• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.19 no.12
• /
• pp.87-97
• /
• 2020

In this study, a UV-cured GFRP molding is made using a combination of hand lay-up and resin transfer molding, and its properties are analyzed. The molded plates produced using various vacuum pressures (0 mmHg, -450 mmHg, and -760 mmHg) are examined via a comparison of hand lay-up molding and resin transfer molding. Tests are conducted by processing tensile specimens (ASTM D-5083), flexural test specimens (ASTM D-790), and ILSS test specimens (ASTM D-2344) according to each ASTM standard with a molded plate. Similarly, the UV-cured GFRP molding is compared against GFRP using epoxy. It was confirmed that the mechanical strengths of all the specimens increased when the vacuum pressure was increased and when UV curing was applied. This is believed to be because as the vacuum pressure increases, the pores of the cured specimen are removed, thereby reducing defects, and the bonding force between the glass fiber and the resin is stronger than that of the epoxy resin. It is expected that if resin transfer molding methods and UV-cured resins are used for molding GFRP composites in industry, products with better mechanical properties and faster curing time will be produced.

• Elastomers and Composites
• /
• v.57 no.2
• /
• pp.48-54
• /
• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Elastomers and Composites
• /
• v.49 no.1
• /
• pp.59-65
• /
• 2014

In this study, in order to complete curing reaction of the molding compound comprising an epoxy/anhydride at $71^{\circ}C$ for 40 hours, metal coordination complexes such as cobalt (II) acetylacetonate, potassium acetylacetonate, iron (III) acetylacetonate and chromium (III) octoate as a catalyst were applied to the epoxy/anhydride compounds respectively. The weight ratio of an epoxy part/an anhydride part was adjusted to improve the mechanical properties of the molding compound. According to the experimental results, an epoxy/anhydride compound containing chromium (III) octoate showed a high conversion at $71^{\circ}C$ for 40 hours as well as a proper processability at room temperature among the several metal coordination complexes. For the mechanical properties of the cured epoxy/anhydride compound, the compounds containing weight ratio from 0.9/1 to 0.5/1 of the epoxy part/anhydride part with chromium (III) octoate showed the high flexural strength, and higher compressive strength was shown with increasing of the hardener part.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.12
• /
• pp.751-756
• /
• 2017

A molding-type power inductor is an inductor that uses a hybrid material that is prepared by mixing a ferrite metal powder coated with an insulating layer and an epoxy resin, which is injected into a coil-embedded mold and heated and cured. The fabrication of molding-type inductors requires various techniques such as for coil formation and insertion, improving the magnetic properties of soft magnetic metal powder, coating an insulating film on the magnetic powder surface, and increasing the packing density by well dispersing the powder in the epoxy resin. Among these aspects, researches on additives that can disperse the metal soft magnetic powder having the greatest performance in the epoxy resin with high charge have not been reported yet. In this study, we investigated the effect of silanes, KBM-303 and KBM-403, and a commercial dispersant on the dispersion of metal soft magnetic powders in epoxy resin. The sedimentation height and viscosity were measured, and it was confirmed that the silane KBM-303 was suitable for dispersion. For this silane, the packing density was as high as about 72.49%. Moreover, when 1.2 wt% of dispersant BYK-103 was added, the packing density was about 80.5%.

• Applied Chemistry for Engineering
• /
• v.32 no.4
• /
• pp.449-455
• /
• 2021

Composite materials are substances that are configured to have excellent physical properties by combining the properties of a single substance, and are in the limelight as materials that exceed the performance of metals and polymers. However, it has the disadvantages of long cycle time and high unit price, and much research is being performed to overcome these disadvantages. In this study, we developed an epoxy resin curing agent that can shorten the time required for mass production of composite materials, and tried to expand the applicability of objections by imparting flame retardancy. The epoxy resin used as a basic substance utilized two types of bisphenol F and resorcinol structure, which was further modified using 9,10-dihydro-9-oxa-10-phosphaphenantrene-10-oxide (DOPO) to impart flame retardancy. Triethylphosphate (TEP) and bis [(5-ethyl-2-methyl-1,3,2-dioxaphosphorinan-5-yl)methyl] methyl phosphonate P,P'-dioxide (FR-001) were used as additives, seven kinds of compositions were blended, thermal characteristics (gelation time, glass transition temperature) and flame retardant performance were evaluated. We successfully developed an epoxy matrix that can be applied to high pressure resin transfer molding (HP-RTM) process.

• Applied Chemistry for Engineering
• /
• v.8 no.3
• /
• pp.533-542
• /
• 1997

Due to the trends of faster and denser circuit design, dielectric properties of packaging materials for semiconductor will give a greater influence on performance and reliability. Also as chip becomes more densified, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semiconductor packaging materials are low values of dielectric constant, high values of thermal conductivity, relatively low values of thermal expansion coefficient and low cost. Thus, in this study, to achieve increased performance of EMC, crystalline silica was selected as the filler for epoxy matrix. As a result, when the volume percent of crystal silica was 60~70%, good properties as packaging materials for semiconductor were achieved. In addition, overall molding condition of EMC in this experiment was established.

• Journal of the Society of Naval Architects of Korea
• /
• v.49 no.6
• /
• pp.521-527
• /
• 2012

It is well known that flexible composite material propeller has superior radiation noise characteristics with outstanding damping effects. In this paper, three flexible composite material propellers were produced using compression molding process, and their hydrodynamic performances and radiation noise characteristics were measured. One propeller, C1, was made up from carbon/epoxy composite laminates, and the other two ones, G1 and G2, from glass/epoxy ones. Their fiber arrays were selected by the progressive damage structural analysis of propellers using composite material model MAT_162 (Composite_DMG_MSC) linked with LS-DYNA code. Carbon/epoxy and glass/epoxy composite specimen tests were performed, their damage mechanisms were figured out, and their parameters were calibrated by their progressive damage structural analysis according to their damage criteria.

• Journal of Adhesion and Interface
• /
• v.2 no.2
• /
• pp.1-10
• /
• 2001

Silica for Epoxy Molding Compound (EMC) was coated via plasma-polymerization with RF plasma (13.56 MHz) as a function of treatment time, power and pressure. 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allylmercaptan or allylalcohol were utilized for plasma polymerization coating and adhesion of coated silica was evaluated by measuring flexural strength. CTE and water absorption of EMC were also measured, and fracture surface of flexural specimen was analyzed by SEM in order to elucidate the failure mode. The plasma polymer coated silica was analyzed by FT-IR and reactivity of plasma polymer coating with epoxy resin was evaluated with DSC in order to investigate the adhesion mechanism. The EMC prepared from the silica coated with 1,3-diaminopropane or allylamine exhibited high flexural strength, low CTE, and low water absorption compared with the control sample, and also exhibited 100% cohesive failure mode. These results can be attributed to the chemical reaction between the functional groups in the plasma polymer coating and epoxy resin, and also consistent with the results from FT-IR and DSC analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1995.11a
• /
• pp.289-292
• /
• 1995

In this experiment the specimen is selected for epoxy resin used in the molding compound materials for the power semiconductors. The specimen was divided into the two parts. one is a specimen without irradiation, the other is irradiated with electron beam, of which dose is 1[Mrad], 2[Mrad], 4[Mrad], 8[Mrad] and 24[Mrad], respectively. From the analysis for the physical properties of the specimen, the carbonyl group which is asffact the electrical properties is decreased according to increase the dose of the electron beam. In the measurement of dielectric characteristics among the electrical properties, the frequency dependance of the dielectric characteristics is confirmed that its ${\beta}$-peak is represented by one peak due to attribute to the main chain below 50[$^{\circ}C$], and two peak above the temperature 100[$^{\circ}C$].

• Journal of the Microelectronics and Packaging Society
• /
• v.5 no.2
• /
• pp.37-48
• /
• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.