• 전자공학회논문지 IE
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• v.45 no.4
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• pp.42-46
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• 2008

LED's production does Die bonding and Wire bonding on L/F board, and do epoxy dispensing to protect LED Chip and improve brightness. In this paper, we propose and realize a x-y-z axis robot mechanism detecting automatically eopxy's amount being filled, control data of pressure and time by the quantity automatic revision, and epoxy of the schedule amount dispensing.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.733-736
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• 2007

We have proposed novel bonding technique of substrates for developing the flexible LCD with high quality. The gel type mixture of agarose and UV curable epoxy developed to obtain tight bonding ability and enhanced electro-optical characteristic simultaneously. This technique can be used to roll-to-roll process for fabricating the flexible LCDs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.485-486
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• 2012

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.272-276
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• 1999

The present paper proposes design and manufacturing methods of the carbon/epoxy square grid structure with near zero-CTE in three geometrical principal directions. Bonding strength of the grid structure is examined for different bonding methods. Numerical examples show that maximum displacement of the composite grid structure is almost zero comparing with that of aluminum grid structure with same dimension under thermal loading.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.653-654
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• 2010

• Textile Coloration and Finishing
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• v.29 no.1
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• pp.37-44
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• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• Journal of the Korea institute for structural maintenance and inspection
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• v.7 no.2
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• pp.149-157
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• 2003

The purpose of this paper is to quantitatively investigate aging state of epoxy coating on containment structure at nuclear power plant. In order to evaluate an physical bonding of the epoxy coating, adhesion test was performed on a degraded epoxy coating on concrete specimens fabricated by accelerated aging experiment. In addition, impedance data by ultrasonic test were measured to compare with adhesion data. From almost 50 % of the specimens, aging phenomena of epoxy coating such as pin hole, blistering was discovered. To improve reliability on quality degradation of epoxy, co-relation between two kinds of different data was analyzed. By tracing co-related these data, it was possible to figure out physical state of as-built epoxy coating. The possibility to develop new methodology of time - dependent aging state on epoxy coating was found and discussed.

• Journal of Powder Materials
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• v.15 no.2
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• pp.119-124
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• 2008

To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.

• Proceedings of the Korea Concrete Institute Conference
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• 2000.10a
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• pp.785-792
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• 2000

Repair and retrofit system of concrete structures has been developed from conventional reinforced concrete overlaying, steel plate bonding and recently to fiber composite systems. Research and study on carbon, aramid, and glass fiber composite system has been actively carried out from all over the world Glass fiber composite is proved to be competitive technically and enconomically, among fiber composite system. CAF system is a system developed locally using all domestic materal, glass fabric and epoxy, and improved in shear bonding property by utilizing silica fume mixed with epoxy. All the tests on material properties, structural behavior, constructiveness at site and quality control procedure proved to be most appropriate system so far developed. Futher research work is and will be under progress for utilization of this system which will be applied to more adverse situation.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.161-164
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• 2004

In these days, composite materials are applied to the military field like parts of air crafts, rockets, ammunitions and so on. As high pressure is loaded on the composite body, however, cracks or delamination phenomena can be occurred between layers of laminate. These cracks or delamination usually cause a deterioration of mechanical properties under the complicated loads. In this study, methods for improvement of the inter-laminar bonding strength of thick carbon/epoxy composite structures are suggested and discussed in terms of segment bending test.