also called as qualification test (QT)) that confirms the effect on the integrity of materials after HTCC. This is one of the series studies that assess the effect, and this study determines the effects of 20 % EDTA aqueous solution on defective tubes in high temperature chemical cleaning environments. The depth and magnitude of defects in steam generator (SG) tubes were measured by eddy current test (ECT) signals. Surface analysis and magnitude of defects were performed by using SEM/EDS. Corrosion rate was assessed by weight loss of specimens. The ECT signals (potential and depth %) of defective tubes increased marginally. But the lengths of defects, oxides on the surface and weights of specimens did not change. The average corrosion rate of standard corrosion specimens was negligible. But the surfaces on specimens showed traces of etching. The depth of etching showed a range on the nanometer. After comprehensive evaluation of all the results, it is concluded that 20 % EDTA aqueous solution in high temperature chemical cleaning environments does not have a negative effect on defective tubes.

Nano-gap Trench Etching using Forward Biased PN Junction for High Performance MEMS Devices (고성능 MEMS 소자를 위한 순방향 전극이 걸린 PN 접합을 이용한 나노 간격 홈의 식각)

  • Jeong, Jin-Woo;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.833-836
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    • 2005
  • Nano-gap trench is fabricated by the novel electrochemical etching technique using forward biased PN junction formed at the backside of the wafer. PN junction is formed using boron nitride wafer and the concentration of the boron doping is the high value of $1{\times}10^{19}$ $cm^{-3}$. The electro-chemical etching is performed in the 5% HF solution under the forward bias voltage of $1{\sim}2V$. The relationship between the etch rate of the trench and the voltage of the forward bias is investigated and the dependence of the gap for the voltage also examined. The etch rate increase from 0.027 ${\mu}m/min$ to 0.031 ${\mu}m/min$ as the value of the applied voltage increase from 1V to 2V, but the the gap is kept constant value of 40 nm.

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COMPARISON OF MICROLEAKAGE OF NEW GENERATION DENTIN BONDING SYSTEM (자가부식 전처치제를 이용한 상아질 결합재의 미세 누출에 관한 연구)

  • Kim, Jong-Soo
    • Journal of the korean academy of Pediatric Dentistry
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    • v.26 no.1
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    • pp.53-61
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    • 1999
  • Newley developed dentin bonding system which contains self-etching primer performed the removing of smear layer and etching procedure at once. So, it make possible more simple and shorter working time, the stronger bonding strength than conventional dentin bonding system. Cavities were prepared in the buccal and lingual surface of 30 extracted primary molars, and randomly assigned into three equal groups of 10 each. All cavities were filled with Z-100 composite resin following manufacturer's specifications after priming of three different dentin bonding system. Specimens stored for 7 days in 37 degree C water, thermocycled for 1000 cycles between 5 degree C and 55 degree C, immersed in 50% silvernitrate solution for 24 hours, and embedded in resin before being sectioned longitudinally. Data were analyzed by t-test and ANOVA. Mac-Bond II and Clearfil Linear-Bond II showed less microleakage at the occlusal and gingival margins compared to Scotchbond Multi Purpose. All dentin bonding systems showed significantly less microleakage at the occlusal margins compared to the gingival margins. But, there were no significantley difference between each group.

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Investigation of the surface structure improvement to reduce the optical losses of crystalline silicon solar cells (결정질 실리콘 태양전지의 광학적 손실 감소를 위한 표면구조 개선에 관한 연구)

  • Lee Eun-Joo;Lee Soo-Hong
    • New & Renewable Energy
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    • v.2 no.2 s.6
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    • pp.4-8
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    • 2006
  • Reduction of optical losses in crystalline silicon solar cells by surface modification is one of the most important issues of silicon photovoltaics. Porous Si layers on the front surface of textured Si substrates have been investigated with the aim of improving the optical losses of the solar cells, because an anti-reflection coating and a surface passivation can be obtained simultaneously in one process. We have demonstrated the feasibility of a very efficient porous Si AR layer, prepared by a simple, cost effective, electrochemical etching method. Silicon p-type CZ (100) oriented wafers were textured by anisotropic etching in sodium carbonate solution. Then, the porous Si layer were formed by electrochemical etching in HF solutions. After that, the properties of porous Si in terms of morphology, structure and reflectance are summarized. The surface morphology of porous Si layers were investigated using SEM. The formation of a porous Si layer about $0.1{\mu}m$ thick on the textured silicon wafer result in an effective reflectance coefficient Reff lower than 5% in the wavelength region from 400 to 1000nm. Such a surface modification allows improving the Si solar cell characteristics.

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Investigation of the crystalline silicon solar cells with porous silicon layer (다공성 실리콘 막을 적용한 결정질 실리콘 태양전지 특성 연구)

  • Lee, Eun-Joo;Lee, Il-Hyung;Lee, Soo-Hong
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.06a
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    • pp.295-298
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    • 2007
  • Reduction of optical losses in crystalline silicon solar cells by surface modification is one of the most important issues of silicon photovoltaics. Porous Si layers on the front surface of textured Si substrates have been investigated with the aim of improving the optical losses of the solar cells, because an anti-reflection coating(ARC) and a surface passivation can be obtained simultaneously in one process. We have demonstrated the feasibility of a very efficient porous Si ARC layer, prepared by a simple, cost effective, electrochemical etching method. Silicon p-type CZ (100) oriented wafers were textured by anisotropic etching in sodium carbonate solution. Then, the porous Si layers were formed by electrochemical etching in HF solutions. After that, the properties of porous Si in terms of morphology, structure and reflectance are summarized. The structure of porous Si layers was investigated with SEM. The formation of a nanoporous Si layer about 100nm thick on the textured silicon wafer result in a reflectance lower than 5% in the wavelength region from 500 to 900nm. Such a surface modification allows improving the Si solar cell characteristics. An efficiency of 13.4% is achieved on a monocrystalline silicon solar cell using the electrochemical technique.

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