• Coupled systems mechanics
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• v.5 no.4
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• pp.355-369
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• 2016

Changes in chemical structure have profound effects on the physical properties of epoxy-based materials, and eventually affect the durability of the entire system. Microscopic structural voids generally existing in the epoxy cross-linked networks have a detrimental influence on the epoxy mechanical properties, but the relation remains elusive, which is hindered by the complex structure of epoxy-based materials. In this paper, we investigate the effect of structural voids on the epoxy-based materials by using our developed mesoscale model equipped with the concept of multiscale modeling, and SU-8 photoresist is used as a representative of epoxy-based materials. Developed from the results of full atomistic simulations, the mesoscopic model is validated against experimental measurements, which is suitable to describe the elastic deformation of epoxy-based materials over several orders of magnitude in time- and length scales. After that, a certain quantity of the structure voids is incorporated in the mesoscale model. It is found that the existence of structural voids reduces the tensile stiffness of the mesoscale epoxy network, when compared with the case without any voids in the model. In addition, it is noticed that a certain number of the structural voids have an insignificant effect on the epoxy elastic properties, and the mesoscale model containing structural voids is close to those found in real systems.

• Journal of Powder Materials
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• v.30 no.4
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• pp.346-355
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• 2023

Epoxy-based composites find extensive application in electronic packaging due to their excellent processability and insulation properties. However, conventional epoxy-based polymers exhibit limitations in terms of thermal properties and insulation performance. In this study, we develop epoxy-based siloxane/silica composites that enhance the thermal, mechanical, and insulating properties of epoxy resins. This is achieved by employing a sol-gel-synthesized siloxane hybrid and spherical fused silica particles. Herein, we fabricate two types of epoxy-based siloxane/silica composites with different siloxane molecular structures (branched and linear siloxane networks) and investigate the changes in their properties for different compositions (with or without silica particles) and siloxane structures. The presence of a branched siloxane structure results in hardness and low insulating properties, while a linear siloxane structure yields softness and highly insulating properties. Both types of epoxy-based siloxane/silica composites exhibit high thermal stability and low thermal expansion. These properties are considerably improved by incorporating silica particles. We expect that our developed epoxy-based composites to hold significant potential as advanced electronic packaging materials, offering high-performance and robustness.

• Macromolecular Research
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• v.12 no.1
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• pp.11-21
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• 2004

Toughening of epoxy resins for improvement of crack resistance has been the subject of intense research interest during the last two decades. Epoxy resins are successfully toughened by blending with a suitable liquid rubber, which initially remains miscible with epoxy and undergoes a phase separation in the course of curing that leads to the formation of a two-phase microstructure, or by directly blending preformed rubbery particle. Unlike the situation for thermoplastics, physical blending is not successful for toughening epoxy resins. Recent advances in the development of various functionalized liquid rubber-based toughening agents and core-shell particles are discussed critically in this review.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.136-139
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• 2000

Epoxy materials are used as insulation material for electric power cables. In the case of a flow of excess current due to the temperature difference which occurs between the heat of the conductor and the atmosphere, heat degrades connection point of the cables. Also, the mechanical stress, which occurs due to the thermal expansion coefficient of cable connection electrode system and epoxy insulation materials along with the gap between thermal conduction based on the extra high voltage of transmitted voltage, increases possibility of cracks to occur. The relationship between mechanical stress and electrical breakdown mechanism is verified for the epoxy materials such as high toughness epoxy materials, which comes to be used contemporarily, and for the breakdown mechanism of epoxy materials on the multi-stresses (mechanical and electrical) due to the variation of the temperature.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Proceedings of the Korean Fiber Society Conference
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• 1998.10a
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• pp.61-65
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• 1998

Epoxy resins are currently one of the most widely used thermoset polymers. Applications on epoxy-based materials range from common to structural adhesives as well as to matrix materials for high performance composites. The outstanding versatility of this resin can be related to the reactivity of the epoxy group, which can be opened by a large number of different chemical compounds, such a aliphatic and aromatic amines, anhydrides and poly-amides. (omitted)

• Journal of the Korean institute of surface engineering
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• v.56 no.1
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

• Advances in materials Research
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• v.5 no.3
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• pp.171-179
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• 2016

Fusion and characterization of bisphenol-A diglycidyl ether based thermosetting polymer mortars containing an epoxy resin, Fly ash and Rock sand are presented here for the Experimental study. The specimens have been prepared by means of an innovative process, in mild conditions, of commercial epoxy resin, Fly ash and Rock sand based paste. In this way, thermosetting based hybrid mortars characterized by a different content of normalized Fly ash and Rock sand by a homogeneous dispersion of the resin have been obtained. Once hardened, these new composite materials show improved compressive strength and toughness in respect to both the Fly ash and the Rock sand pastes since the Resin provides a more cohesive microstructure, with a reduced amount of micro cracks. The micro structural characterization allows pointing out the presence of an Interfacial Transition Zone similar to that observed in cement based mortars. A correlation between micro-structural features and mechanical properties of the mortar has also been studied.

• Composites Research
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• v.34 no.3
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• pp.180-185
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• 2021

Due to the formation of random three dimensional network structure, which cause a lot of scattering of phonons, the thermal conductivity is low when the liquid crystalline epoxy is cured with amine-based curing agent. This problem is solved by using a cationic initiator that can make mesogen groups to be stacked structure. In this experiment, the thermal stability is compared by investigating the activation energy of isothermal decomposition through TGA of an epoxy using an amine-based curing agent and a cationic initiator. As a result, the energy of the activation of the epoxy using a cationic initiator is high. Compared with the previous experiments, the thermal stability is similar to the thermal conductivity.

• Textile Coloration and Finishing
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• v.27 no.1
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• pp.11-17
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• 2015

Recently, super fiber reinforced composite materials are widely used in many industries due to high mechanical properties. In this study, 2 different types of composite materials were manufactured in order to compare their mechanical properties. Carbon and Aramid fibers were used for reinforcement materials and Bisphenol-A type epoxy resin was for matrix. Two kinds of fiber-reinforced materials were manufactured by RIM(Resin Injection Molding) method. Before manufacturing composite materials, the optimal manufacturing and curing process condition were established and the ratio of reinforcement to epoxy resin was discussed. FT-IR analysis was conducted to clarify the structure of epoxy resin. Thermal and mechanical property test were also carried out. The cross-section of composite materials was observed using a scanning electron microscope(SEM).