• 한국태양에너지학회:학술대회논문집
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• 2009.11a
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• pp.383-387
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• 2009

Multi-crystalline silicon surface etching without grain-boundary delineation is a challenging task for the fabrication of high efficiency solar cell. The use of sodium hydroxide - sodium hypochlorite (NaOH40% + NaOCl 12%) solution for texturing multi-crystalline silicon wafer surface in solar cell fabrication line is reported in this article. in light current-voltage results, the cells etched in NaOH 40% + NaOCl 12% = 1:2 exhibited higher short circuit current and open circuit voltage than those of the cells etched in NaOH 40% + NaOCl 12% = 1:1 solution. we have obtained 15.19% conversion efficiency in large area(156cm2) multi-Si solar cells etched in NaOH 40% + NaOCl 12% = 1:1 solution.

• Journal of Korean Vacuum Science & Technology
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• v.2 no.2
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• pp.122-132
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• 1998

Characteristics of inductively coupled Cl2/O2 and Cl2/N2 plasmas and their effects on the formation of submicron deep trench etching of single crystal silicon have been investigated using Langmuir probe, quadrupole mass spectrometer (QMS), X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM), Also, when silicon is etched with oxygen added chlorine plasmas, etch products recombined with oxygen such as SiClxOy emerged and Si-O bondings were found on the etched silicon surface. However, when nitrogen is added to chlorine, no etch products recombined with nitrogen nor Si-N bondings were found on the etched silicon surface. When deep silicon trenches were teached, the characteristics of Cl2/O2 and Cl2/N2 plasmas changed the thickness of the sidewall residue (passivation layer) and the etch profile. Vertical deep submicron trench profiles having the aspect ratio higher than 5 could be obtained by controlling the thickness of the residue formed on the trench sidewall using Cl2(O2/N2) plasmas.

• The korean journal of orthodontics
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• v.26 no.3
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• pp.309-316
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• 1996

The purpose of this study was to determine the effect of salivary contamination of etched enamel on shear bond strength of a bracket adhered to etched enamel. Eighty extracted human permanent premolars were used in this study. These samples were divided into two groups. Buccal surface of samples were etched in vitro with 38% phosphoric acid for 15 seconds and 60 seconds. Each group was divided into four subgroups. Etched enamel surfaces were contaminated with saliva for 0, 1, 20, 60 seconds, washed and dried. Test surfaces were examined using scanning electron microscope(SEM). The shear bond strength of each sample was determined with a universal testing instrument(Instron Co. Model 4201). Results were as follows; 1. Salivary contamination for 1, 20, 60 seconds did not affect shear bond strength when compared with the uncontaminated enamel group. 2 There was no significant difference(P>.05) in shear bond strength between 15 sec. and 60 sec. etching in uncontaminated enamel groups. 3. When samples were examined using SEM, organic materials coated enamel surface masked the etched pattern partially.

• Journal of the Korean institute of surface engineering
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• v.31 no.2
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• pp.117-126
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• 1998

In this study, the residue remaining on the silicon wafer during the oxide overetching using $C_4F_8/H_2$ helicon were plasmas and effects of various cleaning and annealing methods on the removal of the remaining residue were investigated. The addition of 30%$H_2$ to the C4F8 plasma increased the C/F ratio and the thickness of the residue on the etched silicon surface. Most of the residuse on the etched surfaces colud be removed by the oxygen plasmsa cleaning followed by thermal annealing over $450^{\circ}C$. Hydrogen-coataining residue formed on the silicon by 70%$C_4F_8/30%H_2$ helicon plasmas was more easily removed than hydrogen-free residue formed residue formed by $C_4F_8$ helicon wear plasmas. However, damage remaining on the silicon surface overetched using 70%$C_4F_8/30%H_2$ helicon plasmas was intensive and the degree of reocvery duing the post-annealing was lower.

• Journal of the Korean institute of surface engineering
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• v.43 no.2
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• pp.80-85
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• 2010

The surfaces of WC-Co and SCM415 were etched to form a micro size protrusion for oil based ultra low friction applications using an ion bombardment process in a filtered vacuum arc plasma. WC-Co species showed that a self-patterned surface was available by the ion bombarding process due to the difference of sputtering yield of WC and Co. And the increasing rate of roughness was 0.6 nm/min at -600 V substrate bias voltage. The increasing rate of roughness of SCM415 species was 1.5 nm/min at -800 V, but the selfpatterning effect as shown in WC-Co was not appeared. When the SCM415 species pretreated by electrical discharge machining is etched, the increasing rate of roughness increased from 1.5 nm/min to 40 nm/min at -800 V substrate bias voltage and the uniform surface treatment was available.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.70-71
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• 2007

Multicrystalline silicon(mc-Si) solar cells are steadily increasing their share of the PV market due to the lower material costs. However, commercial mc-Si solar cells have lower efficiency than singlecrystalline silicon solar cells. To improve efficiency of mc-Si solar cells, it is important to reduce optical losses from front surface reflection. Isotropic etching with acid solution based on hydrofluoric acid(HF) and nitric acid$(HNO_3)$ is one of the promising methods that can reduce surface reflectance for mc-Si solar cells. Anisotropic etching is not suitable for mc-Si because of its various grain orientations. In this paper, we isotropically etched mc-Si using acid solution. After that, etched surface was observed by Scanning Electron Microscope(SEM) and surface reflectance was measured. We obtained 29.29% surface reflectance by isotropic etching with acid solution in wavelength from 400nm to 1000nm for fabrication of mc-Si solar cells.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.62-65
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• 2001

$SrBi_2Ta_2O_{9}$ thin films were etched in inductively coupled $Cl_{2}$/$CF_{4}$/Ar plasma. The maximum etch rate was 1060 $\AA\textrm{m}$/min in $Cl_{2}$/$CF_{4}$/Ar (80). The chemical reactions on the etched surface were studied with x-ray photoelectron spectroscopy. The etching of SBT thin films in $Cl_{2}$/$CF_{4}$/Ar were etched by chemically assisted reactive ion etching. The small addition of $Cl_2$ into $CF_4$(20)/Ar(80) plasma will decrease the fluorine radicals and the increase Cl radical.

• The Journal of the Korean dental association
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• v.23 no.7 s.194
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• pp.577-583
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• 1985

The purpose of this investigation was to evaluate scanning electron micrographs of repeatedly cast base metal alloy. For this study two Ni-Cr-Be alloys were used; Rexillium III and Verabond. They were repeatedly cast without addition o new alloy melting with an electric resistant furnace (Castron 8, Yoshida dental equipment Mfg.Co.). They were etched with 10% H₂SO₄ Sol. at 300mA/㎠ for 3 minutes with the use of metal etching unit Oxyetch (OXY dental product Inc.), and ultrasonic cleaning in 18% HC1 Sol. was done. Etched surfaces were examined under a SEM at x 200 and x 750. The surfaces are shown in legends.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.235-236
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• 2008

Wet etched ZnO:Al films for thin film solar cells were prepared by Facing Target sputtering(FTS) method. Wet etching has been used to produce a rough TCO surface that enables light trapping in the absorber. The ZnO:Al films for thin film solar cells were etched by HCl 0.5%. The etching performance of ZnO:Al films can be tuned by changing etching time. The etched ZnO:Al films compared to a smooth ZnO:Al thin film structure. From the results, the lowest resistivity of deposited films was $5.67\times10^{-4}$ [$\Omega$-cm] and the transmittance of all ZnO:Al thin films were over 80% in visible range.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.288-291
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• 1996

The surface properties after plasma etching of TiW solutions using the chemistries of BCl$_3$ and SF$\_$6/ gases with varying mixing ratio have been investigated using X-ray photoelectron spectroscopy. The elements of C, Cl, F, O and S are observed on the etched TiW films. After plasma etching with SF$\_$6/ gas, Ti-S bond are detected on the samples and Ti-S bond makes a role of passivation layer that surpresses Ti-O formation. After plasma etching wish BCl$_3$ gas, Ti are easily removed but W are hardly etched. As a results, W/Ti are increased on the etched sample.