• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.441-446
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• 2000

Although the net-shape molding of composites is generally recommended, molded composites frequently required cutting or grinding due to the dimensional inaccuracy for precision machine elements. During the composite machining operations such as cutting and grinding, the temperature at the grinding area may increase beyond the allowed limit due to the low thermal conductivity of composites, which might degrade the matrix of composite. Therefore, in this work, the temperature at the grinding point during surface grinding of carbon fiber epoxy composite was measured. The grinding temperature and surface roughness were also measured to investigate the surface grinding characteristics of the composited. The experiments were performed both under dry and wet grinding conditions with respect to cutting speed, feed speed, depth of cut and stacking angle. From the experimental investigation, the optimal conditions for the composite plain grinding were suggested.

• Journal of the Korea Society of Computer and Information
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• v.22 no.10
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• pp.1-7
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• 2017

In this paper, the separation force measuring system is developed. The separation force aries due to adhesive strength between semiconductor epoxy molding compound(EMC) and the metal plate in semiconductor formed plate. In general, when removing the metal plate in semiconductor formed plate from semiconductor epoxy molding compound, excessive strength can result in a increase in semiconductor defect rates, or conversely, if too little force is exerted on the metal plate in semiconductor formed plate, the semiconductor production rates can decrease. In this study, the design criteria for the selection of the AC servo motor, the role of the ball screw, the relationship between the load cell and the ball screw, and the rate of deceleration are given. In addition, minimizing the reject rate of semiconductors and maximizing the semiconductor production rate are achieved through the standardization of the collected separation force data measured by the proposed system.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.147-150
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• 2004

Graphite reinforced conductive polymer composites were fabricated by the compression molding technique. Graphite powder (conductive filler) was mixed with an epoxy resin to impart electrical property in composites. The ratio of graphite powder was varied to investigate electrical property of cured conductive composites. In this study, graphite filled conductive polymer composites with high filler loadings$(>60wt.\%)$ were manufactured to accomplish high electrical conductivity(> 100S/cm). Graphite powder increase electrical conductivity of composites by direct physical contact between particles. While high filler loadings are needed to attain good electrical property, the composites becomes brittle. So the ratio of filler to epoxy was varied to optimize of cured composites. The optimum molding pressure according to filler was proposed experimentally.

• Journal of Surface Science and Engineering
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• v.36 no.4
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• pp.347-355
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• 2003

Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

• Journal of Surface Science and Engineering
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• v.56 no.1
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

• Transactions on Electrical and Electronic Materials
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• v.1 no.3
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• pp.23-28
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• 2000

A block-oxide layer was formed on the surface of Cu-based leadframe by chamical oxidation method in order to enhance the adhesion strength between Cu-based leadframe and epoxy molding compound (EMC) Using sandwiched double cantilever beam (SDCB) specimens, the adesion strength was measured in terms of interfacial fracture toughness, G$\sub$IC//Results showed that the black-oxide layer was composed of two kinds of layers: pebble-like Cu$_2$O layer and acicular CuO layer, At the initial stage of oxidation the Cu$_2$O layer was preferentially formed and thickened up to around 200 nm whithin 1 minute of the oxidation time. Then the CuO layer started to from atop of the Cu$_2$O layer and thickened up to around 1300 nm until 20 minutes. As soon as the CuO layer formed, the thickness of Cu$_2$O layer began to reduce and finally reached to around 150 nm. The pre-cleaned and the Cu$_2$O coated leadframes showed almost no adhesion of EMC, however, as the CuO precipitates appeared and became continuous, G$\sub$IC/ increased up to around 80 J/㎡. Further oxidation raised G$\sub$IC/ up. to around 100 J/㎡.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Journal of the Korea Institute of Military Science and Technology
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• v.9 no.3
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• pp.88-94
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• 2006

In order to substitute current aluminum sabot and to increase the penetration performance of the kinetic energy projectiles, the research and development program for composites sabot has been conducted. For carbon/epoxy composites sabot, unidirectional carbon fiber reinforced epoxy prepreg was chosen and thick sectioned composites preforms with the different fiber angles along the circumferential direction of sabot were prepared by compression molding under the careful processing conditions at $150^{\circ}C$ for 1hour with $70kgf/cm^2$ curing pressure. The composites sabot demonstrated a weight reduction by approximately 30% than that of current aluminum sabot. The muzzle velocity of a kinetic energy projectile with composites sabot was measured to be about 63m/s higher than that with aluminum sabot. These results imply that the penetration performance is expected to be considerably increased when the composite sabot is applied to the kinetic energy projectiles.