DOI QR코드

DOI QR Code

Surface Modification of WC-Co and SCM415 by the Ion Bombardment Process of Filtered Vacuum Arc Plasma

자장 여과 아크 이온빔 식각 공정을 이용한 WC-Co 및 SCM415 금속 소재 표면 구조 제어 연구

  • 이승훈 (한국기계연구원 부설 재료연구소) ;
  • 윤성환 (한국기계연구원 부설 재료연구소) ;
  • 김도근 (한국기계연구원 부설 재료연구소) ;
  • 권정대 (한국기계연구원 부설 재료연구소) ;
  • 김종국 (한국기계연구원 부설 재료연구소)
  • Received : 2010.04.09
  • Accepted : 2010.04.29
  • Published : 2010.04.30

Abstract

The surfaces of WC-Co and SCM415 were etched to form a micro size protrusion for oil based ultra low friction applications using an ion bombardment process in a filtered vacuum arc plasma. WC-Co species showed that a self-patterned surface was available by the ion bombarding process due to the difference of sputtering yield of WC and Co. And the increasing rate of roughness was 0.6 nm/min at -600 V substrate bias voltage. The increasing rate of roughness of SCM415 species was 1.5 nm/min at -800 V, but the selfpatterning effect as shown in WC-Co was not appeared. When the SCM415 species pretreated by electrical discharge machining is etched, the increasing rate of roughness increased from 1.5 nm/min to 40 nm/min at -800 V substrate bias voltage and the uniform surface treatment was available.

Keywords

References

  1. A. M. Korsunsky, A. R. Torosyan, K. M. Kim, Thin Solid Fims, 516 (2008) 5690. https://doi.org/10.1016/j.tsf.2007.07.056
  2. N. Wain, N. R. Thomas, S. Hickman, J. Wallbank, D. G. Teer, Surf. Coat. Technol. 200 (2005) 1885. https://doi.org/10.1016/j.surfcoat.2005.08.016
  3. D. Yonekura, R. J. Chittenden, P. A. Dearnley, Wear, 259 (2005) 779. https://doi.org/10.1016/j.wear.2004.12.008
  4. J.-K. Kim, E.-S. Lee, D.-H. Kim, D.-G. Kim, Thin Solid Films, 447 (2004) 95. https://doi.org/10.1016/j.tsf.2003.09.029
  5. D.-G. Kim, I. Svadkovski, S. H. Lee, J.-W. Choi, J.-K. Kim, Current Appl. Phys. 9 (2009) 179. https://doi.org/10.1016/j.cap.2008.01.007
  6. V. I. Gorokhovsky, D. G. Bhat, R. Shivpuri, K. Kulkarni, R. Bhattacharya, Surf. Coat. Technol., 140 (2001) 215. https://doi.org/10.1016/S0257-8972(01)01023-4
  7. A. Anders, S. Anders, I. G. Brown, Plasma Sources Sci. Technol. 4 (1995) 1. https://doi.org/10.1088/0963-0252/4/1/001
  8. M. A. Lieberman, A. J. Lichtenberg, Principles of Plasma Discharge and Materials Processing, 2nd edition, Wiley-Interscience (2005) 37.
  9. D. C. Meeker, Finite Element Method Magnetics, Version 4.0.1 (03Dec2006 Build), http://www.femm. info
  10. K. Wasa, M. Kitabatake, H. Adachi, Thin Film Materials Technology, Elsevier Science & Technology Books (2004).
  11. http://eaps4.iap.tuwien.ac.at/www/surface/script/sputteryield.html
  12. K. Fuchs, P. Rdhammer, E. Bertel, F. P. Netzer, E. Gornik, Thin Solid Films 151 (1987) 383. https://doi.org/10.1016/0040-6090(87)90137-4