Browse > Article
http://dx.doi.org/10.4150/KPMI.2008.15.2.119

Improvement of Pot Life in the Epoxy Resin-based Adhesive Formulation by Size Control and Coating of Curing Accelerator Powders  

Lee, Jun-Sik (Micro-Joining Center/Advanced Joining Technology Team, KITECH (Korea Institute of Industrial Technology))
Hyun, Chang-Yong (Department of Materials Science and Engineering, Seoul National University of Technology)
Lee, Jong-Hyun (Department of Materials Science and Engineering, Seoul National University of Technology)
Publication Information
Journal of Powder Materials / v.15, no.2, 2008 , pp. 119-124 More about this Journal
Abstract
To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.
Keywords
RFID; Chip bonding; Epoxy resin; High-speed curing; Pot life;
Citations & Related Records
연도 인용수 순위
  • Reference
1 D. Wojciechowski, J. Vanfleteren, E. Reese and H.-W. Hagedorn: Microelectronics Reliability, 40 (2000) 1215   DOI   ScienceOn
2 J. S. Rasul: Microelectronics Reliability, 44 (2004) 135   DOI   ScienceOn
3 C.-M. Cheng, V. Buffa, W. O'Hara, B. Xia and J. Shah: Global SMT & Packaging, 5 (2005) 17
4 M. Fairley, RFID Smart Labels, Tarsus Exhibition and Publishing, London (2005) 19
5 Korean Patent Publication, 2007-0092639
6 Korean Patent Number, 0673778
7 Korean Patent Number, 2003-0041572
8 U.S. Patent Number US 6,555,602
9 J.-S. Lee, J.-K. Kim and J.-H. Lee: Collection of the Awarded Research Papers in RFID/USN Korea 200, Korea Association at RFID/USN, Seoul (2007) 43
10 H. Nogami, T. Nagai and A. Sasuta: Chem. Pharm. Bull., 14 (1966) 329   DOI   ScienceOn
11 A. Noyes and W. Whitney: J. Am. Chem. Soc., 19 (1987) 930
12 W. Nernst and Z. Phys: Chem., 47 (1904) 52
13 J. T. Carstensen: Theory of Pharmaceutical System, Academic Press, New York (1972) 238
14 M. J. Yim and K. W. Paik: Int. J. Adhesion & Adhesives, 26 (2006) 304   DOI   ScienceOn