• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• 한국수소및신에너지학회논문집
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• 제25권2호
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• pp.131-138
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• 2014

Highly conductive bipolar plate for polymer electrolyte membrane fuel cell (PEMFC) was prepared using phenol novolac-type epoxy/graphite powder (GP)/carbon fiber filament (CFF) composite, and a rubber-modified epoxy resin was introduced in order to give elasticity to the bipolar plate graphite fiber (GF) was incorporated in order to improve electrical conductivity. To find out the cure condition of the mixture of novolac-type and rubber-modified epoxies, differential scanning calorimetry (DSC) was carried out and their data were introduced to Kissinger equation. And tensile and flexural tests were carried out using universal testing machine (UTM) and the surface morphology of the fractured specimen and the interfacial bonding between epoxy matrix and CFF or GF were observed by a scanning electron microscopy (SEM).

• Journal of Welding and Joining
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• 제29권4호
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• pp.54-60
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• 2011

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.509-510
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• 2007

The Breakdown properties of epoxy composites are used for transformers and sensor, which has been studied. As a result, From the measurements of breakdown voltage, the more hardener is increased the stronger breakdown strength at low temperature because the ester of hardener is increased. Breakdown strength at the high temperature is decreased because the temperature at $110^{\circ}C$ is near at $T_g$. When the filler is added, between epoxy and silica is formed interface. Therefore the charge is accumulated in it, and the electric field is concentrated, and breakdown strength is decreased than non-filled specimens. In the case of specimens, the treated with silane, the breakdown strength becomes much higher since this is suggested that silane coupling agent has been improved chemical bonding in the interfaces and has been relaxed the electric filed concentration.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.388-394
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• 2008

For purpose of anti-static film remaining unchanged in the condition of $160^{\circ}C$, organic solvent, acid and base solution $0.01\sim0.03{\mu}m$ particles of Sb doped tin oxide(ATO) were grafted by 3-Glycidyloxypropyltrimethoxysilane(GPTS) for improving interfere bonding force between ATO and epoxy resin. The particles were dispersed in 2-methoxyethanol with YD-I28(Bisphenol A type epoxy resin, Kukdo chemical) and 1-imidazole as hardener. The anti-static solutions were coated on PI film as thickness of $0.1{\mu}m$. Surface resistivity of anti-static film containing conductive polymer became $10^{12}\Omega/\Box$ after 32 hours in $160^{\circ}C$. The surface resistivity of ATO grafted by GPTS / Epoxy coating layer remained as $10^{7.6}\Omega/\Box$ in $160^{\circ}C$ for 7 days. ATO grafted by GPTS / Epoxy coating layer coated on PI film was dipped in acetone for 7 days. The surface resistivity remained unchanged as $10^{7.6}\Omega/\Box$. The anti-static layer dipped in water solutions containing each KOH 10 wt % and $H_2SO_4$ 2 wt% was ultra-sonicated for 10 minutes per once until 30th. The surface resistance of anti-static layer containing ATO grafted by GPTS remained unchanged.

• 보존과학회지
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• 제26권1호
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• pp.25-32
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• 2010

에폭시의 황변 현상은 도자기 복원재에 있어 항상 발생하는 문제로 알려져 있다. 이들의 재복원을 위해서는 반드시 이 에폭시의 제거가 선행되어야 하는 바, 본 논문에서는 이의 화학적인 제거법과 그 제거제의 특성들에 대하여 논의하고자 하였다. 이 논문에서 파손되어 에폭시로 복원된 다양한 형태의 도자기들에서 에폭시의 화학적 제거에 대하여 설명하였으며 디크로로메탄(Dichloromethane)과 Dichloromethane을 기초로 한 Dimethylformamide를 이용한 용액들이 나타내는 도자기 복원에 사용된 에폭시 제거법에 대하여 설명하였다. 이들 중, 특히 Dichloromethane + Dimethylformamide 용액을 이용할 경우, 색도의 변화, 광택도의 변화, 굽힘 강도의 변화, 무게의 변화, 표면도, 박리 시간에서 매우 우수한 결과를 나타내었다. 이것은 Dichoromethane의 에폭시에 대한 팽윤 성질과 Dimethylformamide의 연화성 증진의 결과로 Dichloromethane은 에폭시와 도자기의 경계면을 팽윤시켜 박리시키면서, Dimethylformaide가 에폭시 자체의 경도를 낮춤으로 매우 약한 내부 결합을 가진 도자기라도 안정한 박리가 가능한 결과로 보인다. 또 이 용액의 직접적인 적용을 위하여 국내 대학 박물관 소장 청화백자모란문 양념단지의 재복원시의 에폭시 제거제로 이용하였으며, 매우 안정된 박리 현상을 발견할 수 있어 추후, 이를 이용하여 재 복원될 도자기 유물에 실적용할 경우, 완벽하고 안전하게 에폭시를 제거함으로 재복원될 에폭시 접착제의 제거에 충분히 이용이 가능할 것으로 사료된다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.292-297
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• 2000

In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

• 한국기계가공학회지
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• 제20권8호
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• pp.18-24
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• 2021

Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.

• Advances in aircraft and spacecraft science
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• 제4권6호
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.

• 폴리머
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• 제25권4호
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• pp.587-593
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• 2001

본 연구에서는 red mud(RM)를 0.1, 1, 그리고 5M 의 H$_3PO_4$ 용액으로 화학적 표면처리하여 에폭시/RM 나노복합재료를 제조하였으며, RM 표면의 pH, 표면 산-염기도, 표면적, 그리고 기공도를 이용하여 표면처리에 의한 영향을 분석하였다. 또한, 임계응력 세기인자(K$_{IC}$)를 통하여 제조된 복합재료의 기계적 계면물성을 조사하였다. 실험결과로부터, 표면처리에 의한 RM의 표면은 hydroxyl 등의 산성관능기 그룹의 생성과 금속산화물의 반응으로 인하여 표면 산도가 증가하고, 미세기공 및 중기공 구조가 발달하여 비표면적이 증가되었다. K(IC)를 이용한 RM의 기계적 계면성질은 비표면적이 증가함과 동시에 표면산도가 증가함으로 염기성 매트릭스와의 계면결합력이 증대되어 순수 에폭시와 처리되지 않은 에폭시/RM 복합재료보다 더 우수한 기계적 계면물성을 나타내었다.